Shelf life

Follow

Industry

CPC
H01L2924/37002

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/37002Shelf life

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reliable microstrip routing for electronics components
- Patent number 9,607,947
- Issue date Mar 28, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an integrated circuit chip and of a plate
- Patent number 9,589,874
- Issue date Mar 7, 2017
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable microstrip routing for electronics components
- Patent number 9,391,025
- Issue date Jul 12, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot plated leadframe and IC bond pad via array design for copper wire
- Patent number 9,230,928
- Issue date Jan 5, 2016
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER BONDING WIRE
- Publication number 20230105851
- Publication date Apr 6, 2023
- NIPPON MICROMETAL CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREDICTING RELIABILITY OF SEMICONDUCTOR DEVICE
- Publication number 20220260504
- Publication date Aug 18, 2022
- RENESAS ELECTRONICS CORPORATION
- Takuo FUNAYA
- G01 - MEASURING TESTING
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
- Publication number 20160172278
- Publication date Jun 16, 2016
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150262959
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Yuuji HISAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE MICROSTRIP ROUTING FOR ELECTRONICS COMPONENTS
- Publication number 20150228583
- Publication date Aug 13, 2015
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire
- Publication number 20130062742
- Publication date Mar 14, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS