Silicon Controlled Rectifier [SCR]

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CPC
H01L2924/13034

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/13034Silicon Controlled Rectifier [SCR]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 11,961,834
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 11,929,363
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module including stacked power devices with metal clip
- Patent number 11,495,580
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete power transistor package having solderless DBC to leadfram...
- Patent number 11,387,162
- Issue date Jul 12, 2022
- Littelfuse, Inc.
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming complex electronic circuits by interconnecting g...
- Patent number 10,964,665
- Issue date Mar 30, 2021
- Nthdegree Technologies Worldwide, Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete power transistor package having solderless DBC to leadfram...
- Patent number 10,720,376
- Issue date Jul 21, 2020
- Littelfuse, Inc.
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a printable solution def...
- Patent number 10,499,499
- Issue date Dec 3, 2019
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with forward and reverse-biased light emitting diodes cou...
- Patent number 10,161,615
- Issue date Dec 25, 2018
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- F21 - LIGHTING
Information Patent Grant
Chip packages, chip arrangements, a circuit board, and methods for...
- Patent number 10,128,180
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module including stacked power devices with metal clip
- Patent number 10,128,219
- Issue date Nov 13, 2018
- Texas Instruments Incorporated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement including a ceramic layer
- Patent number 9,984,897
- Issue date May 29, 2018
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a patterned hydrophobic...
- Patent number 9,913,371
- Issue date Mar 6, 2018
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages, chip arrangements, a circuit board, and methods for...
- Patent number 9,859,198
- Issue date Jan 2, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for communication systems transceiver interfaces
- Patent number 9,831,233
- Issue date Nov 28, 2017
- Analog Devices Global
- Javier Alejandro Salcedo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light emitting apparatus having at least one reverse-biased light e...
- Patent number 9,777,914
- Issue date Oct 3, 2017
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for assembly of microelectronic devices
- Patent number 9,763,370
- Issue date Sep 12, 2017
- National Technology & Engineering Solutions of Sandia, LLC
- Murat Okandan
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Power module package and method for manufacturing the same
- Patent number 9,728,484
- Issue date Aug 8, 2017
- Hyundai Mobis Co., Ltd.
- Jae Hyun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of manufacturing the same
- Patent number 9,698,086
- Issue date Jul 4, 2017
- Infineon Technologies AG
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die arrangement
- Patent number 9,685,396
- Issue date Jun 20, 2017
- NXP B.V.
- Deorex David Avila Navaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods for manufacturing a chip package
- Patent number 9,666,452
- Issue date May 30, 2017
- Infineon Technologies AG
- Karl Adolf Dieter Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device for detecting factory ESD events
- Patent number 9,629,294
- Issue date Apr 18, 2017
- Texas Instruments Incorporated
- John Eric Kunz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure having wirebonds and method of manufacturin...
- Patent number 9,613,843
- Issue date Apr 4, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement
- Patent number 9,607,966
- Issue date Mar 28, 2017
- Infineon Technologies AG
- Anton Prueckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disabling electrical connections using pass-through 3D interconnect...
- Patent number 9,607,930
- Issue date Mar 28, 2017
- Micron Technologies, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits
- Patent number 9,572,249
- Issue date Feb 14, 2017
- Nthdegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with light emitting diodes
- Patent number 9,534,772
- Issue date Jan 3, 2017
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...
- Publication number 20240222363
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...
- Publication number 20240178216
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION DEVICE
- Publication number 20230223750
- Publication date Jul 13, 2023
- NEXPERIA B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE
- Publication number 20210335691
- Publication date Oct 28, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...
- Publication number 20200303281
- Publication date Sep 24, 2020
- IXYS, LLC
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE INCLUDING STACKED POWER DEVICES WITH METAL CLIP
- Publication number 20190088628
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...
- Publication number 20190088571
- Publication date Mar 21, 2019
- IXYS, LLC
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...
- Publication number 20180096924
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with Light Emitting or Absorbing Diodes
- Publication number 20180023793
- Publication date Jan 25, 2018
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- F21 - LIGHTING
Information Patent Application
APPARATUSES FOR COMMUNICATION SYSTEMS TRANSCEIVER INTERFACES
- Publication number 20170317070
- Publication date Nov 2, 2017
- ANALOG DEVICES GLOBAL
- Javier Alejandro Salcedo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170162468
- Publication date Jun 8, 2017
- HYUNDAI MOBIS Co., LTD.
- Jae Hyun KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Printable Composition of a Liquid or Gel...
- Publication number 20140370629
- Publication date Dec 18, 2014
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Light Emitting, Power Generating or Other...
- Publication number 20140363908
- Publication date Dec 11, 2014
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...
- Publication number 20140319697
- Publication date Oct 30, 2014
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printable Composition of a Liquid or Gel Suspension of Diodes
- Publication number 20140312332
- Publication date Oct 23, 2014
- Mark David Lowenthal
- B82 - NANO-TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291823
- Publication date Oct 2, 2014
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20140291644
- Publication date Oct 2, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF SENSING CURRENT IN A POWER SEMICONDUCTOR DEVICE
- Publication number 20140285178
- Publication date Sep 25, 2014
- ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
- Richard K. Williams
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CRYSTALLINE MICROELECTRONIC DEVICES
- Publication number 20140259633
- Publication date Sep 18, 2014
- SANDIA CORPORATION
- Murat Okandan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPLEX ELECTRONIC CIRCUITS
- Publication number 20140268591
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ACCUMULATION-MODE FIELD EFFECT TRANSISTOR WITH I...
- Publication number 20140264573
- Publication date Sep 18, 2014
- Fairchild Semiconductor Corporation
- Christopher Boguslaw KOCON
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS
- Publication number 20140264460
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGES...
- Publication number 20140233145
- Publication date Aug 21, 2014
- ams AG
- Dieter MAIER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140220743
- Publication date Aug 7, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink Package
- Publication number 20140217572
- Publication date Aug 7, 2014
- Fairchild Korea Semiconductor, Ltd.
- Joo-yang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE, ESD PROTECTION CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140210003
- Publication date Jul 31, 2014
- Jae-Hyok KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPECTRUM SPLITTING USING OPTICAL RECTENNAS
- Publication number 20140209788
- Publication date Jul 31, 2014
- The Regents of the University of Colorado, a Body Corporate
- Garrett Moddel
- G01 - MEASURING TESTING
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140197527
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20140197523
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...
- Publication number 20140197552
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Silicon Controlled Rectifier [SCR]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having multiple electrostatic discharge (ESD)...

