TREA

Shields or metal cases

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  • H05K2201/10371
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10371Shields or metal cases
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Module
    • Patent number 12,177,982
    • Issue date Dec 24, 2024
    • Murata Manufacturing Co., Ltd.
    • Tadashi Nomura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electromagnetic interference shielding enclosure with thermal condu...
    • Patent number 12,167,530
    • Issue date Dec 10, 2024
    • Intel Corporation
    • Jaejin Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device including cooling structure
    • Patent number 12,100,637
    • Issue date Sep 24, 2024
    • Samsung Electronics Co., Ltd.
    • Jae Ho Chung
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Electronic device for a vehicle
    • Patent number 12,082,383
    • Issue date Sep 3, 2024
    • Aptiv Technologies AG
    • Sebastian Melfried
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Camera module
    • Patent number 12,081,851
    • Issue date Sep 3, 2024
    • LG Innotek Co., Ltd
    • Jekyung Park
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Grant

    Electronic assembly for a vehicle display
    • Patent number 12,041,732
    • Issue date Jul 16, 2024
    • Polaris Industries Inc.
    • Mark A. Powell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printed circuit board including on-board integrated enclosure for e...
    • Patent number 12,028,966
    • Issue date Jul 2, 2024
    • Marvell Asia Pte, Ltd.
    • Shaowu Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic module
    • Patent number 12,016,112
    • Issue date Jun 18, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito Otsubo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Personal care appliance and a method of assembling
    • Patent number 12,005,596
    • Issue date Jun 11, 2024
    • The Gillette Company LLC
    • Jannik Loeper
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Grant

    Circuit systems
    • Patent number 12,009,311
    • Issue date Jun 11, 2024
    • Snap Inc.
    • Stephen Andrew Steger
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit board
    • Patent number 11,997,785
    • Issue date May 28, 2024
    • Unimicron Technology Corp.
    • Chun-Lin Liao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic apparatus
    • Patent number 11,985,766
    • Issue date May 14, 2024
    • Sony Interactive Entertainment Inc.
    • Katsushi Ito
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Module
    • Patent number 11,968,815
    • Issue date Apr 23, 2024
    • Murata Manufacturing Co., Ltd.
    • Tadashi Nomura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Coupler and base station antenna
    • Patent number 11,968,782
    • Issue date Apr 23, 2024
    • COMMSCOPE TECHNOLOGIES LLC
    • Xiaotuo Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic apparatus
    • Patent number 11,943,868
    • Issue date Mar 26, 2024
    • Sony Interactive Entertainment Inc.
    • Katsushi Ito
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cable assembly for a cable connector module
    • Patent number 11,924,970
    • Issue date Mar 5, 2024
    • TE CONNECTIVITY SOLUTIONS GmbH
    • Chad William Morgan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Diagnostic disc with a high vacuum and temperature tolerant power s...
    • Patent number 11,924,972
    • Issue date Mar 5, 2024
    • Applied Materials, Inc.
    • Phillip A. Criminale
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Board level shield (BLS) frames including pickup members with picku...
    • Patent number 11,903,177
    • Issue date Feb 13, 2024
    • Laird Technologies, Inc.
    • Paul W. Crotty
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Additively manufactured protrusions
    • Patent number 11,895,812
    • Issue date Feb 6, 2024
    • Microsoft Technology Licensing, LLC
    • Lincoln Matthew Ghioni
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Shielding shell
    • Patent number 11,862,898
    • Issue date Jan 2, 2024
    • Dongguan Luxshare Technologies Co., Ltd.
    • Tao Song
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device with connector structure
    • Patent number 11,839,027
    • Issue date Dec 5, 2023
    • Wistron NeWeb Corp.
    • Yan-Da Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device comprising interposer surrounding circuit element...
    • Patent number 11,825,639
    • Issue date Nov 21, 2023
    • Samsung Electronics Co., Ltd.
    • Hyelim Yun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device including interposer
    • Patent number 11,818,843
    • Issue date Nov 14, 2023
    • Samsung Electronics Co., Ltd.
    • Jungsik Park
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Circuit board
    • Patent number 11,778,741
    • Issue date Oct 3, 2023
    • LG Innotek Co., Ltd
    • Yong Han Jeon
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Backplane connector with improved mounting block
    • Patent number 11,769,968
    • Issue date Sep 26, 2023
    • Dongguan Luxshare Technologies Co., Ltd.
    • Xiaogang Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Backplane connector
    • Patent number 11,749,948
    • Issue date Sep 5, 2023
    • Dongguan Luxshare Technologies Co., Ltd.
    • Tao Song
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Component mounted on circuit board
    • Patent number 11,744,019
    • Issue date Aug 29, 2023
    • Murata Manufacturing Co., Ltd.
    • Shigeyuki Kamio
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electromagnetic shielding structure for an overmolded printed circu...
    • Patent number 11,729,897
    • Issue date Aug 15, 2023
    • Meta Platforms Technologies, LLC
    • Qiuming Li
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Terminal module and backplane connector having the terminal module
    • Patent number 11,710,929
    • Issue date Jul 25, 2023
    • Dongguan Luxshare Technologies Co., Ltd.
    • Xiaogang Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Camera module
    • Patent number 11,711,599
    • Issue date Jul 25, 2023
    • LG Innotek Co., Ltd
    • Jekyung Park
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

  • Information Patent Application

    SWITCHING BOARD AND SOLDERING METHOD THEREOF
    • Publication number 20240407126
    • Publication date Dec 5, 2024
    • AEWIN TECHNOLOGIES CO., LTD.
    • Cheng-En LIU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20240388782
    • Publication date Nov 21, 2024
    • LG Innotek Co., Ltd.
    • JeKyung PARK
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
    • Publication number 20240341029
    • Publication date Oct 10, 2024
    • Spreadtrum Communications (Shanghai) CO., Ltd.
    • Li YAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT SYSTEMS
    • Publication number 20240312927
    • Publication date Sep 19, 2024
    • Snap Inc.
    • Stephen Andrew Steger
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit Board Assembly and Electronic Device
    • Publication number 20240292581
    • Publication date Aug 29, 2024
    • Honor Device Co., Ltd.
    • Jianqiang Guo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Shield Can as Stiffener on Flexible Printed Circuits
    • Publication number 20240224481
    • Publication date Jul 4, 2024
    • Meta Platforms Technologies, LLC
    • Adam Richard WEBER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Shielding Case, Circuit Board Assembly, and Electronic Device
    • Publication number 20240206138
    • Publication date Jun 20, 2024
    • Honor Device Co., Ltd.
    • Jiuliang Gao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENT...
    • Publication number 20240107726
    • Publication date Mar 28, 2024
    • Samsung Electronics Co., Ltd.
    • Hyelim YUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
    • Publication number 20240098940
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • Haein CHUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING ELECTRONI...
    • Publication number 20240090133
    • Publication date Mar 14, 2024
    • Murata Manufacturing Co., Ltd.
    • Norikazu KUME
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...
    • Publication number 20240023246
    • Publication date Jan 18, 2024
    • Applied Materials, Inc.
    • Phillip A. Criminale
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRESSURE SENSING IMPLANT
    • Publication number 20230380764
    • Publication date Nov 30, 2023
    • ENDOTRONIX, INC.
    • Harry ROWLAND
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
    • Publication number 20230380120
    • Publication date Nov 23, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Kunitoshi HANAOKA
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20230354509
    • Publication date Nov 2, 2023
    • Hitachi Astemo, Ltd.
    • Ryo AKIBA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
    • Publication number 20230344460
    • Publication date Oct 26, 2023
    • Murata Manufacturing Co., Ltd.
    • Masanari MIURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230328940
    • Publication date Oct 12, 2023
    • Sony Interactive Entertainment Inc.
    • Shinya Tsuchida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20230319383
    • Publication date Oct 5, 2023
    • LG Innotek Co., Ltd.
    • JeKyung PARK
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20230291090
    • Publication date Sep 14, 2023
    • Samsung Electronics Co., Ltd.
    • Jongwon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROMAGNETIC INTERFERENCE SHIELDING MATERIALS, DEVICES, AND METH...
    • Publication number 20230255011
    • Publication date Aug 10, 2023
    • NanoTech Energy, Inc.
    • Richard B. KANER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE AND METHOD FOR MANUFACTURING MODULE
    • Publication number 20230209788
    • Publication date Jun 29, 2023
    • Murata Manufacturing Co., Ltd.
    • Shota HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20230200032
    • Publication date Jun 22, 2023
    • Murata Manufacturing Co., Ltd.
    • Shota HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20230189490
    • Publication date Jun 15, 2023
    • Murata Manufacturing Co., Ltd.
    • Shota Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE CONDUCTIVE SHIELD INCLUDING DISCONTINUITIES TO REDUCE DEVICE...
    • Publication number 20230180380
    • Publication date Jun 8, 2023
    • Qorvo US, Inc.
    • Loizos Loizou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
    • Publication number 20230180382
    • Publication date Jun 8, 2023
    • Unimicron Technology Corp.
    • Chun-Lin LIAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE TYPE SENSOR FOR DETECTING VOLTAGE AND CURRENT OF RADIO FREQU...
    • Publication number 20230160946
    • Publication date May 25, 2023
    • Newpowerplasma Co., Ltd.
    • Jinjoong KIM
    • G01 - MEASURING TESTING
  • Information Patent Application

    MODULE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230141689
    • Publication date May 11, 2023
    • Murata Manufacturing Co., Ltd.
    • Tetsuya ODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20230116950
    • Publication date Apr 20, 2023
    • Sony Interactive Entertainment Inc.
    • Katsushi ITO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230113302
    • Publication date Apr 13, 2023
    • LG Innotek Co., Ltd.
    • Yong Han JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VACUUM-BASED ATTACHMENT FOR HEAT SINK AND RADIATION SHIELD
    • Publication number 20230097977
    • Publication date Mar 30, 2023
    • Intel Corporation
    • Samarth Alva
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20230100404
    • Publication date Mar 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR