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H01L2224/75982

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding apparatus and wafer bonding system including the same
- Patent number 10,639,875
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- B32 - LAYERED PRODUCTS