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CPC
H05K2201/0125

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0125Shrinkable

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plastic film/sheet as replacement for typical conformal coatings
- Patent number 10,349,530
- Issue date Jul 9, 2019
- Hamilton Sundstrand Corporation
- Robert C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing layered electronic devices
- Patent number 9,832,875
- Issue date Nov 28, 2017
- Hamilton Sundstrand Corporation
- Slade R. Culp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light emitting device module
- Patent number 9,285,083
- Issue date Mar 15, 2016
- LG Innotek Co., Ltd
- GunKyo Lee
- F21 - LIGHTING
Information Patent Grant
Method for mounting electronic-component module
- Patent number 7,650,692
- Issue date Jan 26, 2010
- Murata Manufacturing Co., Ltd.
- Kunihiro Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for compensating for substrate shrinkage during manufactu...
- Patent number 7,439,083
- Issue date Oct 21, 2008
- Delphi Technologies, Inc.
- M. Ray Fairchild
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetically shielded circuit device and shielding method th...
- Patent number 7,202,422
- Issue date Apr 10, 2007
- NEC Corporation
- Toshinobu Ogatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
- Patent number 7,131,193
- Issue date Nov 7, 2006
- Intel Corporation
- Arjang Fartash
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits on shrink film
- Patent number 7,033,667
- Issue date Apr 25, 2006
- 3M Innovative Properties Company
- Jessica L. Voss-Kehl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip carrier film, method of manufacturing the chip carrier film an...
- Patent number 6,908,790
- Issue date Jun 21, 2005
- Advanced Display Inc.
- Kouki Nakahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
- Patent number 6,906,268
- Issue date Jun 14, 2005
- Intel Corporation
- Arjang Fartash
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of disposing conductive bumps onto a semiconductor device
- Patent number 6,861,345
- Issue date Mar 1, 2005
- Micron Technology, Inc.
- Michael B. Ball
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing membranes
- Patent number 6,810,579
- Issue date Nov 2, 2004
- Shin Jiuh Corp.
- Tien-Min Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating ball grid array package for enhanced stress...
- Patent number 6,689,678
- Issue date Feb 10, 2004
- Texas Instruments Incorporated
- Richard D. James
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip carrier film, method of manufacturing the chip carrier film an...
- Patent number 6,674,155
- Issue date Jan 6, 2004
- Advanced Display Inc.
- Kouki Nakahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting semiconductor element to circuit board
- Patent number 6,651,320
- Issue date Nov 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiko Yagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array package for enhanced stress tolerance
- Patent number 6,583,515
- Issue date Jun 24, 2003
- Texas Instruments Incorporated
- Richard D. James
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for surface mounting electrical components to a substrate
- Patent number 6,478,909
- Issue date Nov 12, 2002
- Micron Technology, Inc.
- Mark E. Tuttle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component
- Patent number 6,315,856
- Issue date Nov 13, 2001
- Kabushiki Kaisha Toshiba
- Satoru Asagiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processes for manufacturing flexible printed wiring boards
- Patent number 6,233,821
- Issue date May 22, 2001
- Sony Chemicals Corp.
- Satoshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for surface mounting electrical components to a substrate
- Patent number 6,048,420
- Issue date Apr 11, 2000
- Micron Technology, Inc.
- Mark E. Tuttle
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible printed circuit and process for producing the same
- Patent number 6,001,489
- Issue date Dec 14, 1999
- Nitto Denko Corporation
- Chiharu Miyaake
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for surface mounting electrical components to a substrate
- Patent number 5,820,716
- Issue date Oct 13, 1998
- Micron Technology, Inc.
- Mark E. Tuttle
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of making subsurface electronic circuits
- Patent number 5,531,020
- Issue date Jul 2, 1996
- Poly-Flex Circuits, Inc.
- David Durand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Miniature hearing aid to be worn on the head, and a method for the...
- Patent number 5,404,408
- Issue date Apr 4, 1995
- Siemens Aktiengesellschaft
- Harald Strohmaier
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for mounting very small integrated circuit package on PCB
- Patent number 5,359,768
- Issue date Nov 1, 1994
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly using electrically conductive cement
- Patent number 5,326,636
- Issue date Jul 5, 1994
- Poly-Flex Circuits, Inc.
- David Durand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of assembling an electronic part device
- Patent number 5,210,938
- Issue date May 18, 1993
- Rohm Co., Ltd.
- Minoru Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive cement
- Patent number 5,183,593
- Issue date Feb 2, 1993
- Poly-Flex Circuits, Inc.
- David Durand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrically conductive cement containing agglomerate, flake and po...
- Patent number 5,180,523
- Issue date Jan 19, 1993
- Poly-Flex Circuits, Inc.
- David Durand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic circuit element
- Patent number 4,873,397
- Issue date Oct 10, 1989
- TDK Corporation
- Sho Masujima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...
- Publication number 20240032191
- Publication date Jan 25, 2024
- Denka Company Limited
- Yusuke MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM AND LAMINATE FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC SUBSTRAT...
- Publication number 20220330423
- Publication date Oct 13, 2022
- SKC CO., LTD.
- Young Min HEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASTIC FILM/SHEET AS REPLACEMENT FOR TYPICAL CONFORMAL COATINGS
- Publication number 20190215968
- Publication date Jul 11, 2019
- HAMILTON SUNDSTRAND CORPORATION
- Robert C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES
- Publication number 20180054894
- Publication date Feb 22, 2018
- HAMILTON SUNDSTRAND CORPORATION
- Slade R. Culp
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FABRICATING PRINTED ELECTRONICS
- Publication number 20160007473
- Publication date Jan 7, 2016
- HAMILTON SUNDSTRAND CORPORATION
- Sameh Dardona
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE MODULE
- Publication number 20110280012
- Publication date Nov 17, 2011
- Gun Kyo LEE
- F21 - LIGHTING
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...
- Publication number 20100085722
- Publication date Apr 8, 2010
- Murata Manufacturing Co., Ltd.
- Kunihiro KOYAMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...
- Publication number 20080192447
- Publication date Aug 14, 2008
- MURATA MANUFACTURING CO., LTD.
- Kunihiro KOYAMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Technique for compensating for substrate shrinkage during manufactu...
- Publication number 20060234424
- Publication date Oct 19, 2006
- M. Ray Fairchild
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuits on shrink film
- Publication number 20060141259
- Publication date Jun 29, 2006
- 3M Innovative Properties Company
- Jessica L. Voss-Kehi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetically shielded circuit device and shielding method th...
- Publication number 20050162841
- Publication date Jul 28, 2005
- Toshinobu Ogatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of disposing conductive bumps onto a semiconductor device an...
- Publication number 20050142835
- Publication date Jun 30, 2005
- Michael B. Ball
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUITS ON SHRINK FILM
- Publication number 20050136231
- Publication date Jun 23, 2005
- 3M Innovative Properties Company
- Jessica L. Voss-Kehl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-shrinkable retainer for PCB double-sided assembly
- Publication number 20040209508
- Publication date Oct 21, 2004
- Arjang Fartash
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip carrier film, method of manufacturing the chip carrier film an...
- Publication number 20040164429
- Publication date Aug 26, 2004
- ADVANCED DISPLAY INC.
- Kouki Nakahara
- G02 - OPTICS
Information Patent Application
Method for manufacturing membranes
- Publication number 20040020031
- Publication date Feb 5, 2004
- Tien-Min Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball grid array package for enhanced stress tolerance
- Publication number 20030153160
- Publication date Aug 14, 2003
- Richard D. James
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-shrinkable retainer for PCB double-sided assembly
- Publication number 20030111260
- Publication date Jun 19, 2003
- Arjang Fartash
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board, method for manufacturing same, and high-output module
- Publication number 20030070292
- Publication date Apr 17, 2003
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Nobuyoshi Tatoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip carrier film, method of manufacturing the chip carrier film an...
- Publication number 20020047133
- Publication date Apr 25, 2002
- ADVANCED DISPLAY INC.
- Kouki Nakahara
- G02 - OPTICS
Information Patent Application
Method of disposing conductive bumps onto a semiconductor device an...
- Publication number 20010002044
- Publication date May 31, 2001
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plastic film/sheet as replacement for typical conformal coatings

Method for manufacturing layered electronic devices

Light emitting device module

Method for mounting electronic-component module

Technique for compensating for substrate shrinkage during manufactu...

Electromagnetically shielded circuit device and shielding method th...

Heat-shrinkable retainer for PCB double-sided assembly

Printed circuits on shrink film

Chip carrier film, method of manufacturing the chip carrier film an...

Heat-shrinkable retainer for PCB double-sided assembly

Method of disposing conductive bumps onto a semiconductor device

Method for manufacturing membranes

Process for fabricating ball grid array package for enhanced stress...

Chip carrier film, method of manufacturing the chip carrier film an...

Method for mounting semiconductor element to circuit board

Ball grid array package for enhanced stress tolerance

Method for surface mounting electrical components to a substrate

Method of mounting electronic component

Processes for manufacturing flexible printed wiring boards

Method for surface mounting electrical components to a substrate

Flexible printed circuit and process for producing the same

Method for surface mounting electrical components to a substrate

Method of making subsurface electronic circuits

Miniature hearing aid to be worn on the head, and a method for the...

Method for mounting very small integrated circuit package on PCB

Assembly using electrically conductive cement

Method of assembling an electronic part device

Electrically conductive cement

Electrically conductive cement containing agglomerate, flake and po...

Electronic circuit element

Patents Applicationslast 30 patents

LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...

FILM AND LAMINATE FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC SUBSTRAT...

PLASTIC FILM/SHEET AS REPLACEMENT FOR TYPICAL CONFORMAL COATINGS

METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES

METHOD FOR FABRICATING PRINTED ELECTRONICS

LIGHT EMITTING DEVICE MODULE

METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...

METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...

Technique for compensating for substrate shrinkage during manufactu...

Printed circuits on shrink film

Electromagnetically shielded circuit device and shielding method th...

Method of disposing conductive bumps onto a semiconductor device an...

PRINTED CIRCUITS ON SHRINK FILM

Heat-shrinkable retainer for PCB double-sided assembly

Chip carrier film, method of manufacturing the chip carrier film an...

Method for manufacturing membranes

Ball grid array package for enhanced stress tolerance

Heat-shrinkable retainer for PCB double-sided assembly

Circuit board, method for manufacturing same, and high-output module

Chip carrier film, method of manufacturing the chip carrier film an...

Method of disposing conductive bumps onto a semiconductor device an...