Shape

Industry

CPC
H01L2224/80365

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80365Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor element, and semiconductor el...
- Patent number 12,132,142
- Issue date Oct 29, 2024
- Kyocera Corporation
- Katsuaki Masaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, metal member, and method of manufacturing sem...
- Patent number 10,199,314
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointed body, method for manufacturing same and jointed member
- Patent number 9,821,406
- Issue date Nov 21, 2017
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 9,806,051
- Issue date Oct 31, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding surfaces for direct bonding of semiconductor structures
- Patent number 8,697,493
- Issue date Apr 15, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining a silicon plate to a second plate
- Patent number 6,955,975
- Issue date Oct 18, 2005
- Robert Bosch GmbH
- Frank Reichenbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240105674
- Publication date Mar 28, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071968
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...
- Publication number 20230064032
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METAL MEMBER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20160343647
- Publication date Nov 24, 2016
- Fuji Electric Co., Ltd.
- Kenshi KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20150255418
- Publication date Sep 10, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER WITH COOLANT CHANNELS
- Publication number 20140264759
- Publication date Sep 18, 2014
- Christopher R. KOONTZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SURFACES FOR DIRECT BONDING OF SEMICONDUCTOR STRUCTURES
- Publication number 20130020704
- Publication date Jan 24, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for joining a silicon plate to a second plate
- Publication number 20040082145
- Publication date Apr 29, 2004
- Frank Reichenbach
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor element, and semiconductor el...

Ultra-thin embedded semiconductor device package and method of manu...

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device, metal member, and method of manufacturing sem...

Jointed body, method for manufacturing same and jointed member

Ultra-thin embedded semiconductor device package and method of manu...

Bonding surfaces for direct bonding of semiconductor structures

Method for joining a silicon plate to a second plate

Patents Applicationslast 30 patents

BONDED STRUCTURE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION

EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

SEMICONDUCTOR DEVICE, METAL MEMBER, AND METHOD OF MANUFACTURING SEM...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

STACKED WAFER WITH COOLANT CHANNELS

BONDING SURFACES FOR DIRECT BONDING OF SEMICONDUCTOR STRUCTURES

Method for joining a silicon plate to a second plate