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H01L2224/45028

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45028Side-to-side arrangements

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of a microelectronic chip having a groove with a wire elem...
- Patent number 8,611,101
- Issue date Dec 17, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding wire and bonded connection
- Patent number 7,319,196
- Issue date Jan 15, 2008
- EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission cable structure for GHz frequency band signals and con...
- Patent number 7,113,002
- Issue date Sep 26, 2006
- Fujikura Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect
- Patent number 6,794,760
- Issue date Sep 21, 2004
- Intel Corporation
- Edward Jaeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
- Publication number 20120228759
- Publication date Sep 13, 2012
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF A MICROELECTRONIC CHIP HAVING A GROOVE WITH A WIRE ELEM...
- Publication number 20110198735
- Publication date Aug 18, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire and bonded connection
- Publication number 20060055041
- Publication date Mar 16, 2006
- Eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Guy LeFranc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission cable structure for GHz frequency band signals and con...
- Publication number 20040227580
- Publication date Nov 18, 2004
- FUJIKURA LTD.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS