Sockets

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CPC
H05K2201/10325

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10325Sockets

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Assembly structure
- Patent number 12,232,288
- Issue date Feb 18, 2025
- Delta Electronics, Inc.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit system and method of manufacturing a printed circuit board
- Patent number 12,225,665
- Issue date Feb 11, 2025
- NVIDIA Corp.
- MingYi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection structure and electronic device including the...
- Patent number 12,185,466
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Gidae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable interface cable structure for high voltage under-module p...
- Patent number 12,183,999
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board interconnection device and circuit board assembly
- Patent number 12,127,344
- Issue date Oct 22, 2024
- BorgWarner Inc.
- Sisay Tadele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Linear actuator
- Patent number 11,973,392
- Issue date Apr 30, 2024
- J-STAR MOTOR INDUSTRIAL CO., LTD.
- Wei-Fan Wu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket load regulation utilizing CPU carriers with shim components
- Patent number 11,818,832
- Issue date Nov 14, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power delivery packaging structure
- Patent number 11,799,374
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Xin Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Expansion card with mezzanine level connector
- Patent number 11,778,743
- Issue date Oct 3, 2023
- Xilinx, Inc.
- Ieuan James Mackereth Marshall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronic assembly with an electrically conductive sleeve an...
- Patent number 11,705,650
- Issue date Jul 18, 2023
- Semikron Elektronik GmbH & Co. KG
- Jörg Ammon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device with detachable capacitor connection structure
- Patent number 11,652,310
- Issue date May 16, 2023
- SK Hynix Inc.
- Xiaofang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,626,673
- Issue date Apr 11, 2023
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies including heat dispersing elements and related systems a...
- Patent number 11,617,284
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Xiaopeng Qu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multipoint contact conduction cooling of a removable device
- Patent number 11,579,668
- Issue date Feb 14, 2023
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronics of an electric motor of a motor vehicle
- Patent number 11,563,355
- Issue date Jan 24, 2023
- Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Bamberg
- Peter Buckmueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular motherboard for a computer system and method thereof
- Patent number 11,546,992
- Issue date Jan 3, 2023
- Sanmina Corporation
- Charles C. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Socket alignment and retention system
- Patent number 11,503,732
- Issue date Nov 15, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure and electronic device having the same
- Patent number 11,503,731
- Issue date Nov 15, 2022
- DELTA ELECTRONICS INC.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic assembly including cable modules
- Patent number 11,477,904
- Issue date Oct 18, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density dual-embedded microstrip interconnects
- Patent number 11,395,402
- Issue date Jul 19, 2022
- Intel Corporation
- Albert Sutono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket connector and cable assembly for a communication system
- Patent number 11,382,231
- Issue date Jul 5, 2022
- Tyco Electronics Japan G.K.
- Junya Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device with detachable capacitor connection structure
- Patent number 11,362,447
- Issue date Jun 14, 2022
- SK Hynix Inc.
- Xiaofang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly, display device and method for manufacturing...
- Patent number 11,350,527
- Issue date May 31, 2022
- K-TRONICS (SUZHOU) TECHNOLOGY CO., LTD.
- Qigui Rong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket with thermal conductor
- Patent number 11,259,399
- Issue date Feb 22, 2022
- Intel Corporation
- Hongfei Yan
- G01 - MEASURING TESTING
Information Patent Grant
Cable assembly modules detachably mounted upon corresponding circui...
- Patent number 11,239,586
- Issue date Feb 1, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Jie Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin count socket having reduced pin count and pattern transformation
- Patent number 11,212,932
- Issue date Dec 28, 2021
- Intel Corporation
- Srikant Nekkanty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER WITH INTEGRATED CONNECTORS
- Publication number 20250079276
- Publication date Mar 6, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CONNECTING DEVICE FOR A RECHARGEABLE BATTERY OF A HEARING AID
- Publication number 20240422489
- Publication date Dec 19, 2024
- OTICON A/S
- Helge Åsmund YTTERDAL
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COVERS FOR INTEGRATED CIRCUIT PACKAGE SOCKETS
- Publication number 20240407092
- Publication date Dec 5, 2024
- Intel Corporation
- Ariatne Ramirez Macias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND EXPANSION CARD MODULE
- Publication number 20240381532
- Publication date Nov 14, 2024
- PEGATRON CORPORATION
- PING-MU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB SPACER
- Publication number 20240373556
- Publication date Nov 7, 2024
- Intel Corporation
- Gabriel Khouri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240226565
- Publication date Jul 11, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
COPLANAR CARD-EDGE CONNECTOR
- Publication number 20240204434
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Phillip V. Mann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY APPARATUS AND LAMP ASSEMBLY INCLUDING THE SAME
- Publication number 20240172365
- Publication date May 23, 2024
- HYUNDAI MOBIS CO., LTD.
- Sae Jun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240131339
- Publication date Apr 25, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...
- Publication number 20240088588
- Publication date Mar 14, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- MOTOHIKO FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240057254
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY MODULE CONNECTION INTERFACE FOR POWER DELIVERY
- Publication number 20240008181
- Publication date Jan 4, 2024
- Dell Products L.P.
- Isaac Q. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS
- Publication number 20230380067
- Publication date Nov 23, 2023
- Intel Corporation
- Raul Enriquez Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS
- Publication number 20230363093
- Publication date Nov 9, 2023
- NVIDIA Corp.
- MingYi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Expansion card with mezzanine level connector
- Publication number 20230284384
- Publication date Sep 7, 2023
- Xilinx, Inc.
- Ieuan James Mackereth MARSHALL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK
- Publication number 20230223639
- Publication date Jul 13, 2023
- ZHEJIANG LERA NEW ENERGY POWER TECHNOLOGY CO., LTD.
- Hengzhao KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS
- Publication number 20230180397
- Publication date Jun 8, 2023
- R&D Circuits
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET
- Publication number 20230156917
- Publication date May 18, 2023
- Amphenol Corporation
- Paul R. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20230141357
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Gidae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL POWER DELIVERY PACKAGING STRUCTURE
- Publication number 20230078561
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Xin Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS
- Publication number 20230074269
- Publication date Mar 9, 2023
- Intel Corporation
- Donald Tiendung Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY STRUCTURE
- Publication number 20230059607
- Publication date Feb 23, 2023
- DELTA ELECTRONICS,INC.
- Haoyi YE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD INTERCONNECTION DEVICE AND CIRCUIT BOARD ASSEMBLY
- Publication number 20230056822
- Publication date Feb 23, 2023
- BorgWarner Inc.
- Sisay Tadele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20230025397
- Publication date Jan 26, 2023
- TE Connectivity Solutions GMBH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PR...
- Publication number 20230022058
- Publication date Jan 26, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION MECHANISMS FOR COUPLING PRINTED CIRCUIT BOARD MODULES TO...
- Publication number 20230008535
- Publication date Jan 12, 2023
- Smith & Nephew, Inc.
- Sied W. Janna
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MOTHERBOARD
- Publication number 20220377894
- Publication date Nov 24, 2022
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Hui ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET ALIGNMENT AND RETENTION SYSTEM
- Publication number 20220354013
- Publication date Nov 3, 2022
- TE Connectivity Services GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE WITH DETACHABLE CAPACITOR CONNECTION STRUCTURE
- Publication number 20220231437
- Publication date Jul 21, 2022
- SK HYNIX INC.
- Xiaofang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR ACTUATOR
- Publication number 20220224214
- Publication date Jul 14, 2022
- J-STAR MOTOR INDUSTRIAL CO., LTD.
- Wei-Fan WU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Assembly structure

Circuit system and method of manufacturing a printed circuit board

Electrical connection structure and electronic device including the...

Separable interface cable structure for high voltage under-module p...

Circuit board interconnection device and circuit board assembly

Electronic assembly including cable modules

Method and process for creating high-performance coax sockets

Linear actuator

Edge connector, circuit board, and connector component

Socket load regulation utilizing CPU carriers with shim components

Vertical power delivery packaging structure

Expansion card with mezzanine level connector

Power electronic assembly with an electrically conductive sleeve an...

Storage device with detachable capacitor connection structure

Edge connector, circuit board, and connector component

Assemblies including heat dispersing elements and related systems a...

Multipoint contact conduction cooling of a removable device

Electronics of an electric motor of a motor vehicle

Modular motherboard for a computer system and method thereof

Socket alignment and retention system

Assembly structure and electronic device having the same

Electronic assembly including cable modules

High-density dual-embedded microstrip interconnects

Socket connector and cable assembly for a communication system

Storage device with detachable capacitor connection structure

Circuit board assembly, display device and method for manufacturing...

Server microprocessor carrier with guiding alignment anti-tilt and...

Socket with thermal conductor

Cable assembly modules detachably mounted upon corresponding circui...

Pin count socket having reduced pin count and pattern transformation

Patents Applicationslast 30 patents

STIFFENER WITH INTEGRATED CONNECTORS

FLEXIBLE CONNECTING DEVICE FOR A RECHARGEABLE BATTERY OF A HEARING AID

COVERS FOR INTEGRATED CIRCUIT PACKAGE SOCKETS

ELECTRONIC DEVICE AND EXPANSION CARD MODULE

PCB SPACER

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

COPLANAR CARD-EDGE CONNECTOR

POWER SUPPLY APPARATUS AND LAMP ASSEMBLY INCLUDING THE SAME

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...

PRINTED CIRCUIT BOARD

MEMORY MODULE CONNECTION INTERFACE FOR POWER DELIVERY

COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS

POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS

Expansion card with mezzanine level connector

BATTERY PACK

METHOD AND PROCESS FOR CREATING HIGH-PERFORMANCE COAX SOCKETS

HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET

ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...

VERTICAL POWER DELIVERY PACKAGING STRUCTURE

TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS

ASSEMBLY STRUCTURE

CIRCUIT BOARD INTERCONNECTION DEVICE AND CIRCUIT BOARD ASSEMBLY

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PR...

CONNECTION MECHANISMS FOR COUPLING PRINTED CIRCUIT BOARD MODULES TO...

MOTHERBOARD

SOCKET ALIGNMENT AND RETENTION SYSTEM

STORAGE DEVICE WITH DETACHABLE CAPACITOR CONNECTION STRUCTURE

LINEAR ACTUATOR