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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78302Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,398,449
- Issue date Jul 26, 2022
- Kabushiki Kaisha Toshiba
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic horn
- Patent number 8,511,534
- Issue date Aug 20, 2013
- Kabushiki Kaisha Shinkawa
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic horn
- Patent number 8,434,656
- Issue date May 7, 2013
- Kabushiki Kaisha Shinkawa
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 8,415,245
- Issue date Apr 9, 2013
- Renesas Electronics Corporation
- Yasuki Takata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 8,362,594
- Issue date Jan 29, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebonded semiconductor package
- Patent number 8,357,998
- Issue date Jan 22, 2013
- Advanced Semiconductor Engineering, Inc.
- Wen Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus with a textured capillary surface enabling h...
- Patent number 8,267,303
- Issue date Sep 18, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic horn
- Patent number 8,152,043
- Issue date Apr 10, 2012
- Kabushiki Kaisha Shinkawa
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic horn
- Patent number 8,052,026
- Issue date Nov 8, 2011
- Kabushiki Kaisha Shinkawa
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loop and method of forming the wire loop
- Patent number 8,048,720
- Issue date Nov 1, 2011
- Kulicke and Soffa Industries, Inc.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum wire tensioner for wire bonder
- Patent number 7,954,689
- Issue date Jun 7, 2011
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spot heat wirebonding
- Patent number 7,926,698
- Issue date Apr 19, 2011
- Texas Instruments Incorporated
- Norihiro Kawakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding deflector for a wire bonder
- Patent number 7,918,378
- Issue date Apr 5, 2011
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 7,915,711
- Issue date Mar 29, 2011
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,889,513
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding tool with improved bonding accuracy
- Patent number 7,872,208
- Issue date Jan 18, 2011
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monitoring deformation and time to logically constrain a bonding pr...
- Patent number 7,845,542
- Issue date Dec 7, 2010
- Palomar Technologies, Inc.
- Daniel D. Evans, Jr.
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond method for angularly disposed conductive pads and a devic...
- Patent number 7,772,045
- Issue date Aug 10, 2010
- Randy Wayne Bindrup
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spot heat wirebonding
- Patent number 7,677,432
- Issue date Mar 16, 2010
- Texas Instruments Incorporated
- Norihiro Kawakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,677,429
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 7,674,655
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tail wire cutting method and bonding apparatus
- Patent number 7,658,314
- Issue date Feb 9, 2010
- Kabushiki Kaisha Shinkawa
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 7,605,478
- Issue date Oct 20, 2009
- Samsung Electronics Co., Ltd.
- Kyung-Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding capillary tool having multiple outer steps
- Patent number 7,597,231
- Issue date Oct 6, 2009
- Small Precision Tools Inc.
- Jaime Castaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool head for attaching an electrical conductor on the contact surf...
- Patent number 7,581,667
- Issue date Sep 1, 2009
- Robert Bosch GmbH
- Manfred Reinold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method for manufacturing same
- Patent number 7,563,648
- Issue date Jul 21, 2009
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for increased stand-off height in stud bumping pr...
- Patent number 7,521,284
- Issue date Apr 21, 2009
- Texas Instruments Incorporated
- Ariel Lizaba Miranda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for manufacturing of the same
- Patent number 7,518,250
- Issue date Apr 14, 2009
- Renesas Technology Corp.
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile capillary for wire bonding
- Patent number 7,500,591
- Issue date Mar 10, 2009
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-part capillary
- Patent number 7,500,590
- Issue date Mar 10, 2009
- Kulicke and Soffa Industries, Inc.
- Dan Mironescu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210288019
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip Mounting Structure and Flip-chip Mounting Method
- Publication number 20120273942
- Publication date Nov 1, 2012
- Japan Aviation Electronics Industry ,Limited
- Daisuke Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120153444
- Publication date Jun 21, 2012
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...
- Publication number 20120031955
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BON...
- Publication number 20120032354
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC HORN
- Publication number 20120018490
- Publication date Jan 26, 2012
- SHINKAWA LTD.
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC HORN
- Publication number 20120018489
- Publication date Jan 26, 2012
- SHINKAWA LTD.
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC HORN
- Publication number 20120018491
- Publication date Jan 26, 2012
- SHINKAWA LTD.
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20110175206
- Publication date Jul 21, 2011
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110159644
- Publication date Jun 30, 2011
- Renesas Electronics Corporation
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110057299
- Publication date Mar 10, 2011
- Renesas Electronics Corporation
- Yasuki TAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING GAS KIT DESIGN FOR COPPER BONDING
- Publication number 20110017806
- Publication date Jan 27, 2011
- Jerry Gomez Cayabyab
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
- Publication number 20100230809
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100200969
- Publication date Aug 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Wen Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot Heat Wirebonding
- Publication number 20100140327
- Publication date Jun 10, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Norihiro KAWAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20100133662
- Publication date Jun 3, 2010
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100013083
- Publication date Jan 21, 2010
- Samsung Electronics Co., Ltd.
- Kyung-Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS
- Publication number 20090308911
- Publication date Dec 17, 2009
- SMALL PRECISION TOOLS INC.
- Jaime Castaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20090057843
- Publication date Mar 5, 2009
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Tool With Improved Finish
- Publication number 20080314963
- Publication date Dec 25, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- Harel Itzhaky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
- Publication number 20080302862
- Publication date Dec 11, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BO...
- Publication number 20080296781
- Publication date Dec 4, 2008
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WIRE TENSIONER FOR WIRE BONDER
- Publication number 20080272178
- Publication date Nov 6, 2008
- Ka Shing Kenny KWAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND
- Publication number 20080237887
- Publication date Oct 2, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT...
- Publication number 20080242076
- Publication date Oct 2, 2008
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for increased stand-off height in stud bumping pr...
- Publication number 20080217768
- Publication date Sep 11, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Ariel Lizaba Miranda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE CAPILLARY FOR WIRE BONDING
- Publication number 20080210740
- Publication date Sep 4, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080150167
- Publication date Jun 26, 2008
- Samsung Electronics Co., Ltd.
- Kyung-Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND AND METHOD OF FORMING SAME
- Publication number 20080116548
- Publication date May 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding and wire bonding method
- Publication number 20080093416
- Publication date Apr 24, 2008
- KABUSHIKI KAISHA SHINKAWA
- Tetsuya Utano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and wire bonding method

Ultrasonic horn

Ultrasonic horn

Method of manufacturing semiconductor device and semiconductor device

Semiconductor assemblies and methods of manufacturing such assembli...

Wirebonded semiconductor package

Wire bonding apparatus with a textured capillary surface enabling h...

Ultrasonic horn

Ultrasonic horn

Wire loop and method of forming the wire loop

Vacuum wire tensioner for wire bonder

Spot heat wirebonding

Wire bonding deflector for a wire bonder

Semiconductor assemblies and methods of manufacturing such assembli...

Semiconductor device

Laser bonding tool with improved bonding accuracy

Monitoring deformation and time to logically constrain a bonding pr...

Wire bond method for angularly disposed conductive pads and a devic...

Spot heat wirebonding

Concave face wire bond capillary and method

Semiconductor assemblies and methods of manufacturing such assembli...

Tail wire cutting method and bonding apparatus

Semiconductor package and method of manufacturing the same

Wire bonding capillary tool having multiple outer steps

Tool head for attaching an electrical conductor on the contact surf...

Semiconductor device package and method for manufacturing same

System and method for increased stand-off height in stud bumping pr...

Semiconductor device and a method for manufacturing of the same

Low-profile capillary for wire bonding

Multi-part capillary

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

Flip-chip Mounting Structure and Flip-chip Mounting Method

SEMICONDUCTOR DEVICE

WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BON...

ULTRASONIC HORN

ULTRASONIC HORN

ULTRASONIC HORN

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

FORMING GAS KIT DESIGN FOR COPPER BONDING

WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Spot Heat Wirebonding

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

Bonding Tool With Improved Finish

CONCAVE FACE WIRE BOND CAPILLARY AND METHOD

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BO...

VACUUM WIRE TENSIONER FOR WIRE BONDER

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT...

System and method for increased stand-off height in stud bumping pr...

LOW-PROFILE CAPILLARY FOR WIRE BONDING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRE BOND AND METHOD OF FORMING SAME

Wire bonding and wire bonding method