Solder dip coating, i.e. coating printed conductors

Industry

CPC
H05K2203/044

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/044Solder dip coating, i.e. coating printed conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wave solder pallets for optimal solder flow and methods of manufact...
- Patent number 11,850,684
- Issue date Dec 26, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant pin surface mount technology pad for rework
- Patent number 11,647,591
- Issue date May 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 11,589,487
- Issue date Feb 21, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Protective heat shields for thermally sensitive components and meth...
- Patent number 11,516,924
- Issue date Nov 29, 2022
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-destructive identifying of plating dissolution in soldered, pla...
- Patent number 11,059,120
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Matthew S. Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel for the purpose of winding a length of cable of optical fiber...
- Patent number 10,845,562
- Issue date Nov 24, 2020
- Sagemcom Broadband SAS
- Stéphane Kohn
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Protective heat shields for thermally sensitive components and meth...
- Patent number 10,827,626
- Issue date Nov 3, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 10,757,814
- Issue date Aug 25, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Nobuhiko Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wave solder pallet
- Patent number 10,737,344
- Issue date Aug 11, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accurate positioning and alignment of a component during processes...
- Patent number 10,667,387
- Issue date May 26, 2020
- ams Sensors Singapore Pte. Ltd.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure
- Patent number 10,638,605
- Issue date Apr 28, 2020
- DENSO TEN Limited
- Tamaki Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,576,566
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work machine
- Patent number 10,470,350
- Issue date Nov 5, 2019
- FUJI CORPORATION
- Satoru Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, power supply apparatus, image forming appara...
- Patent number 10,412,839
- Issue date Sep 10, 2019
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate on which electronic component is soldered, electronic dev...
- Patent number 10,299,387
- Issue date May 21, 2019
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,286,471
- Issue date May 14, 2019
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,286,472
- Issue date May 14, 2019
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and soldering device for selective soldering with at least o...
- Patent number 10,201,866
- Issue date Feb 12, 2019
- SEHO Systemtechnik GmbH
- Bernd Dreikorn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cleaning an Electronic circuit board
- Patent number 10,144,078
- Issue date Dec 4, 2018
- Raytheon Company
- William R. Vuono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual solder layer for fluidic self assembly and electrical componen...
- Patent number 10,039,194
- Issue date Jul 31, 2018
- OSRAM SYLVANIA Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for coating thin molten solder film, thin solder film-covere...
- Patent number 9,956,634
- Issue date May 1, 2018
- Senju Metal Industry Co., Ltd.
- Isamu Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, power supply apparatus, image forming appara...
- Patent number 9,918,393
- Issue date Mar 13, 2018
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cleaning an electronic circuit board
- Patent number 9,902,006
- Issue date Feb 27, 2018
- Raytheon Company
- William R. Vuono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Refrigerating apparatus
- Patent number 9,769,955
- Issue date Sep 19, 2017
- Daikin Industries, Ltd.
- Junichi Teraki
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Method of manufacture an electric circuit
- Patent number 9,699,915
- Issue date Jul 4, 2017
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Soldering device, soldering method, and substrate and electronic co...
- Patent number 9,686,871
- Issue date Jun 20, 2017
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,662,732
- Issue date May 30, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,661,748
- Issue date May 23, 2017
- FANUC CORPORATION
- Norihiro Saidou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-based solder composition with low void characteristic
- Patent number 9,604,316
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
- Publication number 20240268036
- Publication date Aug 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shingo OKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING DEVICE AND COMPONENT MOUNTING MACHINE
- Publication number 20230247772
- Publication date Aug 3, 2023
- FUJI CORPORATION
- Jinya IMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING
- Publication number 20230164966
- Publication date May 25, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING
- Publication number 20230141137
- Publication date May 11, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...
- Publication number 20230086271
- Publication date Mar 23, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK
- Publication number 20220400557
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...
- Publication number 20200139466
- Publication date May 7, 2020
- International Business Machines Corporation
- Matthew S. KELLY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...
- Publication number 20180343748
- Publication date Nov 29, 2018
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE
- Publication number 20180332705
- Publication date Nov 15, 2018
- DENSO TEN LIMITED
- Tamaki Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...
- Publication number 20180235080
- Publication date Aug 16, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...
- Publication number 20180160544
- Publication date Jun 7, 2018
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CLEANING AN ELECTRONIC CIRCUIT BOARD
- Publication number 20180141144
- Publication date May 24, 2018
- Raytheon Company
- William R. Vuono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...
- Publication number 20180132361
- Publication date May 10, 2018
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20160297022
- Publication date Oct 13, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN-BASED SOLDER COMPOSITION WITH LOW VOID CHARACTERISTIC
- Publication number 20160082551
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAVE SOLDERING NOZZLE SYSTEM AND METHOD OF WAVE SOLDERING
- Publication number 20160052074
- Publication date Feb 25, 2016
- Illinois Tool Works Inc.
- Gregory Leo Hueste
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-HEATER LATCH AND SEAL MECHANISM FOR WAVE SOLDER MACHINE AND REL...
- Publication number 20150367438
- Publication date Dec 24, 2015
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-HEATER LATCH AND SEAL MECHANISM FOR WAVE SOLDER MACHINE AND REL...
- Publication number 20150245499
- Publication date Aug 27, 2015
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...
- Publication number 20150223346
- Publication date Aug 6, 2015
- Osram Sylvania Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20140311775
- Publication date Oct 23, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHAO-RONG LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER WITH A TEST SURFACE WETTABLE WITH LIQUID SOLDER AND METHOD...
- Publication number 20140284374
- Publication date Sep 25, 2014
- Siemens Aktiengesellschaft
- Bernd Müller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly Structure with Filter Device and Printed Circuit Board and...
- Publication number 20140254094
- Publication date Sep 11, 2014
- U.D. ELECTRONIC CORP.
- Chih-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING IMPEDANCE OF A PRINTED CIRCUIT BOARD THROUGH A SQUARE WAVE...
- Publication number 20140192502
- Publication date Jul 10, 2014
- Shuang Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER DEVICE FOR WAVE SOLDERING
- Publication number 20140182909
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER DEVICE FOR WAVE SOLDERING
- Publication number 20140183250
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRIPPABLE ADHESION COMPOSITION AND USES THEREOF
- Publication number 20140162060
- Publication date Jun 12, 2014
- CHI MEI CORPORATION
- Kuang-Chieh LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ESD PROTECTION IN A VERY SMALL FORM FACTOR CONSUMER ELECTRONIC PRODUCT
- Publication number 20140104807
- Publication date Apr 17, 2014
- Apple Inc.
- Teodor Dabov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT HAVING AN ELECTRODE CORROSION PREVENTING LAYER AND A METH...
- Publication number 20140036427
- Publication date Feb 6, 2014
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus And Method For Providing An Inerting Gas During Soldering
- Publication number 20140027495
- Publication date Jan 30, 2014
- Air Products and Chemicals Inc
- Gregory Khosrov Arslanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM PROVIDED WITH A SOLDER JOINT
- Publication number 20130264102
- Publication date Oct 10, 2013
- Tellabs Oy
- Antti HOLMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Solder dip coating, i.e. coating printed conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

