Shape

Industry

CPC
H01L2224/48456

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48456Shape

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding tool, method for manufacturing ultrasonic bondin...
- Patent number 10,864,597
- Issue date Dec 15, 2020
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akio Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming three-dimensional wire loops and wire loops forme...
- Patent number 9,881,891
- Issue date Jan 30, 2018
- ASM Technology Singapore Pte. Ltd.
- Jeffrey Grijaldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loop forming systems and methods of using the same
- Patent number 8,998,063
- Issue date Apr 7, 2015
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with bonding wire and method for making the same
- Patent number 8,847,410
- Issue date Sep 30, 2014
- Rohm Co., Ltd.
- Kosuke Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal bond head for wire bonders
- Patent number 8,434,669
- Issue date May 7, 2013
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding wedge
- Patent number 7,451,905
- Issue date Nov 18, 2008
- Edwards Enterprises
- Russell K. Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device
- Patent number 6,229,199
- Issue date May 8, 2001
- Rohm Co., Ltd.
- Kazutaka Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to produce known good die using temporary wire bond, die att...
- Patent number 5,836,071
- Issue date Nov 17, 1998
- Texas Instrument Incorporated
- Robert J. Falcone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure for a semiconductor device
- Patent number 5,666,009
- Issue date Sep 9, 1997
- Rohm Co. Ltd.
- Hiroshi Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding head
- Patent number 4,067,039
- Issue date Jan 3, 1978
- Motorola, Inc.
- Stanley Gaicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiface wire bonding method and tool
- Patent number 3,934,783
- Issue date Jan 27, 1976
- John E. Larrison
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE STITCH WIREBONDS
- Publication number 20240113065
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Xiaolin KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402354
- Publication date Dec 14, 2023
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- WuXing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS
- Publication number 20140103096
- Publication date Apr 17, 2014
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20130220673
- Publication date Aug 29, 2013
- Technische Universitaet Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130200134
- Publication date Aug 8, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20130049231
- Publication date Feb 28, 2013
- ROHM CO., LTD.
- Kosuke MIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND AND METHOD OF FORMING SAME
- Publication number 20080116548
- Publication date May 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding structure, wire bonding method, actuator device and liquid...
- Publication number 20060027623
- Publication date Feb 9, 2006
- Seiko Epson Corporation
- Isao Yanagisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING WEDGE
- Publication number 20050279811
- Publication date Dec 22, 2005
- GAISER TOOL COMPANY
- Russell K. Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ultrasonic bonding tool, method for manufacturing ultrasonic bondin...

Heavy-wire bond arrangement and method for producing same

Method of forming three-dimensional wire loops and wire loops forme...

Waterfall wire bonding

Wire loop forming systems and methods of using the same

Semiconductor chip with bonding wire and method for making the same

Universal bond head for wire bonders

Wire bonding wedge

Packaged semiconductor device

Method to produce known good die using temporary wire bond, die att...

Wire bonding structure for a semiconductor device

Ultrasonic bonding head

Multiface wire bonding method and tool

Patents Applicationslast 30 patents

DOUBLE STITCH WIREBONDS

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

SEMICONDUCTOR DEVICE

STRENGTHENED WIRE-BOND

CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS

WATERFALL WIRE BONDING

WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS

HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME

WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

WIRE BOND AND METHOD OF FORMING SAME

Bonding structure, wire bonding method, actuator device and liquid...

WIRE BONDING WEDGE