TREA

Shields or metal cases

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  • H05K2201/10371
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10371Shields or metal cases
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENT...
    • Publication number 20240107726
    • Publication date Mar 28, 2024
    • Samsung Electronics Co., Ltd.
    • Hyelim YUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
    • Publication number 20240098940
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • Haein CHUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING ELECTRONI...
    • Publication number 20240090133
    • Publication date Mar 14, 2024
    • Murata Manufacturing Co., Ltd.
    • Norikazu KUME
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...
    • Publication number 20240023246
    • Publication date Jan 18, 2024
    • Applied Materials, Inc.
    • Phillip A. Criminale
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRESSURE SENSING IMPLANT
    • Publication number 20230380764
    • Publication date Nov 30, 2023
    • ENDOTRONIX, INC.
    • Harry ROWLAND
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
    • Publication number 20230380120
    • Publication date Nov 23, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Kunitoshi HANAOKA
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20230354509
    • Publication date Nov 2, 2023
    • Hitachi Astemo, Ltd.
    • Ryo AKIBA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
    • Publication number 20230344460
    • Publication date Oct 26, 2023
    • Murata Manufacturing Co., Ltd.
    • Masanari MIURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230328940
    • Publication date Oct 12, 2023
    • Sony Interactive Entertainment Inc.
    • Shinya Tsuchida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20230319383
    • Publication date Oct 5, 2023
    • LG Innotek Co., Ltd.
    • JeKyung PARK
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20230291090
    • Publication date Sep 14, 2023
    • Samsung Electronics Co., Ltd.
    • Jongwon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROMAGNETIC INTERFERENCE SHIELDING MATERIALS, DEVICES, AND METH...
    • Publication number 20230255011
    • Publication date Aug 10, 2023
    • NanoTech Energy, Inc.
    • Richard B. KANER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE AND METHOD FOR MANUFACTURING MODULE
    • Publication number 20230209788
    • Publication date Jun 29, 2023
    • Murata Manufacturing Co., Ltd.
    • Shota HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20230200032
    • Publication date Jun 22, 2023
    • Murata Manufacturing Co., Ltd.
    • Shota HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20230189490
    • Publication date Jun 15, 2023
    • Murata Manufacturing Co., Ltd.
    • Shota Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE CONDUCTIVE SHIELD INCLUDING DISCONTINUITIES TO REDUCE DEVICE...
    • Publication number 20230180380
    • Publication date Jun 8, 2023
    • Qorvo US, Inc.
    • Loizos Loizou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
    • Publication number 20230180382
    • Publication date Jun 8, 2023
    • Unimicron Technology Corp.
    • Chun-Lin LIAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE TYPE SENSOR FOR DETECTING VOLTAGE AND CURRENT OF RADIO FREQU...
    • Publication number 20230160946
    • Publication date May 25, 2023
    • Newpowerplasma Co., Ltd.
    • Jinjoong KIM
    • G01 - MEASURING TESTING
  • Information Patent Application

    MODULE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230141689
    • Publication date May 11, 2023
    • Murata Manufacturing Co., Ltd.
    • Tetsuya ODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20230116950
    • Publication date Apr 20, 2023
    • Sony Interactive Entertainment Inc.
    • Katsushi ITO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230113302
    • Publication date Apr 13, 2023
    • LG Innotek Co., Ltd.
    • Yong Han JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VACUUM-BASED ATTACHMENT FOR HEAT SINK AND RADIATION SHIELD
    • Publication number 20230097977
    • Publication date Mar 30, 2023
    • Intel Corporation
    • Samarth Alva
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20230100404
    • Publication date Mar 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ON-BOARD INTEGRATED ENCLOSURE FOR ELECTROMAGNETIC COMPATIBILITY SHI...
    • Publication number 20230089254
    • Publication date Mar 23, 2023
    • Marvell Asia Pte, Ltd.
    • Shaowu Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
    • Publication number 20230075555
    • Publication date Mar 9, 2023
    • Qorvo US, Inc.
    • Kelly M. Lear
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC ASSEMBLY FOR A VEHICLE DISPLAY
    • Publication number 20230056939
    • Publication date Feb 23, 2023
    • Polaris Industries Inc.
    • Mark A. POWELL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit Board Assembly
    • Publication number 20230030311
    • Publication date Feb 2, 2023
    • Tyco Electronics (Shanghai) Co. Ltd.
    • Ping Hou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20230013032
    • Publication date Jan 19, 2023
    • Murata Manufacturing Co., Ltd.
    • Minoru HATASE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20220353391
    • Publication date Nov 3, 2022
    • LG Innotek Co., Ltd.
    • JeKyung PARK
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    PERSONAL CARE APPLIANCE
    • Publication number 20220324127
    • Publication date Oct 13, 2022
    • The Gillette Company LLC
    • Jannik Loeper
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING