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H01L2224/2205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2205Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,062,621
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking devices using support f...
- Patent number 11,869,848
- Issue date Jan 9, 2024
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,721,597
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,552,038
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,373,954
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high density die to die connection and m...
- Patent number 9,595,494
- Issue date Mar 14, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing vias in fan-out wafers using dry film and cond...
- Patent number 8,535,980
- Issue date Sep 17, 2013
- STMicroelectronics Pte Ltd
- Puay Gek Chua
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379575
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Devices Using Support F...
- Publication number 20240088060
- Publication date Mar 14, 2024
- STATS ChipPAC Pte Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING ALIGNMENT MARK
- Publication number 20230187372
- Publication date Jun 15, 2023
- Industrial Technology Research Institute
- Tsung-Yi HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230133567
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230064152
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230065941
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Devices Using Support F...
- Publication number 20230050884
- Publication date Feb 16, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220328414
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220130786
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210057344
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND M...
- Publication number 20160329284
- Publication date Nov 10, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING VIAS IN FAN-OUT WAFERS USING DRY FILM AND COND...
- Publication number 20120161332
- Publication date Jun 28, 2012
- STMicroelectronics Pte Ltd
- Puay Gek Chua
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package

Package and package-on-package structure having elliptical columns...

Semiconductor device and method of stacking devices using support f...

Semiconductor package and method of manufacturing the semiconductor...

Package and package-on-package structure having elliptical columns...

Semiconductor device and manufacturing method of the same

Semiconductor package and method of manufacturing the semiconductor...

Package and package-on-package structure having elliptical columns...

Semiconductor package

Semiconductor package with high density die to die connection and m...

Method for producing vias in fan-out wafers using dry film and cond...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Stacking Devices Using Support F...

ELECTRONIC DEVICE HAVING ALIGNMENT MARK

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Stacking Devices Using Support F...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND M...

METHOD FOR PRODUCING VIAS IN FAN-OUT WAFERS USING DRY FILM AND COND...