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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29239
Silver [Ag] as principal constituent
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Patents Grants
last 30 patents
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Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
Patent number
12,096,554
Issue date
Sep 17, 2024
Xerox Corporation
Naveen Chopra
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Diffusion soldering with contaminant protection
Patent number
12,087,723
Issue date
Sep 10, 2024
Infineon Technologies Austria AG
Victor Verdugo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device
Patent number
11,923,270
Issue date
Mar 5, 2024
Kabushiki Kaisha Toshiba
Tatsuya Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method of manufacturing the same
Patent number
11,856,828
Issue date
Dec 26, 2023
Samsung Display Co., Ltd.
Joo-nyung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device and substrate with dimple region
Patent number
11,842,968
Issue date
Dec 12, 2023
Mitsubishi Electric Corporation
Kohei Yabuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material and method for die attachment
Patent number
11,842,974
Issue date
Dec 12, 2023
Alpha Assembly Solutions Inc.
Angelo Gulino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal particle aggregates, method for producing same, paste-like me...
Patent number
11,801,556
Issue date
Oct 31, 2023
Mitsubishi Materials Corporation
Tomohiko Yamaguchi
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device including a solder compound containing a compo...
Patent number
11,776,927
Issue date
Oct 3, 2023
Infineon Technologies AG
Thomas Behrens
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Terminal member made of plurality of metal layers between two heat...
Patent number
11,710,709
Issue date
Jul 25, 2023
Denso Corporation
Ryoichi Kaizu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for semiconductor device
Patent number
11,676,936
Issue date
Jun 13, 2023
Nitto Denko Corporation
Ryota Mita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroconductive film, roll, connected structure, and process for...
Patent number
11,667,817
Issue date
Jun 6, 2023
SHOWA DENKO MATERIALS CO., LTD.
Takashi Tatsuzawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display module and manufacturing method thereof
Patent number
11,652,196
Issue date
May 16, 2023
Samsung Electronics Co., Ltd.
Myunghee Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sheet and composite sheet
Patent number
11,634,611
Issue date
Apr 25, 2023
Nitto Denko Corporation
Nao Kamakura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor having double-sided substrate
Patent number
11,631,627
Issue date
Apr 18, 2023
JMJ KOREA CO., LTD.
Yun Hwa Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Diffusion soldering with contaminant protection
Patent number
11,610,861
Issue date
Mar 21, 2023
Infineon Technologies Austria AG
Victor Verdugo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for semiconductor device
Patent number
11,594,513
Issue date
Feb 28, 2023
Nitto Denko Corporation
Ryota Mita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sinter sheet, semiconductor device and manufacturing method thereof
Patent number
11,557,563
Issue date
Jan 17, 2023
Denso Corporation
Tomohito Iwashige
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structure and bonding material
Patent number
11,515,281
Issue date
Nov 29, 2022
Panasonic Holdings Corporation
Akio Furusawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounting structure and nanoparticle mounting material
Patent number
11,515,280
Issue date
Nov 29, 2022
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Kiyohiro Hine
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
Patent number
11,510,314
Issue date
Nov 22, 2022
Xerox Corporation
Naveen Chopra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silver nano-twinned thin film structure and method for forming the...
Patent number
11,488,920
Issue date
Nov 1, 2022
AG MATERIALS TECHNOLOGY CO., LTD.
Hsing-Hua Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
Patent number
11,462,502
Issue date
Oct 4, 2022
SHOWA DENKO MATERIALS CO., LTD.
Yuki Kawana
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device, sintered metal sheet, and method for manufact...
Patent number
11,437,338
Issue date
Sep 6, 2022
Hitachi, Ltd.
Tomohisa Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit having die attach materials with channels and pr...
Patent number
11,424,177
Issue date
Aug 23, 2022
Wolfspeed, Inc.
Mitch Flowers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device and manufacturing method for power semic...
Patent number
11,342,281
Issue date
May 24, 2022
Mitsubishi Electric Corporation
Kohei Yabuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film-shaped fired material, and film-shaped fired material with sup...
Patent number
11,285,536
Issue date
Mar 29, 2022
Lintec Corporation
Isao Ichikawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Three-dimensional integrated package device for high-voltage silico...
Patent number
11,158,609
Issue date
Oct 26, 2021
Xi'an Jiaotong University
Laili Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material for semiconductor device
Patent number
11,145,615
Issue date
Oct 12, 2021
Fuji Electric Co., Ltd.
Hirohiko Watanabe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Display device and method of manufacturing the same
Patent number
11,145,706
Issue date
Oct 12, 2021
Samsung Display Co., Ltd.
Joo-nyung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor device package
Patent number
11,094,865
Issue date
Aug 17, 2021
SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Byung Yeon Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
Publication number
20230137299
Publication date
May 4, 2023
Showa Denko Materials Co., Ltd.
