Simultaneous circuit manufacturing

Industry

CPC
Y10T29/4916

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/4916Simultaneous circuit manufacturing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pre-connected analyte sensors
- Patent number 12,150,250
- Issue date Nov 19, 2024
- DexCom, Inc.
- Jason Halac
- G01 - MEASURING TESTING
Information Patent Grant
Vehicular camera system
- Patent number 12,109,951
- Issue date Oct 8, 2024
- Magna Electronics Inc.
- Garret F. Achenbach
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of making a measurement probe
- Patent number 12,076,113
- Issue date Sep 3, 2024
- ViOptix, Inc.
- Jimmy Jian-Min Mao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
High speed communication jack
- Patent number 12,051,878
- Issue date Jul 30, 2024
- SENTINEL CONNECTOR SYSTEMS
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High tolerance connection between elements
- Patent number 11,994,916
- Issue date May 28, 2024
- Apple Inc.
- Scott A. Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pre-connected analyte sensors
- Patent number 11,943,876
- Issue date Mar 26, 2024
- DexCom, Inc.
- Jason Halac
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light fixture with cover box and mounting box in sealable engagement
- Patent number 11,906,130
- Issue date Feb 20, 2024
- SIGNIFY HOLDING B.V.
- Chad Stuart Newton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart cards with metal layer(s) and methods of manufacture
- Patent number 11,907,791
- Issue date Feb 20, 2024
- Amatech Group Lijited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable conductors
- Patent number 11,894,164
- Issue date Feb 6, 2024
- 3M Innovative Properties Compnay
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,887,969
- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick connection system for energy storage and photovoltaic equipment
- Patent number 11,881,672
- Issue date Jan 23, 2024
- Gridworks, Inc.
- Kevin Bassalleck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smartcards with multiple coupling frames
- Patent number 11,836,565
- Issue date Dec 5, 2023
- AMATECH GROUP LIMITED
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micromechanical detection structure of a MEMS multi-axis gyroscope,...
- Patent number 11,808,574
- Issue date Nov 7, 2023
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for use in making a blister package lid
- Patent number 11,793,717
- Issue date Oct 24, 2023
- Automated Assembly Corporation
- David Neuman
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method, system and device for manufacturing printed circuit board,...
- Patent number 11,770,905
- Issue date Sep 26, 2023
- INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
- Dong Zhou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicular camera system
- Patent number 11,718,228
- Issue date Aug 8, 2023
- Magna Electronics Inc.
- Garret F. Achenbach
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Pre-connected analyte sensors
- Patent number 11,706,876
- Issue date Jul 18, 2023
- DexCom, Inc.
- Jason Halac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handheld device enclosure
- Patent number 11,669,131
- Issue date Jun 6, 2023
- Apple Inc.
- Scott Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 11,602,056
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High tolerance connection between elements
- Patent number 11,573,608
- Issue date Feb 7, 2023
- Apple Inc.
- Scott A. Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a lead for an active implantable medical de...
- Patent number 11,564,605
- Issue date Jan 31, 2023
- Sorin CRM SAS
- Jean-François Ollivier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wall pack light fixture having a cover box mounted to a mounting box
- Patent number 11,555,588
- Issue date Jan 17, 2023
- SIGNIFY HOLDING B.V.
- Chad Stuart Newton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS
- Publication number 20240272681
- Publication date Aug 15, 2024
- Apple Inc.
- Scott A. Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICULAR CAMERA SYSTEM
- Publication number 20230331152
- Publication date Oct 19, 2023
- MAGNA ELECTRONICS INC.
- Garret F. Achenbach
- B60 - VEHICLES IN GENERAL
Information Patent Application
VEHICULAR CAMERA SYSTEM
- Publication number 20230331153
- Publication date Oct 19, 2023
- MAGNA ELECTRONICS INC.
- Garret F. Achenbach
- B60 - VEHICLES IN GENERAL
Information Patent Application
HANDHELD DEVICE ENCLOSURE
- Publication number 20230288965
- Publication date Sep 14, 2023
- Apple Inc.
- Scott Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20230199973
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS
- Publication number 20230176625
- Publication date Jun 8, 2023
- Apple Inc.
- Scott A. Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WALL PACK LIGHT FIXTURE
- Publication number 20230151938
- Publication date May 18, 2023
- SIGNIFY HOLDING B.V.
- CHAD STUART NEWTON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMARTCARDS WITH MULTIPLE COUPLING FRAMES
- Publication number 20230101906
- Publication date Mar 30, 2023
- AmaTech Group Limited
- Mustafa Lotya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20220415855
- Publication date Dec 29, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20220386451
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGE INTEGRATION FOR HIGH-FREQUENCY RF SYSTEM
- Publication number 20220375841
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Shiang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Compensation for Vertical Interconnect Accesses
- Publication number 20220201857
- Publication date Jun 23, 2022
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD OF ASSEMBLY OF ARTICLES AND INTERMEDIATE CREATED THEREBY
- Publication number 20220164621
- Publication date May 26, 2022
- Avery Dennison Corporation
- Ian J. FORSTER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20220117087
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
HANDHELD DEVICE ENCLOSURE
- Publication number 20220075422
- Publication date Mar 10, 2022
- Apple Inc.
- Scott Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COSMETIC CO-REMOVAL OF MATERIAL FOR ELECTRONIC DEVICE SURFACES
- Publication number 20210382525
- Publication date Dec 9, 2021
- Apple Inc.
- Scott Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WALL PACK LIGHT FIXTURE
- Publication number 20210341113
- Publication date Nov 4, 2021
- SIGNIFY HOLDING B.V.
- CHAD STUART NEWTON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASED ARRAY STEERING FOR LASER BEAM POSITIONING SYSTEMS
- Publication number 20210291296
- Publication date Sep 23, 2021
- ELECTRO SCIENTIFIC INDUSTRIES, INC.
- Jan Kleinert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE CONDUCTORS
- Publication number 20210280337
- Publication date Sep 9, 2021
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210195761
- Publication date Jun 24, 2021
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System Producing a Conductive Path on a Substrate
- Publication number 20210195756
- Publication date Jun 24, 2021
- ORBOTECH LTD.
- Zvi KOTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method for manufacturing the same
- Publication number 20210176861
- Publication date Jun 10, 2021
- InnoLux Corporation
- Po-Yun HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20210153360
- Publication date May 20, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20210127500
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Devices in Package-on-Package Structures and Methods for Fo...
- Publication number 20210125923
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

Simultaneous circuit manufacturing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pre-connected analyte sensors

Vehicular camera system

Method of making a measurement probe

High speed communication jack

Stackable via package and method

High tolerance connection between elements

Pre-connected analyte sensors

Fabrication method of substrate having electrical interconnection s...

Light fixture with cover box and mounting box in sealable engagement

Smart cards with metal layer(s) and methods of manufacture

Stretchable conductors

Manufacturing method of package structure

Signal delivery in stacked device

Quick connection system for energy storage and photovoltaic equipment

Smartcards with multiple coupling frames

Micromechanical detection structure of a MEMS multi-axis gyroscope,...

Method for use in making a blister package lid

Method, system and device for manufacturing printed circuit board,...

Method for manufacturing a circuit having a lamination layer using...

Passive devices in package-on-package structures and methods for fo...

Interconnect structure having conductor extending along dielectric...

Vehicular camera system

Pre-connected analyte sensors

Stackable via package and method

Handheld device enclosure

Circuit board and semiconductor device including the same

High tolerance connection between elements

Method of manufacturing a lead for an active implantable medical de...

Wall pack light fixture having a cover box mounted to a mounting box

Reduced capacitance land pad

Patents Applicationslast 30 patents

High Speed Communication Jack

HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS

STACKABLE VIA PACKAGE AND METHOD

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

VEHICULAR CAMERA SYSTEM

VEHICULAR CAMERA SYSTEM

HANDHELD DEVICE ENCLOSURE

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS

WALL PACK LIGHT FIXTURE

SMARTCARDS WITH MULTIPLE COUPLING FRAMES

SIGNAL DELIVERY IN STACKED DEVICE

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

3DIC PACKAGE INTEGRATION FOR HIGH-FREQUENCY RF SYSTEM

Capacitive Compensation for Vertical Interconnect Accesses

METHOD OF ASSEMBLY OF ARTICLES AND INTERMEDIATE CREATED THEREBY

STACKABLE VIA PACKAGE AND METHOD

Method for Manufacturing a Circuit Having a Lamination Layer Using...

HANDHELD DEVICE ENCLOSURE

COSMETIC CO-REMOVAL OF MATERIAL FOR ELECTRONIC DEVICE SURFACES

WALL PACK LIGHT FIXTURE

ELECTRONIC MODULE

PHASED ARRAY STEERING FOR LASER BEAM POSITIONING SYSTEMS

STRETCHABLE CONDUCTORS

MANUFACTURING METHOD OF PACKAGE STRUCTURE

System Producing a Conductive Path on a Substrate

Electronic device and method for manufacturing the same

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

Passive Devices in Package-on-Package Structures and Methods for Fo...