Single layer compositions

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CPC
H05K3/4676

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4676Single layer compositions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Photosensitive resin composition, photosensitive resin film, printe...
- Patent number 12,103,999
- Issue date Oct 1, 2024
- Resonac Corporation
- Akihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triazole silane compound, method for synthesizing said compound and...
- Patent number 11,680,076
- Issue date Jun 20, 2023
- Shikoku Chemicals Corporation
- Takayuki Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board with heat dissipation function
- Patent number 11,553,602
- Issue date Jan 10, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yin-Ju Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Radio frequency filtering of printed wiring board direct current di...
- Patent number 11,452,202
- Issue date Sep 20, 2022
- Raytheon Company
- John W. Hauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer insulating film and method for producing same
- Patent number 11,432,400
- Issue date Aug 30, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Masaharu Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,039,533
- Issue date Jun 15, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 10,980,112
- Issue date Apr 13, 2021
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and switching regulator
- Patent number 10,952,326
- Issue date Mar 16, 2021
- Murata Manufacturing Co., Ltd.
- Akinori Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, display unit, and electronic apparatus
- Patent number 10,930,594
- Issue date Feb 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of calibrating a dispenser
- Patent number 10,926,287
- Issue date Feb 23, 2021
- Illinois Tool Works Inc.
- Scott A. Reid
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of insertion loss in printed circuit board signal traces
- Patent number 10,827,627
- Issue date Nov 3, 2020
- Intel Corporation
- Xiaoning Ye
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and switching regulator
- Patent number 10,694,622
- Issue date Jun 23, 2020
- Murata Manufacturing Co., Ltd.
- Akinori Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for printed circuit board, resin varnish using th...
- Patent number 10,626,288
- Issue date Apr 21, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji-Hye Shim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring board
- Patent number 10,602,622
- Issue date Mar 24, 2020
- KYOCERA Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a flexible circuit board incorporating sun...
- Patent number 10,531,578
- Issue date Jan 7, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable epoxy composition, film, laminated film, prepreg, laminate,...
- Patent number 10,501,620
- Issue date Dec 10, 2019
- Intel Corporation
- Makoto Fujimura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,470,297
- Issue date Nov 5, 2019
- Sumitomo Electric Printed Circuits, Inc.
- Aya Takasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing board
- Patent number 10,396,020
- Issue date Aug 27, 2019
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inorganic filler and epoxy resin composition including the same
- Patent number 10,231,332
- Issue date Mar 12, 2019
- LG Innotek Co., Ltd
- Sanga Ju
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin, curable resin composition, cured product, semiconducto...
- Patent number 10,113,028
- Issue date Oct 30, 2018
- DIC Corporation
- Yousuke Hirota
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of calibrating a dispenser
- Patent number 9,993,838
- Issue date Jun 12, 2018
- Illinois Tool Works Inc.
- Scott A. Reid
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible printed circuit board and method for manufacturing same
- Patent number 9,949,379
- Issue date Apr 17, 2018
- AMOGREENTECH CO., LTD.
- Jongsoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dry film and printed wiring board
- Patent number 9,822,226
- Issue date Nov 21, 2017
- TAIYO INK MFG. CO., LTD.
- Takayuki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of calibrating a dispenser
- Patent number 9,815,081
- Issue date Nov 14, 2017
- Illinois Tool Works Inc.
- Scott A. Reid
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat-curable composition, dry film, and printed wiring board
- Patent number 9,796,810
- Issue date Oct 24, 2017
- TAIYO INK MFG. CO., LTD.
- Takayuki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal circuit structure
- Patent number 9,683,292
- Issue date Jun 20, 2017
- Industrial Technology Research Institute
- Tune-Hune Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,538,642
- Issue date Jan 3, 2017
- Ibiden Co., Ltd.
- Kosuke Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical conductive unit and manufacturing method thereof
- Patent number 9,521,759
- Issue date Dec 13, 2016
- Microcosm Technology Co., Ltd.
- Tang-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20250113447
- Publication date Apr 3, 2025
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230284394
- Publication date Sep 7, 2023
- Nitto Denko Corporation
- Naoki SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
- Publication number 20220377913
- Publication date Nov 24, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- YIN-JU CHEN
- B82 - NANO-TECHNOLOGY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20220276558
- Publication date Sep 1, 2022
- Showa Denko Materials Co., Ltd.
- Kohei ABE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
RADIO FREQUENCY FILTERING OF PRINTED WIRING BOARD DIRECT CURRENT DI...
- Publication number 20220192009
- Publication date Jun 16, 2022
- Raytheon Company
- John W. Hauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTE...
- Publication number 20220169772
- Publication date Jun 2, 2022
- Showa Denko Materials Co., Ltd.
- Akihiro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND SWITCHING REGULATOR
- Publication number 20200260584
- Publication date Aug 13, 2020
- Murata Manufacturing Co., Ltd.
- Akinori HAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200205286
- Publication date Jun 25, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIR...
- Publication number 20200113050
- Publication date Apr 9, 2020
- Murata Manufacturing Co., Ltd.
- Takako SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRIAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND...
- Publication number 20200031852
- Publication date Jan 30, 2020
- SHIKOKU CHEMICALS CORPORATION
- Takayuki MURAI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
REDUCTION OF INSERTION LOSS IN PRINTED CIRCUIT BOARD SIGNAL TRACES
- Publication number 20190223299
- Publication date Jul 18, 2019
- Intel Corporation
- Xiaoning Ye
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20190132962
- Publication date May 2, 2019
- Kyocera Corporation
- Masaaki Harazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CALIBRATING A DISPENSER
- Publication number 20180290170
- Publication date Oct 11, 2018
- Illinois Tool Works Inc.
- Scott A. Reid
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF CALIBRATING A DISPENSER
- Publication number 20180036762
- Publication date Feb 8, 2018
- Illinois Tool Works Inc.
- Scott A. Reid
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METAL CIRCUIT STRUCTURE
- Publication number 20170029953
- Publication date Feb 2, 2017
- Industrial Technology Research Institute
- Tune-Hune KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150022984
- Publication date Jan 22, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Hyungmi JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, BUILD-UP FILM, PREPREG...
- Publication number 20140367149
- Publication date Dec 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jun Young Kim
- B32 - LAYERED PRODUCTS
Information Patent Application
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING...
- Publication number 20140367147
- Publication date Dec 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPRO...
- Publication number 20140353004
- Publication date Dec 4, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Chul Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140353021
- Publication date Dec 4, 2014
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CONDUCTIVE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20140338963
- Publication date Nov 20, 2014
- MICROCOSM TECHNOLOGY CO., LTD.
- TANG-CHIEH HUANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SURFACE-MODIFIED INORGANIC FILLER, METHOD OF PREPARING THE SAME, BU...
- Publication number 20140290994
- Publication date Oct 2, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SYSTEMS AND METHODS FOR RESISTIVE MICROCRACKED PRESSURE SENSOR
- Publication number 20140290390
- Publication date Oct 2, 2014
- Arizona Board of Regents, a Body Corporate of the State of Arizona, Action fo...
- Oliver Graudejus
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140251656
- Publication date Sep 11, 2014
- IBIDEN CO., LTD.
- Kosuke IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION FOR INSULATING FILM, INSULATING FILM, AND P...
- Publication number 20140182908
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hye Shim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN COMPOSITION WITH GOOD WORKABILITY, INSULATING FILM, AND PREPREG
- Publication number 20140187679
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Jik Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL C...
- Publication number 20140174792
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jang Bae Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PR...
- Publication number 20140151091
- Publication date Jun 5, 2014
- Daisuke FUJIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPR...
- Publication number 20140147639
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...
- Publication number 20140090767
- Publication date Apr 3, 2014
- Sankar Paul
- B32 - LAYERED PRODUCTS

Single layer compositions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photosensitive resin composition, photosensitive resin film, printe...

Triazole silane compound, method for synthesizing said compound and...

Method for manufacturing circuit board with heat dissipation function

Radio frequency filtering of printed wiring board direct current di...

Wiring board and method of manufacturing the same

Interlayer insulating film and method for producing same

Printed wiring board and method for manufacturing printed wiring board

Wiring board and method of manufacturing the same

Multilayer wiring board

Printed wiring board and switching regulator

Multilayer wiring substrate, display unit, and electronic apparatus

Method of calibrating a dispenser

Reduction of insertion loss in printed circuit board signal traces

Printed wiring board and switching regulator

Resin composition for printed circuit board, resin varnish using th...

Wiring board

Method for manufacturing a flexible circuit board incorporating sun...

Curable epoxy composition, film, laminated film, prepreg, laminate,...

Printed circuit board and electronic component

Method of manufacturing board

Inorganic filler and epoxy resin composition including the same

Epoxy resin, curable resin composition, cured product, semiconducto...

Method of calibrating a dispenser

Flexible printed circuit board and method for manufacturing same

Dry film and printed wiring board

Method of calibrating a dispenser

Heat-curable composition, dry film, and printed wiring board

Metal circuit structure

Wiring board and method for manufacturing the same

Vertical conductive unit and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

RADIO FREQUENCY FILTERING OF PRINTED WIRING BOARD DIRECT CURRENT DI...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTE...

PRINTED WIRING BOARD AND SWITCHING REGULATOR

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIR...

TRIAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND...

REDUCTION OF INSERTION LOSS IN PRINTED CIRCUIT BOARD SIGNAL TRACES

WIRING BOARD

METHOD OF CALIBRATING A DISPENSER

METHOD OF CALIBRATING A DISPENSER

METAL CIRCUIT STRUCTURE

EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, BUILD-UP FILM, PREPREG...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING...

INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPRO...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

VERTICAL CONDUCTIVE UNIT AND MANUFACTURING METHOD THEREOF

SURFACE-MODIFIED INORGANIC FILLER, METHOD OF PREPARING THE SAME, BU...

SYSTEMS AND METHODS FOR RESISTIVE MICROCRACKED PRESSURE SENSOR

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

EPOXY RESIN COMPOSITION FOR INSULATING FILM, INSULATING FILM, AND P...

RESIN COMPOSITION WITH GOOD WORKABILITY, INSULATING FILM, AND PREPREG

INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL C...

PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PR...

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPR...

DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...