Sheet resistance

Industry

CPC
Y10S438/934

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

Current Industry

Y10S438/934Sheet resistance

Industries

Patents Grantslast 30 patents

Information Patent Grant
Calibration standards for dopants/impurities in silicon and prepara...
- Patent number 7,018,856
- Issue date Mar 28, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ching Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring process for oxide removal
- Patent number 6,579,730
- Issue date Jun 17, 2003
- Applied Materials, Inc.
- Haojiang Li
- G01 - MEASURING TESTING
Information Patent Grant
Deposition of tungsten films from W(CO)6
- Patent number 6,218,301
- Issue date Apr 17, 2001
- Applied Materials, Inc.
- Hyungsuk Alexander Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon delta-doped gallium arsenide/indium arsenide heterojunction...
- Patent number 6,172,420
- Issue date Jan 9, 2001
- Motorola, Inc.
- Kumar Shiralagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact and method of manufacture
- Patent number 6,043,143
- Issue date Mar 28, 2000
- Motorola, Inc.
- Kumar Shiralagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ epitaxial passivation for resistivity measurement
- Patent number 5,872,017
- Issue date Feb 16, 1999
- SEH America, Inc.
- Mark R. Boydston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of silicon for integrated circuit device interconnection by dir...
- Patent number 5,721,150
- Issue date Feb 24, 1998
- LSI Logic Corporation
- Nicholas F. Pasch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a film for a multilayer Semiconductor device for...
- Patent number 5,624,869
- Issue date Apr 29, 1997
- International Business Machines Corporation
- Paul D. Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a CMOS structure with ESD protection
- Patent number 5,620,920
- Issue date Apr 15, 1997
- Deutsche ITT Industries GmbH
- Klaus Wilmsmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film for a multilayer semiconductor device for improving therm...
- Patent number 5,608,266
- Issue date Mar 4, 1997
- International Business Machines Corporation
- Paul D. Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device with refractory metal si...
- Patent number 5,563,100
- Issue date Oct 8, 1996
- NEC Corporation
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for selecting the resistivity of epitaxial lay...
- Patent number 5,320,977
- Issue date Jun 14, 1994
- United Technologies Corporation
- William J. Tanski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of preparing diffused silicon device substrate
- Patent number 5,308,789
- Issue date May 3, 1994
- Shin-Etsu Handotai Co., Ltd.
- Yasushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device whereby a self-align...
- Patent number 5,302,552
- Issue date Apr 12, 1994
- U.S. Philips Corporation
- Johan P. W. B. Duchateau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for improving sheet resistance of an integrated circuit dev...
- Patent number 5,268,330
- Issue date Dec 7, 1993
- International Business Machines Corporation
- John H. Givens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating vertically integrated oxygen-implanted polysi...
- Patent number 5,232,865
- Issue date Aug 3, 1993
- Micron Technology, Inc.
- Monte Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array spreading resistance probe (ASRP) method for profile extracti...
- Patent number 5,217,907
- Issue date Jun 8, 1993
- National Semiconductor Corporation
- Constantin Bulucea
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacture of optically transparent electrically conduct...
- Patent number 5,173,443
- Issue date Dec 22, 1992
- Northrop Corporation
- V. Warren Biricik
- G02 - OPTICS
Information Patent Grant
Method of making amorphous deposited polycrystalline silicon therma...
- Patent number 5,169,806
- Issue date Dec 8, 1992
- Xerox Corporation
- William G. Hawkins
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of fabricating a high voltage, high speed Schottky semicondu...
- Patent number 5,158,909
- Issue date Oct 27, 1992
- Sanken Electric Co., Ltd.
- Koji Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage, high speed schottky semiconductor device and method o...
- Patent number 5,148,240
- Issue date Sep 15, 1992
- Sanken Electric Co., Ltd.
- Koji Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a high-voltage semiconductor device having a...
- Patent number 5,112,774
- Issue date May 12, 1992
- Sanken Electric Co., Ltd.
- Koji Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of heat augmented resistor trimming
- Patent number 5,110,758
- Issue date May 5, 1992
- Motorola, Inc.
- Ira E. Baskett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a physical structure on an integrated circuit device and de...
- Patent number 5,082,792
- Issue date Jan 21, 1992
- LSI Logic Corporation
- Nicholas F. Pasch
- G01 - MEASURING TESTING
Information Patent Grant
High-voltage semiconductor device having a rectifying barrier, and...
- Patent number 5,081,510
- Issue date Jan 14, 1992
- Sanken Electric Co., Ltd.
- Koji Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device and semiconductor device...
- Patent number 5,051,376
- Issue date Sep 24, 1991
- Mitsubishi Monsanto Chemical Co, Ltd.
- Yutaka Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage, high speed Schottky semiconductor device and method o...
- Patent number 5,027,166
- Issue date Jun 25, 1991
- Sanken Electric Co., Ltd.
- Koji Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of tungsten on TiSi.sub.2
- Patent number 5,023,201
- Issue date Jun 11, 1991
- Cornell Research Foundation, Inc.
- David Stanasolovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for deposition of silicon films from azidosilane sources
- Patent number 5,013,690
- Issue date May 7, 1991
- Air Products and Chemicals, Inc.
- Arthur K. Hochberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling dopant incorporation in high resistivity In-b...
- Patent number 4,999,315
- Issue date Mar 12, 1991
- AT&T Bell Laboratories
- Wilbur D. Johnston
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
Calibration standards for dopants/impurities in silicon and prepara...
- Publication number 20050170535
- Publication date Aug 4, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monitoring process for oxide removal
- Publication number 20030017628
- Publication date Jan 23, 2003
- APPLIED MATERIALS, INC.
- Haojiang Li
- G01 - MEASURING TESTING

Sheet resistance

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Calibration standards for dopants/impurities in silicon and prepara...

Monitoring process for oxide removal

Deposition of tungsten films from W(CO)6

Silicon delta-doped gallium arsenide/indium arsenide heterojunction...

Ohmic contact and method of manufacture

In-situ epitaxial passivation for resistivity measurement

Use of silicon for integrated circuit device interconnection by dir...

Method of forming a film for a multilayer Semiconductor device for...

Process for fabricating a CMOS structure with ESD protection

Thin film for a multilayer semiconductor device for improving therm...

Fabrication method of semiconductor device with refractory metal si...

Method and apparatus for selecting the resistivity of epitaxial lay...

Method of preparing diffused silicon device substrate

Method of manufacturing a semiconductor device whereby a self-align...

Process for improving sheet resistance of an integrated circuit dev...

Method of fabricating vertically integrated oxygen-implanted polysi...

Array spreading resistance probe (ASRP) method for profile extracti...

Method of manufacture of optically transparent electrically conduct...

Method of making amorphous deposited polycrystalline silicon therma...

Method of fabricating a high voltage, high speed Schottky semicondu...

High voltage, high speed schottky semiconductor device and method o...

Method of fabricating a high-voltage semiconductor device having a...

Method of heat augmented resistor trimming

Forming a physical structure on an integrated circuit device and de...

High-voltage semiconductor device having a rectifying barrier, and...

Method for producing semiconductor device and semiconductor device...

High voltage, high speed Schottky semiconductor device and method o...

Selective deposition of tungsten on TiSi.sub.2

Method for deposition of silicon films from azidosilane sources

Method of controlling dopant incorporation in high resistivity In-b...

Patents Applicationslast 30 patents

Calibration standards for dopants/impurities in silicon and prepara...

Monitoring process for oxide removal