Single coating layer

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H01L2224/2957

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2957Single coating layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,087,721
- Issue date Sep 10, 2024
- Kyocera Corporation
- Tomonao Kikuchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light emitting diode
- Patent number 12,057,527
- Issue date Aug 6, 2024
- Au Optronics Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,862,598
- Issue date Jan 2, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 11,694,988
- Issue date Jul 4, 2023
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method and joined structure
- Patent number 11,450,643
- Issue date Sep 20, 2022
- Tohoku University
- Takehito Shimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,437,332
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for increasing semiconductor device wafer strength
- Patent number 10,998,231
- Issue date May 4, 2021
- NXP USA, INC.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assemblies with solder layer and exterior coating,...
- Patent number 10,903,186
- Issue date Jan 26, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package structure and bonding method thereof
- Patent number 10,756,050
- Issue date Aug 25, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 10,600,753
- Issue date Mar 24, 2020
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes with integrated reflector for a direct view d...
- Patent number 10,553,767
- Issue date Feb 4, 2020
- GLO AB
- Fariba Danesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 10,304,795
- Issue date May 28, 2019
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mechanical quantity measuring device, and sem...
- Patent number 10,247,630
- Issue date Apr 2, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of double patterning lithography process using plurality of...
- Patent number 10,170,306
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,170,445
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to mitigate soldering offset for wafer-level c...
- Patent number 10,131,540
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Chi Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anisotropic conductive material, electronic device including anisot...
- Patent number 9,831,211
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 9,741,677
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...
- Publication number 20240266470
- Publication date Aug 8, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Zhijun XIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240170441
- Publication date May 23, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055310
- Publication date Feb 15, 2024
- Huawei Technologies Co., Ltd
- Jürgen HÖGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONFINED GROWTH S/D CONTACT WITH SELECTIVE DEPOSI...
- Publication number 20230377998
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230307411
- Publication date Sep 28, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, D...
- Publication number 20230215851
- Publication date Jul 6, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhijun LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE
- Publication number 20220367758
- Publication date Nov 17, 2022
- AU OPTRONICS CORPORATION
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGE STRUCTURE
- Publication number 20220367392
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
- Publication number 20220310546
- Publication date Sep 29, 2022
- NAGASE CHEMTEX CORPORATION
- Daisuke MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
- Publication number 20220199569
- Publication date Jun 23, 2022
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220139851
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20210305195
- Publication date Sep 30, 2021
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
- Publication date Jan 21, 2021
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCREASING SEMICONDUCTOR DEVICE WAFER STRENGTH
- Publication number 20200395247
- Publication date Dec 17, 2020
- NXP USA, Inc.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20200135690
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...
- Publication number 20200126944
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND BONDING METHOD THEREOF
- Publication number 20200043890
- Publication date Feb 6, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT
- Publication number 20190088617
- Publication date Mar 21, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...
- Publication number 20180202883
- Publication date Jul 19, 2018
- Hitachi Automotive Systems, Ltd.
- Hanae SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Single coating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded assembly containing different size opposing bonding pads and...

Electronic device and method for manufacturing electronic device

Light emitting diode

Semiconductor module

Integration and bonding of micro-devices into system substrate

Semiconductor module

Semiconductor module

Semiconductor device

Display module and manufacturing method thereof

Anisotropic conductive film

Flip chip backside mechanical die grounding techniques

Chemical bonding method and joined structure

Package structure and method of manufacturing the same

Methods for bonding substrates

Method for increasing semiconductor device wafer strength

Power electronic assemblies with solder layer and exterior coating,...

Method for electrical coupling and electric coupling arrangement

Integration and bonding of micro-devices into system substrate

Package structure and bonding method thereof

Bond materials with enhanced plasma resistant characteristics and a...

Flip chip backside mechanical die grounding techniques

Light emitting diodes with integrated reflector for a direct view d...

Semiconductor device including antistatic die attach material

Semiconductor device, mechanical quantity measuring device, and sem...

Method of double patterning lithography process using plurality of...

Method for electrical coupling and electric coupling arrangement

Structure and method to mitigate soldering offset for wafer-level c...

Anisotropic conductive material, electronic device including anisot...

UV-curable anisotropic conductive adhesive

Semiconductor device including antistatic die attach material

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...

SEMICONDUCTOR MODULE

COMPONENT-EMBEDDED PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

METHOD OF FORMING CONFINED GROWTH S/D CONTACT WITH SELECTIVE DEPOSI...

SEMICONDUCTOR MODULE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, D...

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

LIGHT EMITTING DIODE

METHOD OF MANUFACTURING PACKAGE STRUCTURE

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...

CHEMICAL BONDING METHOD AND JOINED STRUCTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

METHOD FOR INCREASING SEMICONDUCTOR DEVICE WAFER STRENGTH

METHODS FOR BONDING SUBSTRATES

POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...

PACKAGE STRUCTURE AND BONDING METHOD THEREOF

METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...