Silver [Ag] as principal constituent

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H01L2224/13239

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13239Silver [Ag] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing a chip-card module with soldered electron...
- Patent number 11,894,295
- Issue date Feb 6, 2024
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,682,646
- Issue date Jun 20, 2023
- MARVELL ASIA PTE. LTD.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,658,277
- Issue date May 23, 2023
- OSRAM OLED GmbH
- Guido Weiss
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing circuit structure
- Patent number 11,610,857
- Issue date Mar 21, 2023
- Winbond Electronics Corp.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip flexible under bump metallization size
- Patent number 11,557,557
- Issue date Jan 17, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element mounting structure, and combination of semico...
- Patent number 11,444,054
- Issue date Sep 13, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with bonding pad and method for form...
- Patent number 11,222,859
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder in a photonic device
- Patent number 11,181,689
- Issue date Nov 23, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,171,104
- Issue date Nov 9, 2021
- Marvell Asia Pte, Ltd.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,094,866
- Issue date Aug 17, 2021
- OSRAM OLED GmbH
- Guido Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,700,249
- Issue date Jun 30, 2020
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,283,685
- Issue date May 7, 2019
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,224,301
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of forming the same
- Patent number 10,020,273
- Issue date Jul 10, 2018
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 8,939,347
- Issue date Jan 27, 2015
- Intel Corporation
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solder and electrically conductive adhesive based interconnection f...
- Patent number 8,592,299
- Issue date Nov 26, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
- Patent number 7,528,006
- Issue date May 5, 2009
- Intel Corporation
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230215830
- Publication date Jul 6, 2023
- Sony Semiconductor Solutions Corporation
- Mutsuo TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Manufacturing a Chip-Card Module with Soldered Electron...
- Publication number 20220139818
- Publication date May 5, 2022
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20220102603
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
- Publication number 20210407939
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT STRUCTURE
- Publication number 20210407946
- Publication date Dec 30, 2021
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20210351144
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
- Publication number 20210336111
- Publication date Oct 28, 2021
- OSRAM OLED GmbH
- Guido Weiss
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
- Publication number 20210125952
- Publication date Apr 29, 2021
- Marvell International Ltd.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE
- Publication number 20210088722
- Publication date Mar 25, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...
- Publication number 20200273837
- Publication date Aug 27, 2020
- Hitachi Chemical Company, Ltd.
- Hitoshi ONOZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200251435
- Publication date Aug 6, 2020
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
- Publication number 20200028045
- Publication date Jan 23, 2020
- Osram Opto Semiconductors GmbH
- Guido Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...
- Publication number 20190229098
- Publication date Jul 25, 2019
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20180204991
- Publication date Jul 19, 2018
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20170279020
- Publication date Sep 28, 2017
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20170148753
- Publication date May 25, 2017
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT
- Publication number 20110266030
- Publication date Nov 3, 2011
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Application
Integrated circuit die containing particale-filled through-silicon...
- Publication number 20100193952
- Publication date Aug 5, 2010
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particle-filled through-silicon m...
- Publication number 20070001266
- Publication date Jan 4, 2007
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process for manufacturing a chip-card module with soldered electron...

IC chip package with dummy solder structure under corner, and relat...

Method for producing an optoelectronic component, and optoelectroni...

Method of manufacturing circuit structure

Flip-chip flexible under bump metallization size

Semiconductor element mounting structure, and combination of semico...

Semiconductor device structure with bonding pad and method for form...

Low temperature solder in a photonic device

IC chip package with dummy solder structure under corner, and relat...

Method for producing an optoelectronic component, and optoelectroni...

Lead free solder columns and methods for making same

Contact structures with porous networks for solder connections, and...

Light emitting device and method of fabricating the same

Light emitting device and method of fabricating the same

Semiconductor package device and method of manufacturing the same

Semiconductor devices and methods of forming the same

Package on package structure and method of manufacturing the same

Magnetic intermetallic compound interconnect

Solder and electrically conductive adhesive based interconnection f...

Integrated circuit die containing particle-filled through-silicon m...

Patents Applicationslast 30 patents

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Process for Manufacturing a Chip-Card Module with Soldered Electron...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

METHOD OF MANUFACTURING CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

Method for Producing an Optoelectronic Component, and Optoelectroni...

IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...

LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE

SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...

CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Method for Producing an Optoelectronic Component, and Optoelectroni...

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT

Integrated circuit die containing particale-filled through-silicon...

Integrated circuit die containing particle-filled through-silicon m...