Single or multiple openings in a shielding, ground or power plane

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CPC
H05K1/0225

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0225Single or multiple openings in a shielding, ground or power plane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic interference shields having attentuation interfaces
- Patent number 12,133,322
- Issue date Oct 29, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for reducing power noise and electronic devic...
- Patent number 12,108,523
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Kwangmo Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Waveguide launch system for coupling to a waveguide channel through...
- Patent number 12,087,990
- Issue date Sep 10, 2024
- Saab AB
- Sten Gunnarsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for reducing an eddy current in a ground plane of a core...
- Patent number 12,078,662
- Issue date Sep 3, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Yannick Vuillermet
- G01 - MEASURING TESTING
Information Patent Grant
Printed flexible wiring apparatus in a cryostat
- Patent number 12,016,138
- Issue date Jun 18, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including connector
- Patent number 11,955,706
- Issue date Apr 9, 2024
- LG Electronics Inc.
- Seungwoo Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipolar connector set including multiple connectors mounted to s...
- Patent number 11,916,323
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Yoshiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,889,616
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Masatoshi Toyonaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate
- Patent number 11,844,174
- Issue date Dec 12, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shinkuro Fujino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic apparatus
- Patent number 11,792,917
- Issue date Oct 17, 2023
- Canon Kabushiki Kaisha
- Takuya Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards with meshed conductive structures
- Patent number 11,765,822
- Issue date Sep 19, 2023
- MARVELL ASIA PTE. LTD.
- Shaowu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB RF noise grounding for shielded high-speed interface cable
- Patent number 11,737,207
- Issue date Aug 22, 2023
- Marvell Asia Pte, Ltd.
- Shaowu Huang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for shielding a printed circuit board from electromagnetic i...
- Patent number 11,729,899
- Issue date Aug 15, 2023
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pattern-edged metal-plane resonance-suppression
- Patent number 11,729,900
- Issue date Aug 15, 2023
- Intel Corporation
- Stephen Harvey Hall
- G05 - CONTROLLING REGULATING
Information Patent Grant
Electronic device and circuit board thereof
- Patent number 11,723,144
- Issue date Aug 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Ming-Fan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory system
- Patent number 11,705,444
- Issue date Jul 18, 2023
- Kioxia Corporation
- Hayato Masubuchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Systems for shielding bent signal lines
- Patent number 11,696,390
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slitted PCB for omni-directional like performance of off-center mou...
- Patent number 11,627,656
- Issue date Apr 11, 2023
- DENSO International America, Inc.
- Osman Ahmed
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board device
- Patent number 11,570,886
- Issue date Jan 31, 2023
- Global Unichip Corporation
- Yu-Ju Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 11,558,955
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,553,589
- Issue date Jan 10, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic device
- Patent number 11,553,586
- Issue date Jan 10, 2023
- Canon Kabushiki Kaisha
- Toshiyuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency filtering of printed wiring board direct current di...
- Patent number 11,452,202
- Issue date Sep 20, 2022
- Raytheon Company
- John W. Hauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device including the same
- Patent number 11,439,009
- Issue date Sep 6, 2022
- Samsung Electronics Co., Ltd.
- Sungwon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,375,606
- Issue date Jun 28, 2022
- Sony Interactive Entertainment Inc.
- Tetsufumi Nozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CARRIER STRUCTURE
- Publication number 20240407079
- Publication date Dec 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chien-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
- Publication number 20240324094
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240260172
- Publication date Aug 1, 2024
- Honor Device Co., Ltd.
- Puwei BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...
- Publication number 20240090122
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- G01 - MEASURING TESTING
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD GROUND PLANE OPTIMIZATION FOR CORELESS CURREN...
- Publication number 20230417802
- Publication date Dec 28, 2023
- ALLEGRO MICROSYSTEMS, LLC
- Yannick Vuillermet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED FLEXIBLE WIRING APPARATUS IN A CRYOSTAT
- Publication number 20230403803
- Publication date Dec 14, 2023
- Equal 1 Laboratories Ireland Limited
- Hans HAENLEIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230403785
- Publication date Dec 14, 2023
- Mitsubishi Electric Corporation
- Masatoshi TOYONAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY MODULE AND DISPLAY DEVICE
- Publication number 20230371171
- Publication date Nov 16, 2023
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Yuanye Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230328877
- Publication date Oct 12, 2023
- MURATA MANUFACTURING CO., LTD.
- Yukiya YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20230307433
- Publication date Sep 28, 2023
- Kioxia Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
Printed Circuit Board, Backplane Architecture System, and Communica...
- Publication number 20230269862
- Publication date Aug 24, 2023
- Huawei Technologies Co., Ltd
- Wenliang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUND DISCONTINUITIES FOR THERMAL ISOLATION
- Publication number 20230199936
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD
- Publication number 20230189431
- Publication date Jun 15, 2023
- LG Innotek Co., Ltd.
- Won Suk JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE CONDUCTIVE SHIELD INCLUDING DISCONTINUITIES TO REDUCE DEVICE...
- Publication number 20230180380
- Publication date Jun 8, 2023
- Qorvo US, Inc.
- Loizos Loizou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...
- Publication number 20230084535
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Kwangmo YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...
- Publication number 20230082556
- Publication date Mar 16, 2023
- Canon Kabushiki Kaisha
- Masayoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20220361320
- Publication date Nov 10, 2022
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE
- Publication number 20220322521
- Publication date Oct 6, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Shinkuro FUJINO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20220304144
- Publication date Sep 22, 2022
- Canon Kabushiki Kaisha
- Takuya Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION
- Publication number 20220304143
- Publication date Sep 22, 2022
- Intel Corporation
- Stephen Harvey Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND CIRCUIT BOARD THEREOF
- Publication number 20220225493
- Publication date Jul 14, 2022
- Siliconware Precision Industries Co., Ltd.
- Ming-Fan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLITTED PCB FOR OMNI-DIRECTIONAL LIKE PERFORMANCE OF OFF-CENTER MOU...
- Publication number 20220192008
- Publication date Jun 16, 2022
- DENSO International America, Inc.
- Osman AHMED
- B60 - VEHICLES IN GENERAL
Information Patent Application
RADIO FREQUENCY FILTERING OF PRINTED WIRING BOARD DIRECT CURRENT DI...
- Publication number 20220192009
- Publication date Jun 16, 2022
- Raytheon Company
- John W. Hauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION METHOD OF CHIP PACKAGE
- Publication number 20220189884
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING CONNECTOR
- Publication number 20220181775
- Publication date Jun 9, 2022
- LG ELECTRONICS INC.
- Seungwoo RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND DISCONTINUITIES FOR THERMAL ISOLATION
- Publication number 20220159822
- Publication date May 19, 2022
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220151058
- Publication date May 12, 2022
- SAMSUNG DISPLAY CO., LTD.
- Yeon Sun NA
- H01 - BASIC ELECTRIC ELEMENTS

Single or multiple openings in a shielding, ground or power plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electromagnetic interference shields having attentuation interfaces

Printed circuit board for reducing power noise and electronic devic...

Semiconductor memory system

Waveguide launch system for coupling to a waveguide channel through...

Techniques for reducing an eddy current in a ground plane of a core...

Printed flexible wiring apparatus in a cryostat

Printed circuit board and display device including the same

Electronic device including connector

Multipolar connector set including multiple connectors mounted to s...

Circuit board

Electronic substrate

Backplane footprint for high speed, high density electrical connectors

Electronic module and electronic apparatus

Printed circuit boards with meshed conductive structures

Backplane footprint for high speed, high density electrical connectors

PCB RF noise grounding for shielded high-speed interface cable

Method for shielding a printed circuit board from electromagnetic i...

Pattern-edged metal-plane resonance-suppression

Electronic device and circuit board thereof

Semiconductor memory system

Systems for shielding bent signal lines

Slitted PCB for omni-directional like performance of off-center mou...

Circuit board device

Ground discontinuities for thermal isolation

Backplane footprint for high speed, high density electrical connectors

Wiring substrate and electronic device

Radio frequency filtering of printed wiring board direct current di...

Printed circuit board and electronic device including the same

Wiring board and method of manufacturing the same

Electronic apparatus

Patents Applicationslast 30 patents

CARRIER STRUCTURE

SEMICONDUCTOR MEMORY SYSTEM

REDUCED BALL GRID ARRAY PAD CAPACITANCE

PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME

CIRCUIT BOARD AND ELECTRONIC DEVICE

METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

PRINTED CIRCUIT BOARD GROUND PLANE OPTIMIZATION FOR CORELESS CURREN...

PRINTED FLEXIBLE WIRING APPARATUS IN A CRYOSTAT

CIRCUIT BOARD

DISPLAY MODULE AND DISPLAY DEVICE

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

SEMICONDUCTOR MEMORY SYSTEM

Printed Circuit Board, Backplane Architecture System, and Communica...

GROUND DISCONTINUITIES FOR THERMAL ISOLATION

CIRCUIT BOARD

MODULE CONDUCTIVE SHIELD INCLUDING DISCONTINUITIES TO REDUCE DEVICE...

PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVIC...

DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

ELECTRONIC SUBSTRATE

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION

ELECTRONIC DEVICE AND CIRCUIT BOARD THEREOF

SLITTED PCB FOR OMNI-DIRECTIONAL LIKE PERFORMANCE OF OFF-CENTER MOU...

RADIO FREQUENCY FILTERING OF PRINTED WIRING BOARD DIRECT CURRENT DI...

FORMATION METHOD OF CHIP PACKAGE

ELECTRONIC DEVICE INCLUDING CONNECTOR

GROUND DISCONTINUITIES FOR THERMAL ISOLATION

PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME