Snap-on arrangements

Industry

CPC
H01L23/4093

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4093Snap-on arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Desktop electronic device
- Patent number 12,050,494
- Issue date Jul 30, 2024
- Apple Inc.
- Brett W. Degner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer housing
- Patent number 12,045,099
- Issue date Jul 23, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structural and thermal management of an integrated circuit
- Patent number 12,046,534
- Issue date Jul 23, 2024
- Apple Inc.
- Simon J. Trivett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,955,412
- Issue date Apr 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,948,870
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer housing
- Patent number 11,899,509
- Issue date Feb 13, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer housing
- Patent number 11,899,511
- Issue date Feb 13, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power conversion device having a clip to fix a plurality of switches
- Patent number 11,856,738
- Issue date Dec 26, 2023
- LG Innotek Co., Ltd
- Shin Young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly and pick-up cap
- Patent number 11,830,780
- Issue date Nov 28, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 11,784,434
- Issue date Oct 10, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method of manufacturing the same
- Patent number 11,778,727
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with clip and connector above electronic components
- Patent number 11,756,859
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics unit having at least one semiconductor module att...
- Patent number 11,744,052
- Issue date Aug 29, 2023
- Schaeffler Technologies AG & Co. KG
- Gregor Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Welding-type power supplies with expandable thermal interfaces
- Patent number 11,729,955
- Issue date Aug 15, 2023
- Illinois Tool Works Inc.
- Alan Adam Manthe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 11,672,087
- Issue date Jun 6, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Desktop electronic device
- Patent number 11,650,634
- Issue date May 16, 2023
- Apple Inc.
- Brett W. Degner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal interface for plurality of discrete electronic devices
- Patent number 11,647,611
- Issue date May 9, 2023
- DANA TM4 INC.
- Jean-Philippe Dextraze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backing plate with manufactured features on top surface
- Patent number 11,621,212
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with expanded heat spreader
- Patent number 11,600,547
- Issue date Mar 7, 2023
- Infineon Technologies Austria AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for heater element, method for mounting heater e...
- Patent number 11,574,852
- Issue date Feb 7, 2023
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism combining fastener captivation and assembly tilt control...
- Patent number 11,557,529
- Issue date Jan 17, 2023
- Intel Corporation
- Thomas Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor heat dissipation module and assembly method thereof
- Patent number 11,482,469
- Issue date Oct 25, 2022
- Lite-On Electronics (Guangzhou) Limited
- Cheng-Chung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 11,469,163
- Issue date Oct 11, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices packaged on wing boards
- Patent number 11,452,208
- Issue date Sep 20, 2022
- Hewlett Packard Enterprise Development LP
- Kevin Leigh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Locking push pin and heatsink assembly
- Patent number 11,415,160
- Issue date Aug 16, 2022
- Radian Thermal Products, Inc.
- Thierry Sin Yan Too
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device for electronic component
- Patent number 11,393,739
- Issue date Jul 19, 2022
- Denso Corporation
- Toshiyuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable debris-free socket loading mechanism
- Patent number 11,387,163
- Issue date Jul 12, 2022
- Intel Corporation
- Andrew Larson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly having floating heat sink in resilien...
- Patent number 11,322,871
- Issue date May 3, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Chun-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for detaching a microprocessor from a heat sink
- Patent number 11,296,009
- Issue date Apr 5, 2022
- Intel Corporation
- Rolf Laido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DESKTOP ELECTRONIC DEVICE
- Publication number 20240345635
- Publication date Oct 17, 2024
- Apple Inc.
- Brett W. DEGNER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMM COOLING ASSEMBLIES
- Publication number 20240260233
- Publication date Aug 1, 2024
- Intel Corporation
- Ming Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Spring finger ring laser welded on a die cast part serving as an ai...
- Publication number 20240222220
- Publication date Jul 4, 2024
- Plume Design, Inc.
- Ming-Tsung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203846
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203845
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER HOUSING
- Publication number 20240143043
- Publication date May 2, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR S...
- Publication number 20240087981
- Publication date Mar 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Walter Apfelbacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME
- Publication number 20240087982
- Publication date Mar 14, 2024
- SK HYNIX INC.
- Nam Hyeon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER HOUSING
- Publication number 20240053804
- Publication date Feb 15, 2024
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230363080
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230307315
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Kazuyuki MATSUZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURAL AND THERMAL MANAGEMENT OF AN INTEGRATED CIRCUIT
- Publication number 20230282544
- Publication date Sep 7, 2023
- Apple Inc.
- Simon J. TRIVETT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESKTOP ELECTRONIC DEVICE
- Publication number 20230251694
- Publication date Aug 10, 2023
- Apple Inc.
- Brett W. DEGNER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package with Blind Hole Attachment to Heat Sink
- Publication number 20230125452
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER HOUSING
- Publication number 20230089080
- Publication date Mar 23, 2023
- Apple Inc.
- Eugene A. Whang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230066017
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230027076
- Publication date Jan 26, 2023
- Intel Corporation
- Andres Ramirez Macias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230014476
- Publication date Jan 19, 2023
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415766
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20220415767
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
- Publication number 20220359342
- Publication date Nov 10, 2022
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Markus Lasch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESKTOP ELECTRONIC DEVICE
- Publication number 20220155830
- Publication date May 19, 2022
- Apple Inc.
- Brett W. DEGNER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220159853
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...
- Publication number 20210327784
- Publication date Oct 21, 2021
- Fuji Electric Co., Ltd.
- Shun FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP AND CONNECTOR ABOVE ELECTRONIC COMPONENTS
- Publication number 20210305126
- Publication date Sep 30, 2021
- INFINEON TECHNOLOGIES AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR HEAT DISSIPATION MODULE AND ASSEMBLY METHOD THEREOF
- Publication number 20210272876
- Publication date Sep 2, 2021
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Cheng-Chung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR A MEMORY MODULE
- Publication number 20210259135
- Publication date Aug 19, 2021
- SK HYNIX INC.
- Myoung Seo KIM
- G11 - INFORMATION STORAGE
Information Patent Application
CONNECTOR
- Publication number 20210227711
- Publication date Jul 22, 2021
- Japan Aviation Electronics Industry, Limited
- Tomohiro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Snap-on arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Desktop electronic device

Computer housing

Structural and thermal management of an integrated circuit

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Computer housing

Computer housing

Power conversion device having a clip to fix a plurality of switches

Electrical connector assembly and pick-up cap

Connector assembly with movable heat sink

Semiconductor package assembly and method of manufacturing the same

Package with clip and connector above electronic components

Power electronics unit having at least one semiconductor module att...

Welding-type power supplies with expandable thermal interfaces

Semiconductor package

Desktop electronic device

Thermal interface for plurality of discrete electronic devices

Backing plate with manufactured features on top surface

Semiconductor package with expanded heat spreader

Mounting structure for heater element, method for mounting heater e...

Mechanism combining fastener captivation and assembly tilt control...

Transistor heat dissipation module and assembly method thereof

Low stress asymmetric dual side module

Electronic devices packaged on wing boards

Locking push pin and heatsink assembly

Heat dissipation device for electronic component

Scalable debris-free socket loading mechanism

Electrical connector assembly having floating heat sink in resilien...

Method and apparatus for detaching a microprocessor from a heat sink

Server microprocessor carrier with guiding alignment anti-tilt and...

Patents Applicationslast 30 patents

DESKTOP ELECTRONIC DEVICE

LIQUID METAL CONNECTION DEVICE AND METHOD

DIMM COOLING ASSEMBLIES

Spring finger ring laser welded on a die cast part serving as an ai...

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

COMPUTER HOUSING

HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR S...

SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME

COMPUTER HOUSING

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC APPARATUS

STRUCTURAL AND THERMAL MANAGEMENT OF AN INTEGRATED CIRCUIT

DESKTOP ELECTRONIC DEVICE

Semiconductor Package with Blind Hole Attachment to Heat Sink

COMPUTER HOUSING

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

LOW STRESS ASYMMETRIC DUAL SIDE MODULE

SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

DESKTOP ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...

PACKAGE WITH CLIP AND CONNECTOR ABOVE ELECTRONIC COMPONENTS

TRANSISTOR HEAT DISSIPATION MODULE AND ASSEMBLY METHOD THEREOF

HEAT SPREADER FOR A MEMORY MODULE

CONNECTOR