Silver [Ag] as principal constituent

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H01L2224/13339

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13339Silver [Ag] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package device
- Patent number 11,011,445
- Issue date May 18, 2021
- MagnaChip Semiconductor, Ltd.
- Moon Taek Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Illumination device
- Patent number 10,989,396
- Issue date Apr 27, 2021
- Epistar Corporation
- Chih-Ping Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,692,829
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illumination device
- Patent number 10,655,826
- Issue date May 19, 2020
- Epistar Corporation
- Chih-Ping Ho
- F21 - LIGHTING
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,607,956
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive particle, and connection material, connection structure,...
- Patent number 10,412,838
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintered body made from silver fine particles
- Patent number 10,369,667
- Issue date Aug 6, 2019
- NAMICS CORPORATION
- Makoto Kobayashi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE
- Publication number 20240282737
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Liang Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE FOR FORMING PILLARS
- Publication number 20210229172
- Publication date Jul 29, 2021
- DIC CORPORATION
- Ryota Yamaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Solder Alloys For Electronic Interconnects
- Publication number 20190157535
- Publication date May 23, 2019
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIGHTING DEVICE INCLUDING A NANO-PARTICLE HEAT SPREADING L...
- Publication number 20190097108
- Publication date Mar 28, 2019
- GROTE INDUSTRIES, LLC
- Jiabiao RUAN
- B82 - NANO-TECHNOLOGY
Information Patent Application
Advanced Solder Alloys For Electronic Interconnects
- Publication number 20180102464
- Publication date Apr 12, 2018
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...
- Publication number 20170347463
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- ARATA KISHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-EMITTING DIODE WITH SIDE-WALL BUMP STRUCTURE AND MOUNTING STR...
- Publication number 20140312379
- Publication date Oct 23, 2014
- Lextar Electronics Corporation
- Chia-En LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140246783
- Publication date Sep 4, 2014
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATION DEVICE
- Publication number 20140103369
- Publication date Apr 17, 2014
- Formosa Epitaxy Incorporation
- Chi-Chih Pu
- F21 - LIGHTING
Information Patent Application
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
- Publication number 20130196499
- Publication date Aug 1, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIGH ASPECT RATIO FLIP-CHIP INTERCONNECTS
- Publication number 20130070436
- Publication date Mar 21, 2013
- of Arizona
- Jemmy Sutanto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AGENT, AND LIGHT E...
- Publication number 20130049054
- Publication date Feb 28, 2013
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130020709
- Publication date Jan 24, 2013
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME
- Publication number 20130001757
- Publication date Jan 3, 2013
- Tessera. Inc.
- Chok Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120319289
- Publication date Dec 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kenichi MORI
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Low pressure sintering powder

Semiconductor device and a method of manufacturing thereof

Advanced solder alloys for electronic interconnects

Sintering materials and attachment methods using same

Semiconductor package device

Assembly comprising hybrid interconnecting means including intermed...

Low pressure sintering powder

Illumination device

Method of forming a solder bump structure

Semiconductor device and a method of manufacturing thereof

Die stack assembly using an edge separation structure for connectiv...

Electronic element and electronic device comprising the same

Electronics package having a multi-thickness conductor layer and me...

Die stack assembly using an edge separation structure for connectiv...

Method of forming a solder bump structure

Engineered polymer-based electronic materials

Illumination device

Semiconductor device and a method of manufacturing thereof

Method of forming a solder bump structure

Semiconductor device with barrier layer

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Conductive particle, and connection material, connection structure,...

Sintered body made from silver fine particles

Bonding structure and method for producing bonding structure

Conductive connecting member and manufacturing method of same

Semiconductor device and a method of manufacturing thereof

Method for producing metal ball, joining material, and metal ball

Electronic device and method for producing an electronic device

Method for manufacturing metal powder

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE

TERMINAL AND CONNECTION METHOD

ELECTRICALLY CONDUCTIVE PASTE FOR FORMING PILLARS

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

METHOD OF FORMING A SOLDER BUMP STRUCTURE

METHOD OF FORMING A SOLDER BUMP STRUCTURE

Advanced Solder Alloys For Electronic Interconnects

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

FLEXIBLE LIGHTING DEVICE INCLUDING A NANO-PARTICLE HEAT SPREADING L...

Advanced Solder Alloys For Electronic Interconnects

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...

FORMATION OF CONDUCTIVE CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

LIGHT-EMITTING DIODE WITH SIDE-WALL BUMP STRUCTURE AND MOUNTING STR...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

ILLUMINATION DEVICE

METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT

SYSTEMS AND METHODS FOR HIGH ASPECT RATIO FLIP-CHIP INTERCONNECTS

LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AGENT, AND LIGHT E...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

SEMICONDUCTOR PACKAGE