Patent Application
20140311775
The disclosure generally relates to electronic equipment, and particularly to a circuit board structure.
Generally, pins of an electronic component are coated with tin using a wave-soldering process when a circuit board is made. However, the conducting material on the pins is easy to adhere together if two adjacent pins are too close, which leads to a low yield of the circuit board.
Therefore, it is desirable to provide a means to overcome the above-mentioned problems.
Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustraconducting materialg the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
The disclosure is illustrated by way of example and not by way of limitation in the FIGURE of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can mean “at least one.”
The pin holes 12 are used to receive a number of pins (not shown) of an electronic component (not shown). A wave-soldering process coats a conducting material onto the pins after the pins are received in the pin holes 12, to fasten and electrically connect the pins to the circuit board 10. The pin holes 12 are spacially defined according to the pins of the electronic component. In one embodiment, each group of pin holes 12 corresponds to one group of pins, and the conducting material is tin.
The adsorption strip 14 absorbs excess conducting material during the wave-soldering process to prevent adjacent pins from short-circuiting due to build-up of the conducting material between the two adjacent pins. In one embodiment, the adsorption strip 14 is a substantially rectangular copper strip. Because the adsorption strip 14 is bigger than a single pin of the electronic component, a surface area of the adsorption strip 14 is greater than a surface area of the pins. Thus, a surface tension of the excess conducting material on the adsorption strip 14 is greater than a surface tension of the conducting material between two adjacent pins, so the excess conducting material between two adjacent pins is attracted to the adsorption strip 14.
Each adsorption strip 14 absorbs the excess conducting material between adjacent pins received in the pin holes 12 arranged along the corresponding predetermined line S1 or S2. Numbers of the adsorption strips 14 can be changed according to numbers of the groups of pins and groups of pin holes 12. Thus, if there are different groups of the pin holes 12 correspondingly arranged along the predetermined lines S1 and S2 in different directions, the corresponding adsorption strip 14s are set to absorb the redundant conducting material. In the illustrated embodiment, there are two adsorption strips 14 correspondingly set at two opposite outer sides of two groups of the pin holes 12 arranged along two parallel predetermined lines S1 and S2.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without deparconducting materialg from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013101418265 | Apr 2013 | CN | national |
