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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2105Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,830
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 12,191,239
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 12,021,054
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including post
- Patent number 11,967,578
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including seed structure and method of manufa...
- Patent number 11,935,858
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,894,333
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 11,791,299
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and circuit structure thereof
- Patent number 11,791,300
- Issue date Oct 17, 2023
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 11,756,870
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and massive data storage system including the...
- Patent number 11,715,684
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Sungmin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,682,647
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving reliability
- Patent number 11,557,560
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,552,038
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,424,191
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with bottle-shaped through silicon v...
- Patent number 11,355,464
- Issue date Jun 7, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,309,303
- Issue date Apr 19, 2022
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a core substrate and an embedde...
- Patent number 11,276,660
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Chih Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,244,921
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Chang Eun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,244,926
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Young-Hoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,164,821
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,964,643
- Issue date Mar 30, 2021
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
Information Patent Grant
Semiconductor device having a glass substrate core layer
- Patent number 10,903,157
- Issue date Jan 26, 2021
- SKC Co., Ltd
- Sung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240404973
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mohamad Ashraf bin Mohd Arshad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387391
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379606
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stress Relief Vias in Mu...
- Publication number 20240355760
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240347496
- Publication date Oct 17, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...
- Publication number 20240321730
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274566
- Publication date Aug 15, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING POST
- Publication number 20240243090
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Jaekul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...
- Publication number 20240213202
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20240203922
- Publication date Jun 20, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240194627
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170432
- Publication date May 23, 2024
- DENSO CORPORATION
- Yoichi SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS
- Publication number 20240128222
- Publication date Apr 18, 2024
- Neuralink Corp.
- Supin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
- Publication number 20240105659
- Publication date Mar 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
- Publication number 20240105658
- Publication date Mar 28, 2024
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071896
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jin Won CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...
- Publication number 20240030173
- Publication date Jan 25, 2024
- NXP B.V.
- Che Ming Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240021560
- Publication date Jan 18, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395452
- Publication date Dec 7, 2023
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer (RDL) Layouts for Integrated Circuits
- Publication number 20230378116
- Publication date Nov 23, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING METAL SKELETON FRAME USING EMBEDDED GROUND PLANE
- Publication number 20230369168
- Publication date Nov 16, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...
- Publication number 20230369189
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20230369271
- Publication date Nov 16, 2023
- TORAY INDUSTRIES, INC.
- Keika HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MASSIVE DATA STORAGE SYSTEM INCLUDING THE...
- Publication number 20230326847
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Sungmin HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20230317673
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD THEREFOR
- Publication number 20230307403
- Publication date Sep 28, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ASSEMBLY, DISPLAY DEVICE, AND METHOD FOR MAKING LIGH...
- Publication number 20230290758
- Publication date Sep 14, 2023
- Century Technology (Shenzhen) Corporation Limited
- KUANG-HUA LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR
- Publication number 20230268306
- Publication date Aug 24, 2023
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230268305
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and display unit

Semiconductor devices and methods of manufacture

Stacked via structure disposed on a conductive pillar of a semicond...

Package and package-on-package structure having elliptical columns...

Redistribution layer (RDL) layouts for integrated circuits

High density interconnection and wiring layers, package structures,...

Semiconductor package including post

Semiconductor devices including seed structure and method of manufa...

Semiconductor package

Semiconductor package and method of manufacturing the semiconductor...

Redistribution layer (RDL) layouts for integrated circuits

Electronic package and circuit structure thereof

Package comprising integrated devices coupled through a metallizati...

Package and package-on-package structure having elliptical columns...

Stacked via structure disposed on a conductive pillar of a semicond...

Semiconductor device and massive data storage system including the...

Semiconductor package and method for manufacturing the same

Semiconductor package for improving reliability

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor devices and methods of manufacture

Package and package-on-package structure having elliptical columns...

Semiconductor device structure with bottle-shaped through silicon v...

Semiconductor package including stacked semiconductor chips

Semiconductor device package having a core substrate and an embedde...

Semiconductor package

Semiconductor package and manufacturing method thereof

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor device and method of forming interposer frame over se...

Semiconductor device having a glass substrate core layer

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE

Semiconductor Devices and Methods of Manufacture

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Forming Stress Relief Vias in Mu...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING POST

ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE

DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...

SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE

UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...

POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Redistribution Layer (RDL) Layouts for Integrated Circuits

PACKAGE HAVING METAL SKELETON FRAME USING EMBEDDED GROUND PLANE

STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND MASSIVE DATA STORAGE SYSTEM INCLUDING THE...

FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD THEREFOR

LIGHT-EMITTING ASSEMBLY, DISPLAY DEVICE, AND METHOD FOR MAKING LIGH...

CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME