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H01L21/02035

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02035Shaping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of workpiece
- Patent number 12,191,138
- Issue date Jan 7, 2025
- Disco Corporation
- Toshio Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, manufacturing method for semiconductor wafer,...
- Patent number 11,984,313
- Issue date May 14, 2024
- Kioxia Corporation
- Takashi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer configured to recondition a support surface of a wafer holdin...
- Patent number 11,955,368
- Issue date Apr 9, 2024
- Imec VZW
- Thomas Hantschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar semiconductor packaging systems and related methods
- Patent number 11,894,245
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Wafer stress control using backside film deposition and laser anneal
- Patent number 11,842,911
- Issue date Dec 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
- Patent number 11,756,783
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Eric Prophet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 11,616,008
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer polishing method
- Patent number 11,342,233
- Issue date May 24, 2022
- Disco Corporation
- Yasuyuki Takeishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV laser slicing of β-Ga2O3 by micro-crack generation and propagation
- Patent number 11,171,055
- Issue date Nov 9, 2021
- The Government of the United States of America, as represented by the Secreta...
- Nadeemullah A. Mahadik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Out-of-plane deformable semiconductor substrate, method of making a...
- Patent number 11,127,585
- Issue date Sep 21, 2021
- King Abdullah University of Science and Technology
- Adrián César Cavazos Sepulveda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and manufacturing met...
- Patent number 11,087,971
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with beveled edge region and method for analyzing shape of th...
- Patent number 11,056,403
- Issue date Jul 6, 2021
- SK SILTRON CO., LTD.
- Woo Sung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thinned semiconductor wafer
- Patent number 11,018,092
- Issue date May 25, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,957,607
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Sheng Yun
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 10,950,534
- Issue date Mar 16, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming cantilevered protrusion...
- Patent number 10,903,154
- Issue date Jan 26, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide single crystal substrate and method for manufacturi...
- Patent number 10,872,759
- Issue date Dec 22, 2020
- Sumitomo Electric Industries, Ltd.
- Kyoko Okita
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 10,825,764
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of forming a curved image sensor
- Patent number 10,818,587
- Issue date Oct 27, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Float zone silicon wafer manufacturing system and related process
- Patent number 10,811,245
- Issue date Oct 20, 2020
- Rayton Solar Inc.
- Andrew X. Yakub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of reducing wafer thickness
- Patent number 10,777,509
- Issue date Sep 15, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flatness control using backside compensation structure
- Patent number 10,763,099
- Issue date Sep 1, 2020
- Yangtze Memory Technologies Co., Ltd.
- Xiaowang Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High yield substrate assembly
- Patent number 10,748,858
- Issue date Aug 18, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device structure and method
- Patent number 10,741,484
- Issue date Aug 11, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor copper metallization structure and related methods
- Patent number 10,700,027
- Issue date Jun 30, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped wafer and method for manufacturing stepped wafer
- Patent number 10,649,338
- Issue date May 12, 2020
- Mitsubishi Electric Corporation
- Naoyuki Takeda
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 10,618,140
- Issue date Apr 14, 2020
- Ebara Corporation
- Kuniaki Yamaguchi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR WAFER TREATMENT
- Publication number 20240420946
- Publication date Dec 19, 2024
- Hua Hsu Silicon Materials Co., Ltd.
- Chiao-Yang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD
- Publication number 20240405151
- Publication date Dec 5, 2024
- Tongwei Solar (Meishan) Co., Ltd.
- Wenzhou XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD
- Publication number 20240274462
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Makoto Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP
- Publication number 20240162031
- Publication date May 16, 2024
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Junji SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
- Publication number 20240145266
- Publication date May 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20240030021
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Featuring Ridged Architecture
- Publication number 20240014262
- Publication date Jan 11, 2024
- Walter A. Tormasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20230307343
- Publication date Sep 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20230207303
- Publication date Jun 29, 2023
- Semiconductor Manufacturing International (Beijing) Corporation
- Qingzhao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASC PROCESS AUTOMATION DEVICE
- Publication number 20230154767
- Publication date May 18, 2023
- SK SILTRON CO., LTD.
- Ho Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230138616
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL
- Publication number 20230062866
- Publication date Mar 2, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...
- Publication number 20230008350
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE-GAP SEMICONDUCTOR SUBSTRATE, APPARATUS FOR MANUFACTURING WIDE-...
- Publication number 20220416021
- Publication date Dec 29, 2022
- SPP TECHNOLOGIES CO., LTD.
- Takashi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20220392762
- Publication date Dec 8, 2022
- Disco Corporation
- Shunichiro HIROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME
- Publication number 20220319835
- Publication date Oct 6, 2022
- GlobalWafers Japan Co., Ltd.
- Tatsuhiko AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER,...
- Publication number 20220216051
- Publication date Jul 7, 2022
- KIOXIA Corporation
- Takashi KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND HOT PLATE
- Publication number 20220130666
- Publication date Apr 28, 2022
- Fuji Electric Co., Ltd.
- Kohichi HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20220108882
- Publication date Apr 7, 2022
- Disco Corporation
- Toshio TSUCHIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR
- Publication number 20220072660
- Publication date Mar 10, 2022
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Yanlei SHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
- Publication number 20210358740
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-LUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
- Publication number 20210343555
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20210167002
- Publication date Jun 3, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING METHOD
- Publication number 20210098316
- Publication date Apr 1, 2021
- Disco Corporation
- Yasuyuki TAKEISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER,...
- Publication number 20210066068
- Publication date Mar 4, 2021
- Kioxia Corporation
- Takashi KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210066109
- Publication date Mar 4, 2021
- KABUSHIKI KAISHA TOSHIBA
- Seiya SAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20210043553
- Publication date Feb 11, 2021
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION
- Publication number 20210035795
- Publication date Feb 4, 2021
- Applied Materials, Inc.
- Qi Jie PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CONFIGURED TO RECONDITION A SUPPORT SURFACE OF A WAFER HOLDIN...
- Publication number 20210020494
- Publication date Jan 21, 2021
- IMEC vzw
- Thomas Hantschel
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming micro interconnect struc...

Processing method of workpiece

Through-substrate via structure and method of manufacture

Semiconductor wafer, manufacturing method for semiconductor wafer,...

Wafer configured to recondition a support surface of a wafer holdin...

Non-planar semiconductor packaging systems and related methods

Wafer stress control using backside film deposition and laser anneal

Method for creating cavities in silicon carbide and other semicondu...

Semiconductor device and method of forming micro interconnect struc...

Through-substrate via structure and method of manufacture

Wafer polishing method

UV laser slicing of β-Ga2O3 by micro-crack generation and propagation

Out-of-plane deformable semiconductor substrate, method of making a...

Method for manufacturing semiconductor device and manufacturing met...

Wafer with beveled edge region and method for analyzing shape of th...

Thinned semiconductor wafer

Semiconductor device and method for manufacturing the same

Through-substrate via structure and method of manufacture

Semiconductor device and method of forming cantilevered protrusion...

Silicon carbide single crystal substrate and method for manufacturi...

Semiconductor device and method of forming micro interconnect struc...

Semiconductor device and method of forming a curved image sensor

Float zone silicon wafer manufacturing system and related process

Methods of reducing wafer thickness

Wafer flatness control using backside compensation structure

High yield substrate assembly

Stacked semiconductor device structure and method

Semiconductor copper metallization structure and related methods

Stepped wafer and method for manufacturing stepped wafer

Substrate processing system and substrate processing method

Patents Applicationslast 30 patents

METHOD FOR WAFER TREATMENT

N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD

METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP

NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

Semiconductor Featuring Ridged Architecture

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR PACKAGING METHOD

ASC PROCESS AUTOMATION DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL

METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...

WIDE-GAP SEMICONDUCTOR SUBSTRATE, APPARATUS FOR MANUFACTURING WIDE-...

WAFER PROCESSING METHOD

LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME

SEMICONDUCTOR WAFER, MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER,...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND HOT PLATE

PROCESSING METHOD OF WORKPIECE

METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...

NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

WAFER POLISHING METHOD

SEMICONDUCTOR WAFER, MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER,...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION

WAFER CONFIGURED TO RECONDITION A SUPPORT SURFACE OF A WAFER HOLDIN...