Silver [Ag] as principal constituent

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H01L2224/13139

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13139Silver [Ag] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Backplane and method for manufacturing the same, and display device
- Patent number 12,313,933
- Issue date May 27, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Pei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly having post connects with solder-based j...
- Patent number 12,288,763
- Issue date Apr 29, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures, semiconductor devices having the same, a...
- Patent number 12,288,765
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,272,665
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Yongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,237,282
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic chips
- Patent number 12,230,602
- Issue date Feb 18, 2025
- STMicroelectronics (Tours) SAS
- Ludovic Fallourd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 12,218,091
- Issue date Feb 4, 2025
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level dicing method and semiconductor device
- Patent number 12,176,248
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel
- Patent number 12,166,161
- Issue date Dec 10, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Qiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149456
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Young-Ja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
- Publication number 20250149488
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...
- Publication number 20250132280
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
- Publication number 20250125309
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20250118649
- Publication date Apr 10, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...
- Publication number 20250112138
- Publication date Apr 3, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...
- Publication number 20250113508
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Kronenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105193
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH CONNECTION PILLARS
- Publication number 20250105189
- Publication date Mar 27, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE COMPRISING MICRO LIGHT EMITTING DIODE
- Publication number 20250096177
- Publication date Mar 20, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- Yoonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
- Publication number 20250087612
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- JUNHYUN AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250087618
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079373
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Chaein Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079379
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME AND SEMICON...
- Publication number 20250070068
- Publication date Feb 27, 2025
- WINBOND ELECTRONICS CORP.
- Po-Chun SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20250056937
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250046661
- Publication date Feb 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsin-Mao HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046698
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Sojeong HONG
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backplane and method for manufacturing the same, and display device

Wiring board, semiconductor device, and method of manufacturing wir...

Devices with conductive or magnetic nanowires for localized heating...

Semiconductor packages and methods of forming same

Flip chip package assembly having post connects with solder-based j...

Hybrid bonding structures, semiconductor devices having the same, a...

Semiconductor device and manufacturing method thereof

Conductive bump of a semiconductor device and fabricating method th...

Metal-bump sidewall protection

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor packages and manufacturing methods thereof

Semiconductor packages with an intermetallic layer

Electronic devices in semiconductor package cavities

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Semiconductor device and method of forming the same

Method for manufacturing electronic chips

Chip package structure having molding layer

Superconducting bump bonds for quantum computing systems

Semiconductor device

Wafer level dicing method and semiconductor device

Display panel

Semiconductor package and methods of manufacturing

Single-shot encapsulation

Solder reflow apparatus and method of manufacturing an electronic d...

Bonding structures and methods for forming the same

Semiconductor device with interconnectors of different density

Integrated chip for standard logic performance improvement having a...

Etched trenches in bond materials for die singulation, and associat...

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

ELECTRONIC DEVICE

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

BONDING SCHEME FOR SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICE

CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...

Method for Forming Semiconductor Package and Semiconductor Package

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...

WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...

SEMICONDUCTOR PACKAGE

ELECTRONIC CHIP WITH CONNECTION PILLARS

DISPLAY MODULE COMPRISING MICRO LIGHT EMITTING DIODE

INTEGRATED CIRCUIT PACKAGES AND METHODS

CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME AND SEMICON...

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE