SOI together with lateral isolation

Industry

CPC
H01L21/76264

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76264SOI together with lateral isolation

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor on insulator having a semiconductor layer with differ...
- Patent number 12,170,284
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 12,165,911
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective polysilicon growth for deep trench polysilicon isolation...
- Patent number 12,148,756
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC structure for high voltage device on a SOI substrate
- Patent number 12,136,627
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including strings of memory cells, and related elect...
- Patent number 12,113,019
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device including active patterns...
- Patent number 12,112,952
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-transparency semiconductor-metal interfaces
- Patent number 12,094,760
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Markus Fabian Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient stabilized SOI FETs
- Patent number 11,948,897
- Issue date Apr 2, 2024
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RF devices with enhanced performance including at...
- Patent number 11,923,238
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for radiofrequency applications and related methods
- Patent number 11,923,239
- Issue date Mar 5, 2024
- Soitec
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,830,764
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterolithic integrated circuits including integrated devices forme...
- Patent number 11,817,450
- Issue date Nov 14, 2023
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple thickness semiconductor-on-insulator field effect transist...
- Patent number 11,817,345
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 11,764,104
- Issue date Sep 19, 2023
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with embedded isolation layer in bulk substrate
- Patent number 11,749,717
- Issue date Sep 5, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Uzma Rana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treating a silicon on insulator wafer in preparation for manufactur...
- Patent number 11,749,558
- Issue date Sep 5, 2023
- QUANTUM SILICON INC.
- Bruno Vieira Da Cunha Martins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 11,728,429
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Yul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having spacer capping pattern disposed...
- Patent number 11,665,883
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Inkyoung Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterolithic microwave integrated circuits including gallium-nitrid...
- Patent number 11,640,960
- Issue date May 2, 2023
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap vertical transistor without structural collapse
- Patent number 11,637,179
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure and manufacturing method thereof
- Patent number 11,600,532
- Issue date Mar 7, 2023
- Rockley Photonics Limited
- Aaron Zilkie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive structures, and relate...
- Patent number 11,574,870
- Issue date Feb 7, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of semiconductor device processing
- Patent number 11,527,431
- Issue date Dec 13, 2022
- Imec VZW
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,495,489
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening method and apparatus for detecting deep trench isolation...
- Patent number 11,448,690
- Issue date Sep 20, 2022
- NXP USA, INC.
- Laurent Segarra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for forming dielectric isolated FinFET with im...
- Patent number 11,430,879
- Issue date Aug 30, 2022
- Tessera, Inc.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple thickness semiconductor-on-insulator field effect transist...
- Patent number 11,398,403
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with embedded isolation layer in bulk substrate
- Patent number 11,380,759
- Issue date Jul 5, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Uzma Rana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for radiofrequency applications and related methods
- Patent number 11,367,650
- Issue date Jun 21, 2022
- Soitec
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...
- Publication number 20240379684
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...
- Publication number 20240371882
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE
- Publication number 20240371884
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Stabilized SOI FETs
- Publication number 20240347482
- Publication date Oct 17, 2024
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOURCE/DRAIN EPITAXIAL LAYER OF FDSOI MOSFET
- Publication number 20240170344
- Publication date May 23, 2024
- Shanghai Huali Integrated Circuit Corporation
- Jiaqi HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
- Publication number 20240145253
- Publication date May 2, 2024
- Infineon Technologies Dresden GmbH & Co., KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR FIELD-EFFECT TRANSISTORS INCLUDING STRES...
- Publication number 20240105503
- Publication date Mar 28, 2024
- GLOBALFOUNDRIES U.S. Inc.
- SHESH MANI PANDEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF GATE STRUCTURE
- Publication number 20240063052
- Publication date Feb 22, 2024
- UNITED MICROELECTRONICS CORP.
- Tzu-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AN OXIDE VOLUME WITHIN A FIN
- Publication number 20230377947
- Publication date Nov 23, 2023
- Intel Corporation
- Cheng-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20230377948
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230369457
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- YOSHIKI YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS TRANSISTOR ON SOI STRUCTURE
- Publication number 20230290786
- Publication date Sep 14, 2023
- STMicroelectronics (Crolles 2) SAS
- Sebastien CREMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STRINGS OF MEMORY CELLS, AND RELATED ELECT...
- Publication number 20230148107
- Publication date May 11, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230083880
- Publication date Mar 16, 2023
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MONOLITHIC INTEGRATION OF ELECTRONIC AND O...
- Publication number 20230021758
- Publication date Jan 26, 2023
- IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Instit...
- Andreas MAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...
- Publication number 20230018629
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE
- Publication number 20220415930
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20220359273
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE THICKNESS SEMICONDUCTOR-ON-INSULATOR FIELD EFFECT TRANSIST...
- Publication number 20220328345
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR RADIOFREQUENCY APPLICATIONS AND RELATED METHODS
- Publication number 20220277988
- Publication date Sep 1, 2022
- SOITEC
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH EMBEDDED ISOLATION LAYER IN BULK SUBSTRATE
- Publication number 20220262900
- Publication date Aug 18, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Uzma RANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Stabilized SOI FETs
- Publication number 20220246550
- Publication date Aug 4, 2022
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20220181161
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TRANSPARENCY SEMICONDUCTOR-METAL INTERFACES
- Publication number 20220139770
- Publication date May 5, 2022
- International Business Machines Corporation
- Markus Fabian Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATING A SILICON ON INSULATOR WAFER IN PREPARATION FOR MANUFACTUR...
- Publication number 20220102197
- Publication date Mar 31, 2022
- Quantum Silicon Inc.
- Bruno Vieira Da Cunha Martins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220102555
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Yul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Publication number 20220028731
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- SUNIL SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH EMBEDDED ISOLATION LAYER IN BULK SUBSTRATE
- Publication number 20220028971
- Publication date Jan 27, 2022
- GLOBALFOUNDRIES U.S. INC.
- Uzma RANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCREENING METHOD AND APPARATUS FOR DETECTING DEEP TRENCH ISOLATION...
- Publication number 20220003812
- Publication date Jan 6, 2022
- NXP USA, Inc.
- Laurent Segarra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROLITHIC MICROWAVE INTEGRATED CIRCUITS INCLUDING GALLIUM-NITRID...
- Publication number 20210305237
- Publication date Sep 30, 2021
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS

SOI together with lateral isolation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor on insulator having a semiconductor layer with differ...

Method for forming a semiconductor-on-insulator (SOI) substrate

Selective polysilicon growth for deep trench polysilicon isolation...

3DIC structure for high voltage device on a SOI substrate

Memory devices including strings of memory cells, and related elect...

Methods of forming a semiconductor device including active patterns...

High-transparency semiconductor-metal interfaces

Methods and devices related to radio frequency devices

Transient stabilized SOI FETs

Method of forming RF devices with enhanced performance including at...

Structures for radiofrequency applications and related methods

Method for forming a semiconductor-on-insulator (SOI) substrate

Heterolithic integrated circuits including integrated devices forme...

Multiple thickness semiconductor-on-insulator field effect transist...

Forming an oxide volume within a fin

Transistor with embedded isolation layer in bulk substrate

Treating a silicon on insulator wafer in preparation for manufactur...

Method of fabricating semiconductor device

Semiconductor memory device having spacer capping pattern disposed...

Heterolithic microwave integrated circuits including gallium-nitrid...

Airgap vertical transistor without structural collapse

Integrated structure and manufacturing method thereof

Microelectronic devices including conductive structures, and relate...

Methods of semiconductor device processing

Method for forming a semiconductor-on-insulator (SOI) substrate

Screening method and apparatus for detecting deep trench isolation...

Method and structure for forming dielectric isolated FinFET with im...

Multiple thickness semiconductor-on-insulator field effect transist...

Transistor with embedded isolation layer in bulk substrate

Structures for radiofrequency applications and related methods

Patents Applicationslast 30 patents

SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...

SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...

3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE

Transient Stabilized SOI FETs

METHOD FOR MANUFACTURING SOURCE/DRAIN EPITAXIAL LAYER OF FDSOI MOSFET

METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

SEMICONDUCTOR-ON-INSULATOR FIELD-EFFECT TRANSISTORS INCLUDING STRES...

MANUFACTURING METHOD OF GATE STRUCTURE

FORMING AN OXIDE VOLUME WITHIN A FIN

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MOS TRANSISTOR ON SOI STRUCTURE

MEMORY DEVICES INCLUDING STRINGS OF MEMORY CELLS, AND RELATED ELECT...

SEMICONDUCTOR DEVICE

SUBSTRATE AND METHOD FOR MONOLITHIC INTEGRATION OF ELECTRONIC AND O...

SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...

3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

MULTIPLE THICKNESS SEMICONDUCTOR-ON-INSULATOR FIELD EFFECT TRANSIST...

STRUCTURES FOR RADIOFREQUENCY APPLICATIONS AND RELATED METHODS

TRANSISTOR WITH EMBEDDED ISOLATION LAYER IN BULK SUBSTRATE

Transient Stabilized SOI FETs

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

HIGH-TRANSPARENCY SEMICONDUCTOR-METAL INTERFACES

TREATING A SILICON ON INSULATOR WAFER IN PREPARATION FOR MANUFACTUR...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE

TRANSISTOR WITH EMBEDDED ISOLATION LAYER IN BULK SUBSTRATE

SCREENING METHOD AND APPARATUS FOR DETECTING DEEP TRENCH ISOLATION...

HETEROLITHIC MICROWAVE INTEGRATED CIRCUITS INCLUDING GALLIUM-NITRID...