Single coating layer

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H01L2224/1357

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1357Single coating layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,308,355
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 12,288,758
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 12,218,091
- Issue date Feb 4, 2025
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,113,006
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,435
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,009,359
- Issue date Jun 11, 2024
- Murata Manufacturing Co., Ltd.
- Shinnosuke Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing the same
- Patent number 11,973,046
- Issue date Apr 30, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers and methods of fabricating the same in semico...
- Patent number 11,967,573
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a resin that seals a rewiring
- Patent number 11,894,325
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Manato Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,876,032
- Issue date Jan 16, 2024
- Murata Manufacturing Co., Ltd.
- Shinnosuke Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 11,855,015
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,842,997
- Issue date Dec 12, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226343
- Publication date Jul 10, 2025
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE
- Publication number 20250157898
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Venero SANTAMARIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...
- Publication number 20250132283
- Publication date Apr 24, 2025
- Brewer Science, Inc.
- Xin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250105208
- Publication date Mar 27, 2025
- UltraMemory Inc.
- Shigeru NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079416
- Publication date Mar 6, 2025
- PICO SEMICONDUCTOR INC.
- Yong Kuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250062238
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Bong Wee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038156
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-JA KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
- Publication number 20250015032
- Publication date Jan 9, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421112
- Publication date Dec 19, 2024
- Rohm Co., Ltd.
- Yuta KASHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20240413113
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404971
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240395688
- Publication date Nov 28, 2024
- MURATA MANUFACTURING CO., LTD.
- Takashi KAWANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387463
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379507
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240371742
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363572
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355779
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS

Single coating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and semiconductor module

Semiconductor package

Polyimide profile control

Semiconductor package and method of manufacturing semiconductor pac...

Superconducting bump bonds for quantum computing systems

Camera module, and photosensitive assembly and manufacturing method...

Semiconductor package with intermetallic-compound solder-joint comp...

Manufacturing method of an electronic apparatus

Semiconductor device

Light-emitting device and displayer

Semiconductor package

Semiconductor device with solder on pillar

Conductive terminal for side facing packages

Semiconductor package

Package structure and manufacturing method thereof

Chip package structure

Packaged semiconductor device with electroplated pillars

Semiconductor device

Chiplets with connection posts

Method of forming brass-coated metals in flip-chip redistribution l...

Semiconductor structure and method for preparing the same

Semiconductor device and method for manufacturing the same

Redistribution layers and methods of fabricating the same in semico...

Solderless interconnection structure and method of forming same

Process for thin film capacitor integration

Semiconductor device having a resin that seals a rewiring

Methods of manufacturing a semiconductor device including a joint a...

Semiconductor device

Polyimide profile control

Methods for pillar connection on frontside and passive device integ...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

PACKAGE WITH BACK-TO-BACK DIE STACKING

VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...

MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Coating of Nanowires

ELECTRONIC DEVICE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...