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CPC
H05K2201/0266

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0266Size distribution

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 12,219,704
- Issue date Feb 4, 2025
- Ibiden Co., Ltd.
- Naoki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ink composition, method for forming a conductive member, and conduc...
- Patent number 12,091,567
- Issue date Sep 17, 2024
- Kuprion Inc.
- Zhenggang Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Organic insulating body, metal-clad laminate, and wiring board
- Patent number 11,879,049
- Issue date Jan 23, 2024
- Kyocera Corporation
- Satoshi Kajita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-clad laminate and printed wiring board
- Patent number 11,638,349
- Issue date Apr 25, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Dai Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ink composition, method for forming a conductive member, and conduc...
- Patent number 11,274,224
- Issue date Mar 15, 2022
- Kuprion Inc.
- Zhenggang Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display apparatus and electronic device
- Patent number 11,226,522
- Issue date Jan 18, 2022
- Samsung Display Co., Ltd.
- Sukho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Melt processable thermoplastic composite comprising a multimodal di...
- Patent number 11,198,263
- Issue date Dec 14, 2021
- ROGERS CORPORATION
- Stephen O'Connor
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin composition, prepreg, metallic foil-clad laminate, and printe...
- Patent number 11,161,979
- Issue date Nov 2, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kentaro Nomizu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board, electronic circuit device, and production method of...
- Patent number 10,932,373
- Issue date Feb 23, 2021
- Stanley Electric Co., Ltd.
- Akihiko Hanya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation circuit board
- Patent number 10,893,601
- Issue date Jan 12, 2021
- Mitsubishi Materials Corporation
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-base printed circuit board
- Patent number 10,681,808
- Issue date Jun 9, 2020
- Waseda University
- Yoshimichi Ohki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and electronic device
- Patent number 10,488,720
- Issue date Nov 26, 2019
- Samsung Display Co., Ltd.
- Sukho Choi
- G02 - OPTICS
Information Patent Grant
Biodegradable materials for multilayer transient printed circuit bo...
- Patent number 10,292,263
- Issue date May 14, 2019
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for forming vias on printed circuit boards
- Patent number 9,999,137
- Issue date Jun 12, 2018
- Intrinsiq Materials, Inc.
- David Ciufo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste, method for forming wiring, electronic component,...
- Patent number 9,941,420
- Issue date Apr 10, 2018
- MATERIAL CONCEPT, INC.
- Junichi Koike
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Laser activatable polymer composition
- Patent number 9,896,566
- Issue date Feb 20, 2018
- Ticona LLC
- Paul C. Yung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and mounting structure using same
- Patent number 9,877,387
- Issue date Jan 23, 2018
- KYOCERA Corporation
- Satoshi Kajita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device including same
- Patent number 9,820,379
- Issue date Nov 14, 2017
- KYOCERA Corporation
- Kiyotaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver powder
- Patent number 9,796,018
- Issue date Oct 24, 2017
- Sumitomo Metal Mining Co., Ltd.
- Toshiaki Terao
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Thermosetting resin composition, prepreg, laminate, metal foil-clad...
- Patent number 9,718,941
- Issue date Aug 1, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nano-copper solder for filling thermal vias
- Patent number 9,565,748
- Issue date Feb 7, 2017
- Flextronics AP, LLC
- Michael James Glickman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-base printed circuit board
- Patent number 9,554,464
- Issue date Jan 24, 2017
- Waseda University
- Yoshimichi Ohki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 9,538,645
- Issue date Jan 3, 2017
- EPCOS AG
- Hisashi Kobuke
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,526,168
- Issue date Dec 20, 2016
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and communication apparatus as well as manufacturing method...
- Patent number 9,520,644
- Issue date Dec 13, 2016
- Shuhou Co., Ltd.
- Kouji Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersion for the metallization of contactings
- Patent number 9,324,474
- Issue date Apr 26, 2016
- Robert Bosch GmbH
- Heribert Weber
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive inks obtained by combining AQCs and metal nanoparticles
- Patent number 9,315,687
- Issue date Apr 19, 2016
- Universidade de Santiago de Compostela
- Manuel Arturo Lopez Quintela
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of soldering electronic part
- Patent number 9,301,403
- Issue date Mar 29, 2016
- Fuji Electric Co., Ltd.
- Mitsuo Yamashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE
- Publication number 20250056729
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240407088
- Publication date Dec 5, 2024
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240324103
- Publication date Sep 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...
- Publication number 20240314927
- Publication date Sep 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240237203
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240114619
- Publication date Apr 4, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230180386
- Publication date Jun 8, 2023
- IBIDEN CO., LTD.
- Naoki MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20220353988
- Publication date Nov 3, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Dai SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20210243893
- Publication date Aug 5, 2021
- YAZAKI CORPORATION
- Yukito AOYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT DISSIPATION CIRCUIT BOARD
- Publication number 20200236774
- Publication date Jul 23, 2020
- MITSUBISHI MATERIALS CORPORATION
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS AND ELECTRONIC DEVICE
- Publication number 20200050043
- Publication date Feb 13, 2020
- SAMSUNG DISPLAY CO., LTD.
- Sukho CHOI
- G02 - OPTICS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180213644
- Publication date Jul 26, 2018
- IBIDEN CO., LTD.
- Hiroyasu NOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20170352636
- Publication date Dec 7, 2017
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer Wiring Substrate
- Publication number 20160088729
- Publication date Mar 24, 2016
- EPCOS AG
- Hisashi KOBUKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150342039
- Publication date Nov 26, 2015
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPRO...
- Publication number 20140353004
- Publication date Dec 4, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Chul Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA AND COMMUNICATION APPARATUS AS WELL AS MANUFACTURING METHOD...
- Publication number 20140333484
- Publication date Nov 13, 2014
- SHUHOU CO., LTD.
- Kouji Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE
- Publication number 20140287158
- Publication date Sep 25, 2014
- Intrinsiq Materials, Inc.
- Janet Heyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE PROVIDED WITH SAME
- Publication number 20140268589
- Publication date Sep 18, 2014
- Kyocera Corporation
- Kiyotaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME
- Publication number 20140134350
- Publication date May 15, 2014
- Lockheed Martin Corporation
- Alfred A. Zinn
- B82 - NANO-TECHNOLOGY
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140116769
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD...
- Publication number 20140087614
- Publication date Mar 27, 2014
- PANASONIC CORPORATION
- Takashi Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOA...
- Publication number 20140020938
- Publication date Jan 23, 2014
- FUJIFILM CORPORATION
- Hiroshi MATAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL INSULATING FILM AND PRINTED WIRING BOARD PROVIDED WITH INSULA...
- Publication number 20130333931
- Publication date Dec 19, 2013
- Kaneka Corporation
- Yoshihide Sekito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE THEREOF
- Publication number 20130153279
- Publication date Jun 20, 2013
- KYOCERA CORPORATION
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...
- Publication number 20130105980
- Publication date May 2, 2013
- Hitachi, Ltd
- Yusuke Yasuda
- B82 - NANO-TECHNOLOGY
Information Patent Application
Wire Substrate Structure
- Publication number 20130043067
- Publication date Feb 21, 2013
- Kyocera Corporation
- Katsura HAYASHI
- B82 - NANO-TECHNOLOGY

Size distribution

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate

Method for manufacturing dielectric sheet, method for manufacturing...

Electronic device

Ink composition, method for forming a conductive member, and conduc...

Organic insulating body, metal-clad laminate, and wiring board

Metal-clad laminate and printed wiring board

Ink composition, method for forming a conductive member, and conduc...

Display apparatus and electronic device

Melt processable thermoplastic composite comprising a multimodal di...

Resin composition, prepreg, metallic foil-clad laminate, and printe...

Circuit board, electronic circuit device, and production method of...

Heat dissipation circuit board

Metal-base printed circuit board

Display apparatus and electronic device

Biodegradable materials for multilayer transient printed circuit bo...

Method for forming vias on printed circuit boards

Conductive paste, method for forming wiring, electronic component,...

Laser activatable polymer composition

Wiring board and mounting structure using same

Circuit board and electronic device including same

Silver powder

Thermosetting resin composition, prepreg, laminate, metal foil-clad...

Nano-copper solder for filling thermal vias

Metal-base printed circuit board

Multilayer wiring substrate

Printed wiring board and method for manufacturing the same

Antenna and communication apparatus as well as manufacturing method...

Dispersion for the metallization of contactings

Conductive inks obtained by combining AQCs and metal nanoparticles

Method of soldering electronic part

Patents Applicationslast 30 patents

SUBSTRATE

PRINTED WIRING BOARD

WIRING BOARD

WIRING SUBSTRATE

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

WIRING SUBSTRATE

SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...

WIRING SUBSTRATE

ELECTRONIC DEVICE

WIRING SUBSTRATE

METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

HEAT DISSIPATION CIRCUIT BOARD

DISPLAY APPARATUS AND ELECTRONIC DEVICE

PRINTED WIRING BOARD

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

Multilayer Wiring Substrate

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPRO...

ANTENNA AND COMMUNICATION APPARATUS AS WELL AS MANUFACTURING METHOD...

PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE

CIRCUIT BOARD AND ELECTRONIC DEVICE PROVIDED WITH SAME

METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD...

METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOA...

NOVEL INSULATING FILM AND PRINTED WIRING BOARD PROVIDED WITH INSULA...

WIRING BOARD AND MOUNTING STRUCTURE THEREOF

SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...

Wire Substrate Structure