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H01L2224/3755

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module and method of manufacturing the same
- Patent number 9,059,334
- Issue date Jun 16, 2015
- Mitsubishi Electric Corporation
- Osamu Usui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220415843
- Publication date Dec 29, 2022
- DENSO CORPORATION
- Hideki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130181228
- Publication date Jul 18, 2013
- Mitsubishi Electric Corporation
- Osamu USUI
- H01 - BASIC ELECTRIC ELEMENTS