On-demand method of making PCB pallets using additive manufacturing

Wave solder pallets for optimal solder flow and methods of manufact...

Compliant pin surface mount technology pad for rework

On-demand method of making PCB pallets using additive manufacturing

Protective heat shields for thermally sensitive components and meth...

Non-destructive identifying of plating dissolution in soldered, pla...

Reel for the purpose of winding a length of cable of optical fiber...

Protective heat shields for thermally sensitive components and meth...

Method for manufacturing a circuit board

Method of manufacturing a wave solder pallet

Accurate positioning and alignment of a component during processes...

Printed circuit board structure

Solder paste misprint cleaning

Work machine

Printed circuit board, power supply apparatus, image forming appara...

Substrate on which electronic component is soldered, electronic dev...

Solder paste misprint cleaning

Solder paste misprint cleaning

Method and soldering device for selective soldering with at least o...

Method for cleaning an Electronic circuit board

Dual solder layer for fluidic self assembly and electrical componen...

Device for coating thin molten solder film, thin solder film-covere...

Printed circuit board, power supply apparatus, image forming appara...

Apparatus for cleaning an electronic circuit board

Refrigerating apparatus

Method of manufacture an electric circuit

Soldering device, soldering method, and substrate and electronic co...

Increasing solder hole-fill in a printed circuit board assembly

Printed circuit board and method of manufacturing the same

Tin-based solder composition with low void characteristic

Patents Applicationslast 30 patents

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

COATING DEVICE AND COMPONENT MOUNTING MACHINE

ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING

ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...

COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK

NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...

SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...

PRINTED CIRCUIT BOARD STRUCTURE

ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...

PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...

METHOD AND APPARATUS FOR CLEANING AN ELECTRONIC CIRCUIT BOARD

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

TIN-BASED SOLDER COMPOSITION WITH LOW VOID CHARACTERISTIC

WAVE SOLDERING NOZZLE SYSTEM AND METHOD OF WAVE SOLDERING

PRE-HEATER LATCH AND SEAL MECHANISM FOR WAVE SOLDER MACHINE AND REL...

PRE-HEATER LATCH AND SEAL MECHANISM FOR WAVE SOLDER MACHINE AND REL...

DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...

CIRCUIT BOARD STRUCTURE

CARRIER WITH A TEST SURFACE WETTABLE WITH LIQUID SOLDER AND METHOD...

Assembly Structure with Filter Device and Printed Circuit Board and...

REDUCING IMPEDANCE OF A PRINTED CIRCUIT BOARD THROUGH A SQUARE WAVE...

HEAT TRANSFER DEVICE FOR WAVE SOLDERING

HEAT TRANSFER DEVICE FOR WAVE SOLDERING

STRIPPABLE ADHESION COMPOSITION AND USES THEREOF

ESD PROTECTION IN A VERY SMALL FORM FACTOR CONSUMER ELECTRONIC PRODUCT

COMPONENT HAVING AN ELECTRODE CORROSION PREVENTING LAYER AND A METH...

Apparatus And Method For Providing An Inerting Gas During Soldering

SYSTEM PROVIDED WITH A SOLDER JOINT