Semiconductor device having multiple electrostatic discharge (ESD)...

Method of manufacturing semiconductor having double-sided substrate

Multi-chip module including stacked power devices with metal clip

Discrete power transistor package having solderless DBC to leadfram...

Circuit package, an electronic circuit package, and methods for enc...

Method for forming complex electronic circuits by interconnecting g...

Electronics package having a multi-thickness conductor layer and me...

Discrete power transistor package having solderless DBC to leadfram...

Printing complex electronic circuits using a printable solution def...

Power overlay structure and reconstituted semiconductor wafer havin...

Apparatus with forward and reverse-biased light emitting diodes cou...

Chip packages, chip arrangements, a circuit board, and methods for...

Multi-chip module including stacked power devices with metal clip

Method for manufacturing a chip arrangement including a ceramic layer

Printing complex electronic circuits using a patterned hydrophobic...

Chip packages, chip arrangements, a circuit board, and methods for...

Apparatuses for communication systems transceiver interfaces

Light emitting apparatus having at least one reverse-biased light e...

Apparatus for assembly of microelectronic devices

Power module package and method for manufacturing the same

Chip package and method of manufacturing the same

Semiconductor die arrangement

Chip packages and methods for manufacturing a chip package

Packaged device for detecting factory ESD events

Power overlay structure having wirebonds and method of manufacturin...

Chip arrangement

Disabling electrical connections using pass-through 3D interconnect...

Printing complex electronic circuits

Apparatus with light emitting diodes

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...

SEMICONDUCTOR DEVICE HAVING MULTIPLE ELECTROSTATIC DISCHARGE (ESD)...

ESD PROTECTION DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE

DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...

MULTI-CHIP MODULE INCLUDING STACKED POWER DEVICES WITH METAL CLIP

DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...

CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...

Apparatus with Light Emitting or Absorbing Diodes

APPARATUSES FOR COMMUNICATION SYSTEMS TRANSCEIVER INTERFACES

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method of Manufacturing a Printable Composition of a Liquid or Gel...

Method of Manufacturing a Light Emitting, Power Generating or Other...

DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...

Printable Composition of a Liquid or Gel Suspension of Diodes

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Diode for a Printable Composition

SYSTEM AND METHOD OF SENSING CURRENT IN A POWER SEMICONDUCTOR DEVICE

PRINTED CRYSTALLINE MICROELECTRONIC DEVICES

PRINTING COMPLEX ELECTRONIC CIRCUITS

METHOD FOR FORMING ACCUMULATION-MODE FIELD EFFECT TRANSISTOR WITH I...

THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS

CIRCUIT ARRANGEMENT FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGES...

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Heat Sink Package

DIODE, ESD PROTECTION CIRCUIT AND METHOD OF MANUFACTURING THE SAME

SPECTRUM SPLITTING USING OPTICAL RECTENNAS

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT

CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...