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H01L2224/4805

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4805Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,227,983
- Issue date Jan 18, 2022
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LS grid core LED connector system and manufacturing method
- Patent number 11,189,770
- Issue date Nov 30, 2021
- Andrey Zykin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips and met...
- Patent number 11,133,287
- Issue date Sep 28, 2021
- SK hynix Inc.
- Jae-Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure, lead frame, and method for forming...
- Patent number 10,903,146
- Issue date Jan 26, 2021
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection pads for low cross-talk vertical wirebonds
- Patent number 10,580,756
- Issue date Mar 3, 2020
- Intel Corporation
- Hungying L. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 10,573,600
- Issue date Feb 25, 2020
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components with integral lead frame and wires
- Patent number 10,529,653
- Issue date Jan 7, 2020
- STMicroelectronics S.R.L.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 10,396,261
- Issue date Aug 27, 2019
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device by laser-induced forming and transfer of shaped m...
- Patent number 10,297,565
- Issue date May 21, 2019
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 10,262,924
- Issue date Apr 16, 2019
- ABLIC INC.
- Kiyoaki Kadoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular chip with redundant interfaces
- Patent number 10,262,973
- Issue date Apr 16, 2019
- Marvell International Ltd.
- Claus F. Hoyer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Molded lead frame device
- Patent number 9,984,980
- Issue date May 29, 2018
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,966,356
- Issue date May 8, 2018
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Re-distribution layer structure and manufacturing method thereof
- Patent number 9,859,239
- Issue date Jan 2, 2018
- ChipMOS Technologies Inc.
- En-Sung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,837,373
- Issue date Dec 5, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining a bonding connection in a component arrangem...
- Patent number 9,793,179
- Issue date Oct 17, 2017
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating protrusion in the trench of a re-distribution layer stru...
- Patent number 9,793,229
- Issue date Oct 17, 2017
- ChipMOS Technologies Inc.
- En-Sung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,793,196
- Issue date Oct 17, 2017
- Renesas Electronics Corporation
- Akira Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 9,735,113
- Issue date Aug 15, 2017
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,685,349
- Issue date Jun 20, 2017
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,496,203
- Issue date Nov 15, 2016
- Renesas Electronics Corporation
- Akira Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with active shielding of leads
- Patent number 9,271,390
- Issue date Feb 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sunaina Srivastava
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming protective coating mater...
- Patent number 8,524,537
- Issue date Sep 3, 2013
- STATS ChipPAC, Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230083522
- Publication date Mar 16, 2023
- KIOXIA Corporation
- Takayuki IDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220148999
- Publication date May 12, 2022
- Fuji Electric Co., Ltd.
- Mariko Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20210057379
- Publication date Feb 25, 2021
- SK HYNIX INC.
- Jae-Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LS Grid Core LED Connector System and Manufacturing Method
- Publication number 20200321500
- Publication date Oct 8, 2020
- Andrey Zykin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES
- Publication number 20190035761
- Publication date Jan 31, 2019
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS
- Publication number 20180323173
- Publication date Nov 8, 2018
- Intel Corporation
- Hungying L. LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device By Laser-Induced Forming and Transfer of Shaped M...
- Publication number 20180240772
- Publication date Aug 23, 2018
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...
- Publication number 20180006204
- Publication date Jan 4, 2018
- Nichia Corporation.
- Tsuzuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20170309572
- Publication date Oct 26, 2017
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170221851
- Publication date Aug 3, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170103902
- Publication date Apr 13, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20170084569
- Publication date Mar 23, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...
- Publication number 20160086909
- Publication date Mar 24, 2016
- MC10, Inc.
- David G. Garlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20160049390
- Publication date Feb 18, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ACTIVE SHIELDING OF LEADS
- Publication number 20160021734
- Publication date Jan 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sunaina Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150263002
- Publication date Sep 17, 2015
- RENESAS ELECTRONICS CORPORATION
- Akira Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20150221595
- Publication date Aug 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
- Publication number 20130256840
- Publication date Oct 3, 2013
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTU...
- Publication number 20130200400
- Publication date Aug 8, 2013
- DOOSUNG ADVANCED TECHNOLOGY CO., LTD.
- Jong-Jin JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...
- Publication number 20120038054
- Publication date Feb 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20110285007
- Publication date Nov 24, 2011
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
- Publication number 20110266656
- Publication date Nov 3, 2011
- STATS ChipPAC, Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Impedance controlled electrical interconnection employing meta-mate...

Wire bonding for semiconductor devices

Impedance controlled electrical interconnection employing meta-mate...

Light emitting device and method of manufacturing the light emittin...

LS grid core LED connector system and manufacturing method

Semiconductor package including stacked semiconductor chips and met...

Electrode connection structure, lead frame, and method for forming...

Connection pads for low cross-talk vertical wirebonds

Semiconductor device and method of forming ultra thin multi-die fac...

Electronic components with integral lead frame and wires

Impedance controlled electrical interconnection employing meta-mate...

Light emitting device and method of manufacturing the light emittin...

Electronic device by laser-induced forming and transfer of shaped m...

Semiconductor device and electronic apparatus

Modular chip with redundant interfaces

Molded lead frame device

Laser-induced forming and transfer of shaped metallic interconnects

Re-distribution layer structure and manufacturing method thereof

Semiconductor device and production method therefor

Method for determining a bonding connection in a component arrangem...

Insulating protrusion in the trench of a re-distribution layer stru...

Semiconductor device

Semiconductor device and method of forming ultra thin multi-die fac...

Multiple bond via arrays of different wire heights on a same substrate

Laser-induced forming and transfer of shaped metallic interconnects

Semiconductor device

Semiconductor device with active shielding of leads

Semiconductor device and method of forming protective coating mater...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR DEVICE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

LS Grid Core LED Connector System and Manufacturing Method

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES

CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS

Electronic Device By Laser-Induced Forming and Transfer of Shaped M...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

Laser-Induced Forming and Transfer of Shaped Metallic Interconnects

Laser-Induced Forming and Transfer of Shaped Metallic Interconnects

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT...

Multiple bond via arrays of different wire heights on a same substrate

SEMICONDUCTOR DEVICE WITH ACTIVE SHIELDING OF LEADS

SEMICONDUCTOR DEVICE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

Semiconductor Device and Method of Forming Protective Coating Mater...

PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTU...

IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

Semiconductor Device and Method of Forming Protective Coating Mater...