Silver (Ag) as principal constituent

Industry

CPC
H01L2224/85439

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85439Silver (Ag) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging extendable lead and method therefor
- Patent number 11,869,837
- Issue date Jan 9, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 11,508,635
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating carrier-free semiconductor package
- Patent number 11,289,409
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 11,227,776
- Issue date Jan 18, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,903,129
- Issue date Jan 26, 2021
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing chip-mounting substrate, and chip-mounting...
- Patent number 10,868,221
- Issue date Dec 15, 2020
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 10,790,258
- Issue date Sep 29, 2020
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module substrate, power module, and method for manufacturing...
- Patent number 10,763,184
- Issue date Sep 1, 2020
- Kyocera Corporation
- Kenji Suetsugu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 10,685,897
- Issue date Jun 16, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protection layer surrounding a bonding pad
- Patent number 10,566,305
- Issue date Feb 18, 2020
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-free semiconductor package and fabrication method
- Patent number 10,566,271
- Issue date Feb 18, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,529,683
- Issue date Jan 7, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with lead frame and recessed solder terminals
- Patent number 10,510,643
- Issue date Dec 17, 2019
- Texas Instruments Incorporated
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,869
- Issue date Dec 10, 2019
- Renesas Electronics Corporation
- Shoji Hashizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second semiconductor chips conn...
- Patent number 10,497,644
- Issue date Dec 3, 2019
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDABLE INNER LEAD FOR LEADED PACKAGE
- Publication number 20240105579
- Publication date Mar 28, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD OF MAKING LEAD FRAME, SEMICONDUCTOR APPARATUS, A...
- Publication number 20230197580
- Publication date Jun 22, 2023
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR
- Publication number 20230027248
- Publication date Jan 26, 2023
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER PASTE COMPOSITION FOR CONFIGURABLE SINTERED INTERCONNECT AND...
- Publication number 20210024766
- Publication date Jan 28, 2021
- EoPlex Limited
- Joe CHOU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20200258803
- Publication date Aug 13, 2020
- Amkor Technology Singapore Holding Pte. Ltd
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE
- Publication number 20200144167
- Publication date May 7, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200066619
- Publication date Feb 27, 2020
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...
- Publication number 20190306976
- Publication date Oct 3, 2019
- OSRAM SYLVANIA INC.
- Sridharan Venk
- F21 - LIGHTING
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190214361
- Publication date Jul 11, 2019
- ROHM CO., LTD.
- Motoharu HAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180374815
- Publication date Dec 27, 2018
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LEAD FRAME AND RECESSED SOLDER TERMINALS
- Publication number 20180261531
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Mark Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...
- Publication number 20180047588
- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20170271225
- Publication date Sep 21, 2017
- ROHM CO., LTD.
- Motoharu HAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160086875
- Publication date Mar 24, 2016
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140353809
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140349447
- Publication date Nov 27, 2014
- Renesas Electronics Corporation
- Hiroshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20140349424
- Publication date Nov 27, 2014
- Kazunori ODA
- F21 - LIGHTING
Information Patent Application
PRINTING CIRCUIT BOARD AND THE APPLICATION THE SAME OF
- Publication number 20140338957
- Publication date Nov 20, 2014
- Chung-Pao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS

Silver (Ag) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Extendable inner lead for leaded package

Leadframe package with pre-applied filler material

Semiconductor package having routable encapsulated conductive subst...

Palladium-coated copper bonding wire, wire bonding structure, semic...

Semiconductor device packaging extendable lead and method therefor

Semiconductor packages with pass-through clock traces and associate...

Semiconductor device

Semiconductor package having routable encapsulated conductive subst...

Method for fabricating carrier-free semiconductor package

Leadframe package with pre-applied filler material

Plurality of lead frames electrically connected to inductor chip

Direct selective adhesion promotor plating

Electronic device

Method for manufacturing chip-mounting substrate, and chip-mounting...

Semiconductor device

Semiconductor device package and methods of manufacture thereof

Semiconductor integrated circuit device

Method of manufacturing semiconductor device and semiconductor device

Electronic device and mounting structure of the same

Power module substrate, power module, and method for manufacturing...

Semiconductor package having routable encapsulated conductive subst...

Cu alloy core bonding wire with Pd coating for semiconductor device

Semiconductor device with protection layer surrounding a bonding pad

Carrier-free semiconductor package and fabrication method

Bonding wire for semiconductor device

Semiconductor package with lead frame and recessed solder terminals

Semiconductor device

Semiconductor device with first and second semiconductor chips conn...

Cu alloy core bonding wire with Pd coating for semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

EXTENDABLE INNER LEAD FOR LEADED PACKAGE

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

LEAD FRAME, METHOD OF MAKING LEAD FRAME, SEMICONDUCTOR APPARATUS, A...

SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR

SILVER PASTE COMPOSITION FOR CONFIGURABLE SINTERED INTERCONNECT AND...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...

Direct Selective Adhesion Promotor Plating

SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

SEMICONDUCTOR PACKAGE WITH LEAD FRAME AND RECESSED SOLDER TERMINALS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

PRINTING CIRCUIT BOARD AND THE APPLICATION THE SAME OF

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

Stackable Package by Using Internal Stacking Modules