Takashi TATSUZAWA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
Publication number
20220418104
Publication date
Dec 29, 2022
Xerox Corporation
Naveen CHOPRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME
Publication number
20220336407
Publication date
Oct 20, 2022
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
Publication number
20220254738
Publication date
Aug 11, 2022
Mitsubishi Electric Corporation
Kohei YABUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
Publication number
20220216173
Publication date
Jul 7, 2022
INFINEON TECHNOLOGIES AG
Thomas Behrens
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20220093485
Publication date
Mar 24, 2022
Kabushiki Kaisha Toshiba
Tatsuya Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220093719
Publication date
Mar 24, 2022
SAMSUNG DISPLAY CO., LTD.
Joo-nyung JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Diffusion Soldering with Contaminant Protection
Publication number
20220084981
Publication date
Mar 17, 2022
Victor Verdugo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
Publication number
20210407953
Publication date
Dec 30, 2021
Fuji Electric Co., Ltd.
Hirohiko WATANABE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Integrated Circuit Having Die Attach Materials with Channels and Pr...
Publication number
20210351113
Publication date
Nov 11, 2021
Cree, Inc.
Mitch Flowers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE
Publication number
20210335691
Publication date
Oct 28, 2021
JMJ KOREA CO., LTD.
Yun Hwa CHOI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE, SINTERED METAL SHEET, AND METHOD FOR MANUFACT...
Publication number
20210265298
Publication date
Aug 26, 2021
Hitachi, Ltd
Tomohisa SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20210242165
Publication date
Aug 5, 2021
NITTO DENKO CORPORATION
Ryota MITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILVER NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING THE...
Publication number
20210225793
Publication date
Jul 22, 2021
AG MATERIALS TECHNOLOGY CO.,LTD.
Hsing-Hua TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...
Publication number
20210129245
Publication date
May 6, 2021
Heraeus Deutschland GmbH & Co. KG
Michael Schäfer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
Publication number
20210121962
Publication date
Apr 29, 2021
SEMIKRON ELEKTRONIK GMBH & CO. KG
DOMINIC BIRKICHT
B22 - CASTING POWDER METALLURGY
Information
Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
Publication number
20210111325
Publication date
Apr 15, 2021
Samsung Electronics Co., Ltd.
Myunghee KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20210098418
Publication date
Apr 1, 2021
NITTO DENKO CORPORATION
Ryota MITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL PARTICLE AGGREGATES, METHOD FOR PRODUCING SAME, PASTE-LIKE ME...
Publication number
20210050319
Publication date
Feb 18, 2021
MITSUBISHI MATERIALS CORPORATION
Tomohiko Yamaguchi
B22 - CASTING POWDER METALLURGY
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20200403054
Publication date
Dec 24, 2020
SAMSUNG DISPLAY CO., LTD.
Joo-nyung JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINTER SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20200402944
Publication date
Dec 24, 2020
DENSO CORPORATION
Tomohito IWASHIGE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL INTEGRATED PACKAGE DEVICE FOR HIGH-VOLTAGE SILICO...
Publication number
20200388595
Publication date
Dec 10, 2020
XI'AN JIAOTONG UNIVERSITY
Laili WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM-SHAPED FIRED MATERIAL, AND FILM-SHAPED FIRED MATERIAL WITH SUP...
Publication number
20200376549
Publication date
Dec 3, 2020
LINTEC CORPORATION
Isao ICHIKAWA
B22 - CASTING POWDER METALLURGY
Information
Patent Application
JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL
Publication number
20200373269
Publication date
Nov 26, 2020
Panasonic Intellectual Property Management Co., Ltd.
TAKAHIRO KUMAKAWA
B22 - CASTING POWDER METALLURGY
Information
Patent Application
BONDED STRUCTURE AND BONDING MATERIAL
Publication number
20200335470
Publication date
Oct 22, 2020
PANASONIC CORPORATION
Akio FURUSAWA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
Publication number
20200303337
Publication date
Sep 24, 2020
Fuji Electric Co., Ltd.
Hirohiko WATANABE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HOTSPOT THERMAL MANAGEMENT OF POWER ELECTRONIC PACKAGE WITH NANO DI...
Publication number
20200294949
Publication date
Sep 17, 2020
LITTELFUSE, INC.
Be-nazir Khan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...
Publication number
20200251641
Publication date
Aug 6, 2020
Kunshan New Flat Panel Display Technology Center Co., Ltd.
Feng ZHAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
Publication number
20200251423
Publication date
Aug 6, 2020
MITSUBISHI ELECTRIC CORPORATION
Kohei YABUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
Publication number
20200203304
Publication date
Jun 25, 2020
Alpha Assembly Solutions Inc.
Angelo GULINO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR