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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0555Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with increased thermal radiation efficiency
- Patent number 12,113,050
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 12,113,003
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,107,055
- Issue date Oct 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,059
- Issue date Oct 1, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,087,748
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,072,588
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Yoo Jeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Array substrate, light-emitting substrate and display device
- Patent number 12,062,620
- Issue date Aug 13, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Qin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 12,062,833
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device comprising polygonal pads
- Patent number 12,057,420
- Issue date Aug 6, 2024
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 12,057,479
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 12,040,349
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,040,238
- Issue date Jul 16, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, manufacturing method thereof, and display device
- Patent number 12,034,014
- Issue date Jul 9, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhongliu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a through electrode and semiconductor pac...
- Patent number 12,027,482
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and semiconductor die
- Patent number 12,021,057
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,021,049
- Issue date Jun 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20240355886
- Publication date Oct 24, 2024
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...
- Publication number 20240348046
- Publication date Oct 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mikito SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240331932
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240321814
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240321850
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yusuke IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321792
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD AND PACKAGE INCLUDING SAME
- Publication number 20240321788
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Wenjun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321789
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...
- Publication number 20240321794
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS
- Publication number 20240321791
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH
- Publication number 20240321793
- Publication date Sep 26, 2024
- Xilinx, Inc.
- Yun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321667
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240312934
- Publication date Sep 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240304578
- Publication date Sep 12, 2024
- AUO Corporation
- Woei-Chyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306303
- Publication date Sep 12, 2024
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240297132
- Publication date Sep 5, 2024
- InnoLux Corporation
- Maggy HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BONDING FOR SEMICONDUCTOR DEVICES
- Publication number 20240290746
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240290737
- Publication date Aug 29, 2024
- MEDIATEK INC.
- Hung-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned and planarized under-bump metallization

Sensor package structure

Semiconductor package with increased thermal radiation efficiency

Method for fabricating semiconductor device with redistribution plugs

Semiconductor device with composite middle interconnectors

Electronic package and fabrication method thereof

Semiconductor package and manufacturing method thereof

Bonded structures

Semiconductor structure and method for forming semiconductor struct...

Bond pad with micro-protrusions for direct metallic bonding

Semiconductor package and methods of manufacturing a semiconductor...

Bump structure having a side recess and semiconductor structure inc...

Display device and manufacturing method thereof

Display device and method of manufacturing the same

Semiconductor device and method to minimize stress on stack via

Display device

Methods and devices for fabricating and assembling printable semico...

Array substrate, light-emitting substrate and display device

Packaged electronic device having integrated antenna and locking st...

Display device including connection pad part and electronic compone...

Chip, circuit board and electronic device comprising polygonal pads

Bonded structures with integrated passive component

Semiconductor device having a junction portion contacting a Schottk...

Light emitting device and method of manufacturing the same

Radio-frequency switching devices having improved voltage handling...

Display panel, manufacturing method thereof, and display device

Semiconductor chip having a through electrode and semiconductor pac...

Semiconductor structure and semiconductor die

Display panel and display device

Integration and bonding of micro-devices into system substrate

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

SEMICONDUCTOR STRUCTURE

DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE

SILICON CARBIDE SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE

ISOLATOR

SEMICONDUCTOR PACKAGE

PAD AND PACKAGE INCLUDING SAME

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...

BONDING-TYPE INTERCONNECTION MEMBER

SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS

CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH

SEMICONDUCTOR PACKAGE

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

BALL BONDING FOR SEMICONDUCTOR DEVICES

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

Structure and Method of Forming a Joint Assembly