Silver [Ag] as principal constituent

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H01L2224/84539

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84539Silver [Ag] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Patent number 6,515,373
- Issue date Feb 4, 2003
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Publication number 20020084311
- Publication date Jul 4, 2002
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS