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H01L2224/82345

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,629,537
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,290,584
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die-down package-on-package device
- Patent number 9,812,422
- Issue date Nov 7, 2017
- Intel Corporation
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE
- Publication number 20170012020
- Publication date Jan 12, 2017
- Intel Corporation
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20130021766
- Publication date Jan 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS