Simultaneously mounting of different components

Industry

CPC
H05K13/0478

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0478Simultaneously mounting of different components

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Device for self-assembling semiconductor light-emitting diodes
- Patent number 12,159,800
- Issue date Dec 3, 2024
- LG Electronics Inc.
- Inbum Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer tool and method for transferring semiconductor chips
- Patent number 12,020,973
- Issue date Jun 25, 2024
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate chuck for self-assembling semiconductor light emitting di...
- Patent number 11,901,208
- Issue date Feb 13, 2024
- LG Electronics Inc.
- Inbum Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device, mounting device and control method
- Patent number 11,412,651
- Issue date Aug 9, 2022
- FUJI CORPORATION
- Hideya Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting line
- Patent number 11,240,949
- Issue date Feb 1, 2022
- FUJI CORPORATION
- Masahiro Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pickup head with touch down sensor
- Patent number 11,219,151
- Issue date Jan 4, 2022
- Facebook Technologies, LLC
- Pooya Saketi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding device and bonding method
- Patent number 10,903,105
- Issue date Jan 26, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting line
- Patent number 10,820,459
- Issue date Oct 27, 2020
- FUJI CORPORATION
- Masahiro Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 10,667,448
- Issue date May 26, 2020
- FUJI CORPORATION
- Yoshihiro Yasui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and devices for picking and placing workpieces into devices...
- Patent number 10,039,219
- Issue date Jul 31, 2018
- Western Digital Technologies, Inc.
- Jambunathan Vangal-Ramamurthy
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and method of batch assembly
- Patent number 9,918,420
- Issue date Mar 13, 2018
- IMEC Taiwan Co.
- Kevin Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for assembly of microelectronic devices
- Patent number 9,763,370
- Issue date Sep 12, 2017
- National Technology & Engineering Solutions of Sandia, LLC
- Murat Okandan
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Picker assembly
- Patent number 9,480,194
- Issue date Oct 25, 2016
- Samsung Electronics Co., Ltd.
- Jaeho Song
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Element pressing apparatus and heating system using element pressin...
- Patent number 8,875,977
- Issue date Nov 4, 2014
- Alpha Design Co., Ltd.
- Toshiyuki Shiratori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Part mounting method
- Patent number 8,769,810
- Issue date Jul 8, 2014
- Fujitsu Limited
- Toru Nishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting condition determination method
- Patent number 8,407,889
- Issue date Apr 2, 2013
- Panasonic Corporation
- Yasuhiro Maenishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Equipment for the simultaneous manipulation of several components
- Patent number 8,353,547
- Issue date Jan 15, 2013
- Gimatic S.p.A.
- Giuseppe Maffeis
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Component placement apparatus, component placement setting calculat...
- Patent number 8,340,803
- Issue date Dec 25, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Takafumi Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 8,201,329
- Issue date Jun 19, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Osamu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electronic component mounting
- Patent number 7,895,736
- Issue date Mar 1, 2011
- Panasonic Corporation
- Takashi Uchino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for assembling pins onto a circuit board background
- Patent number 7,735,217
- Issue date Jun 15, 2010
- MC Technology GmbH
- Joachim Borst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus with pivotable transfer mechanism
- Patent number 7,621,039
- Issue date Nov 24, 2009
- Samsung Techwin Co., Ltd.
- Tae-young Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for populating a circuit board with semiconductor chips
- Patent number 7,316,060
- Issue date Jan 8, 2008
- Legacy Electronics, Inc.
- Kenneth J. Kledzik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus having at least two image recording devices and its metho...
- Patent number 7,170,045
- Issue date Jan 30, 2007
- Assembleon N.V.
- Josephus M. M. van Gastel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a circuit board with a three dimensional sur...
- Patent number 7,103,970
- Issue date Sep 12, 2006
- Legacy Electronics, Inc.
- Kenneth J. Kledzik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method and component mounting apparatus
- Patent number 6,842,974
- Issue date Jan 18, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Maenishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for surface mounting electronic components on a printed circ...
- Patent number 6,802,118
- Issue date Oct 12, 2004
- Mirae Corporation
- Yun Hyung Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for mounting parts
- Patent number 6,681,468
- Issue date Jan 27, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quadruple pick and place head construction
- Patent number 6,464,069
- Issue date Oct 15, 2002
- Donald S. Rich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parts installation method and parts mounting method and mounter
- Patent number 6,466,837
- Issue date Oct 15, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Mimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT MOUNTING LINE
- Publication number 20210015012
- Publication date Jan 14, 2021
- FUJI CORPORATION
- Masahiro KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL DEVICE, MOUNTING DEVICE AND CONTROL METHOD
- Publication number 20190373783
- Publication date Dec 5, 2019
- FUJI CORPORATION
- Hideya KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICES FOR PICKING AND PLACING WORKPIECES INTO DEVICES...
- Publication number 20180338397
- Publication date Nov 22, 2018
- Western Digital Technologies, Inc.
- Jambunathan Vangal-Ramamurthy
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COMPONENT MOUNTING LINE
- Publication number 20180242485
- Publication date Aug 23, 2018
- FUJI MACHINE MFG. CO., LTD.
- Masahiro KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING METHOD
- Publication number 20180124962
- Publication date May 3, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- HIDEKI SUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLING APPARATUS FOR BACKLIGHT
- Publication number 20160330883
- Publication date Nov 10, 2016
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIEN-YU TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL CAMERA MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20150350502
- Publication date Dec 3, 2015
- Altek Corporation
- Shu-Yu LIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CRYSTALLINE MICROELECTRONIC DEVICES
- Publication number 20140259633
- Publication date Sep 18, 2014
- SANDIA CORPORATION
- Murat Okandan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT PRESSING APPARATUS AND HEATING SYSTEM USING ELEMENT PRESSIN...
- Publication number 20140263575
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method of Batch Assembly
- Publication number 20140241845
- Publication date Aug 28, 2014
- IMEC Taiwan CO.
- Kevin Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING APPARATUS, INFORMATION PROCESSING APPARATUS, INF...
- Publication number 20130110277
- Publication date May 2, 2013
- SONY CORPORATION
- Takao Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY AND METHOD FOR IC UNIT ENGAGEMENT
- Publication number 20120260752
- Publication date Oct 18, 2012
- ROKKO SYSTEMS PTE LTD
- Hae Choon Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EQUIPMENT FOR THE SIMULTANEOUS MANIPULATION OF SEVERAL COMPONENTS
- Publication number 20120200100
- Publication date Aug 9, 2012
- Giuseppe Maffeis
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100236053
- Publication date Sep 23, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Osamu NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...
- Publication number 20100229378
- Publication date Sep 16, 2010
- Matsushita Electric Industrial Co., Ltd.
- Takashi Uchino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PART MOUNTING APPARATUS AND METHOD
- Publication number 20100132187
- Publication date Jun 3, 2010
- Fujitsu Limited
- Toru Nishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Placement Apparatus, Component Placement Setting Calculat...
- Publication number 20100071201
- Publication date Mar 25, 2010
- Takafumi CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING CONDITION DETERMINATION METHOD
- Publication number 20090044401
- Publication date Feb 19, 2009
- Yasuhiro Maenishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for assembling pins onto a circuit board
- Publication number 20080000078
- Publication date Jan 3, 2008
- MC TECHNOLOGY GmbH
- Joachim Borst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for manufacturing semiconductor device
- Publication number 20070183184
- Publication date Aug 9, 2007
- Semiconductor Energy Laboratory Ltd.
- Osamu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for mounting components
- Publication number 20060182585
- Publication date Aug 17, 2006
- Samsung Techwin Co., Ltd.
- Tae-young Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting apparatus
- Publication number 20060021215
- Publication date Feb 2, 2006
- Hitachi High-Tech Instruments Co., Ltd.
- Yoshinori Kano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method suitable for placing at least one component in a desired pos...
- Publication number 20050173621
- Publication date Aug 11, 2005
- Assembleon N.V.
- Josephus M. M. Van Gastel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for fabricating a circuit board with a three d...
- Publication number 20040194301
- Publication date Oct 7, 2004
- Kenneth J. Kledzik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mounting device and the method thereof
- Publication number 20040128828
- Publication date Jul 8, 2004
- MIRAE CORPORATION
- Ji Hyun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for fabricating a circuit board with a three d...
- Publication number 20020162215
- Publication date Nov 7, 2002
- Kenneth J. Kledzik
- H01 - BASIC ELECTRIC ELEMENTS

Simultaneously mounting of different components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device for self-assembling semiconductor light-emitting diodes

Transfer tool and method for transferring semiconductor chips

Substrate chuck for self-assembling semiconductor light emitting di...

Control device, mounting device and control method

Component mounting line

Pickup head with touch down sensor

Flip chip bonding device and bonding method

Component mounting line

Electronic component mounting method

Method and devices for picking and placing workpieces into devices...

Apparatus and method of batch assembly

Apparatus for assembly of microelectronic devices

Picker assembly

Element pressing apparatus and heating system using element pressin...

Part mounting method

Component mounting condition determination method

Equipment for the simultaneous manipulation of several components

Component placement apparatus, component placement setting calculat...

Apparatus and method for manufacturing semiconductor device

Method and apparatus for electronic component mounting

Device for assembling pins onto a circuit board background

Component mounting apparatus with pivotable transfer mechanism

System for populating a circuit board with semiconductor chips

Apparatus having at least two image recording devices and its metho...

Method for fabricating a circuit board with a three dimensional sur...

Component mounting method and component mounting apparatus

Method for surface mounting electronic components on a printed circ...

Device and method for mounting parts

Quadruple pick and place head construction

Parts installation method and parts mounting method and mounter

Patents Applicationslast 30 patents

COMPONENT MOUNTING LINE

CONTROL DEVICE, MOUNTING DEVICE AND CONTROL METHOD

METHOD AND DEVICES FOR PICKING AND PLACING WORKPIECES INTO DEVICES...

COMPONENT MOUNTING LINE

COMPONENT MOUNTING METHOD

ASSEMBLING APPARATUS FOR BACKLIGHT

WAFER-LEVEL CAMERA MODULE AND MANUFACTURING METHOD THEREOF

PRINTED CRYSTALLINE MICROELECTRONIC DEVICES

ELEMENT PRESSING APPARATUS AND HEATING SYSTEM USING ELEMENT PRESSIN...

Apparatus and Method of Batch Assembly

COMPONENT MOUNTING APPARATUS, INFORMATION PROCESSING APPARATUS, INF...

ASSEMBLY AND METHOD FOR IC UNIT ENGAGEMENT

EQUIPMENT FOR THE SIMULTANEOUS MANIPULATION OF SEVERAL COMPONENTS

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...

PART MOUNTING APPARATUS AND METHOD

Component Placement Apparatus, Component Placement Setting Calculat...

COMPONENT MOUNTING CONDITION DETERMINATION METHOD

Device for assembling pins onto a circuit board

Apparatus and method for manufacturing semiconductor device

Method and apparatus for mounting components

Electronic component mounting apparatus

Method suitable for placing at least one component in a desired pos...

Method and apparatus for fabricating a circuit board with a three d...

Surface mounting device and the method thereof

Method and apparatus for fabricating a circuit board with a three d...