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Silver [Ag] as principal constituent
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H01L2224/05339
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05339
Silver [Ag] as principal constituent
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor element and semiconductor device provided with the same
Patent number
11,063,127
Issue date
Jul 13, 2021
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
7,759,177
Issue date
Jul 20, 2010
Semiconductor Energy Laboratory Co., Ltd.
Hidekazu Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
Publication number
20240194623
Publication date
Jun 13, 2024
TDK Electronics AG
Mehrdad Shayganpoor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20230411317
Publication date
Dec 21, 2023
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE PROVIDED WITH THE SAME
Publication number
20200144379
Publication date
May 7, 2020
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20130277850
Publication date
Oct 24, 2013
NAPRA CO., LTD.
Shigenobu Sekine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacturing method of semiconductor device
Publication number
20070037337
Publication date
Feb 15, 2007
Semiconductor Energy Laboratory Co., Ltd
Hidekazu Takahashi
H01 - BASIC ELECTRIC ELEMENTS