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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1405Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
- Patent number 12,057,429
- Issue date Aug 6, 2024
- HRL Laboratories, LLC
- Aurelio Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,990,440
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,923,328
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar bump contacts of differing sizes
- Patent number 11,887,958
- Issue date Jan 30, 2024
- STMicroelectronics Ltd.
- Cheng-Yang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,017
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 11,808,436
- Issue date Nov 7, 2023
- Epistar Corporation
- Chi-Chih Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pad structure of chip
- Patent number 11,694,983
- Issue date Jul 4, 2023
- SITRONIX TECHNOLOGY CORPORATION
- Kuo-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having a substrate comprising surface interconnects aligned...
- Patent number 11,682,607
- Issue date Jun 20, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,676,825
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for electronic device
- Patent number 11,616,038
- Issue date Mar 28, 2023
- Texas Instruments Incorporated
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer method, display device, chip and target substrate
- Patent number 11,616,043
- Issue date Mar 28, 2023
- BOE Technology Group Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip, method of manufacturing the integrated cir...
- Patent number 11,569,206
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Min-hee Uh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip structure
- Patent number 11,502,052
- Issue date Nov 15, 2022
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 11,444,038
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor design for integrated magnetic devices
- Patent number 11,393,787
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND A PACKAGING METHOD
- Publication number 20240371812
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332328
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Hui-Tzu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321799
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...
- Publication number 20240321853
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES
- Publication number 20240266348
- Publication date Aug 8, 2024
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240258259
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20240250053
- Publication date Jul 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240222303
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230411318
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387054
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Junyoung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE
- Publication number 20230307458
- Publication date Sep 28, 2023
- MURATA MANUFACTURING CO., LTD.
- Motoji TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS
- Publication number 20230197658
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SUBSTRATE, AND METHOD FOR MANUFACTURING SEMIC...
- Publication number 20230170321
- Publication date Jun 1, 2023
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...
- Publication number 20230063127
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20230054495
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE
- Publication number 20230030589
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- BOIN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220270962
- Publication date Aug 25, 2022
- Murata Manufacturing Co., Ltd.
- Mizuho ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Forming large chips through stitching

Semiconductor devices and preparation methods thereof

Semiconductor device assembly with surface-mount die support struct...

Bump structure having a side recess and semiconductor structure inc...

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Chip package structure

Semiconductor product with interlocking metal-to-metal bonds and me...

Structure and formation method of semiconductor device with conduct...

Solderless interconnection structure and method of forming same

Semiconductor device and semiconductor package

Method and system for packing optimization of semiconductor devices

Methods of manufacturing a semiconductor device including a joint a...

Coplanar bump contacts of differing sizes

Semiconductor device and method

Wafer level packaging of light emitting diodes (LEDs)

Light emitting apparatus

Test pad structure of chip

Package having a substrate comprising surface interconnects aligned...

Semiconductor chip

Bump structure having a side recess and semiconductor structure inc...

Interconnect for electronic device

Chip transfer method, display device, chip and target substrate

Integrated circuit chip, method of manufacturing the integrated cir...

Chip structure

Semiconductor device assembly with through-package interconnect and...

Forming large chips through stitching

Chip package structure

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Conductor design for integrated magnetic devices

Integrated circuit packages and methods of forming same

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND A PACKAGING METHOD

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...

FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

Semiconductor Device and Method

SEMICONDUCTOR PACKAGE

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS

SEMICONDUCTOR DEVICE, SUBSTRATE, AND METHOD FOR MANUFACTURING SEMIC...

SEMICONDUCTOR PACKAGE

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...

SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

CHIP PACKAGE STRUCTURE

BUMP STRUCTURE OF CHIP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...