Solder filled plated through-hole in the final product

Industry

CPC
H05K2201/09572

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09572Solder filled plated through-hole in the final product

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power conversion device
- Patent number 12,184,190
- Issue date Dec 31, 2024
- Denso Corporation
- Daisuke Yamazaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit for bridging and display panel
- Patent number 11,647,585
- Issue date May 9, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Xiaolong Zhu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer ceramic electronic component, method of producing the s...
- Patent number 11,562,860
- Issue date Jan 24, 2023
- Taiyo Yuden Co., Ltd.
- Yuji Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-current PCB traces
- Patent number 11,564,309
- Issue date Jan 24, 2023
- Schweitzer Engineering Laboratories, Inc.
- Travis C. Mallett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board having thermal through...
- Patent number 11,116,071
- Issue date Sep 7, 2021
- ZKW GROUP GMBH
- Erik Edlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Facilitating filling a plated through-hole of a circuit board with...
- Patent number 11,051,407
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,912,186
- Issue date Feb 2, 2021
- Mitsubishi Electric Corporation
- Shota Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for breadboard-style printed circuit board
- Patent number 10,905,003
- Issue date Jan 26, 2021
- Samuel P. Kho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate, component-mounted substrate, and methods of manu...
- Patent number 10,887,988
- Issue date Jan 5, 2021
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing post reflow interconnect failures in VIPPO solder joints...
- Patent number 10,813,228
- Issue date Oct 20, 2020
- Indium Corporation
- Lee C. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a multi-layer circuit board using conductive past...
- Patent number 10,765,003
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light blocking features for indicator lights in an appliance
- Patent number 10,753,597
- Issue date Aug 25, 2020
- Haier US Appliance Solutions, Inc.
- Ricardo Alberto Aguiar
- F21 - LIGHTING
Information Patent Grant
High-current PCB traces
- Patent number 10,537,016
- Issue date Jan 14, 2020
- Schweitzer Engineering Laboratories, Inc.
- Travis C. Mallett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-current transmitting method utilizing printed circuit board
- Patent number 10,462,911
- Issue date Oct 29, 2019
- LG Chem, Ltd.
- Chang Hui Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for breadboard style printed circuit board
- Patent number 10,368,435
- Issue date Jul 30, 2019
- Samuel P. Kho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing a printed circuit board
- Patent number 10,327,325
- Issue date Jun 18, 2019
- ZK W Group GmbH
- Erik Edlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate on which electronic component is soldered, electronic dev...
- Patent number 10,299,387
- Issue date May 21, 2019
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Construction of printed circuit board having a buried via
- Patent number 10,172,244
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Matteo Cocchini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, electronic device, and solder mounting method
- Patent number 10,137,518
- Issue date Nov 27, 2018
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,839,128
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, ball grid array package and wiring method of...
- Patent number 9,629,241
- Issue date Apr 18, 2017
- BOE Technology Group Co., Ltd.
- Yue Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board consisting of at least...
- Patent number 9,480,172
- Issue date Oct 25, 2016
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Volodymyr Karpovych
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, printed circuit board, and method for manufac...
- Patent number 9,474,166
- Issue date Oct 18, 2016
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,462,703
- Issue date Oct 4, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,437,566
- Issue date Sep 6, 2016
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector
- Patent number 9,420,690
- Issue date Aug 16, 2016
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical and mechanical interconnection for electronic components
- Patent number 9,374,898
- Issue date Jun 21, 2016
- Apple Inc.
- Kuo-Hua Sung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of connector
- Patent number 9,370,099
- Issue date Jun 14, 2016
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE JOINING STRUCTURE
- Publication number 20240314943
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Hiromitsu Itamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Circuit Board, Circuit Board Assembly, and Electronic Device
- Publication number 20240306300
- Publication date Sep 12, 2024
- Honor Device Co., Ltd.
- Jianqiang Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
- Publication number 20240260168
- Publication date Aug 1, 2024
- VITESCO TECHNOLOGIES GMBH
- Detlev Bagung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20230032317
- Publication date Feb 2, 2023
- DENSO CORPORATION
- Daisuke YAMAZAKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHODS OF MANUFACTURING CIRCUIT SUBSTRATE AND COMPONENT-MOUNTED SU...
- Publication number 20210084763
- Publication date Mar 18, 2021
- Nichia Corporation.
- Masaaki KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...
- Publication number 20200128676
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-CURRENT PCB TRACES
- Publication number 20200113043
- Publication date Apr 9, 2020
- Schweitzer Engineering Laboratories, Inc.
- Travis C. Mallett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS...
- Publication number 20190394883
- Publication date Dec 26, 2019
- Indium Corporation
- Lee C. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING THE S...
- Publication number 20190326061
- Publication date Oct 24, 2019
- Taiyo Yuden Co., Ltd.
- Yuji Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...
- Publication number 20180343748
- Publication date Nov 29, 2018
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-Current PCB Traces
- Publication number 20170311440
- Publication date Oct 26, 2017
- Schweitzer Engineering Laboratories, Inc.
- Travis C. Mallett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...
- Publication number 20160338200
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20150325543
- Publication date Nov 12, 2015
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...
- Publication number 20150319863
- Publication date Nov 5, 2015
- Dhananjaya Turpuseema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR
- Publication number 20150289374
- Publication date Oct 8, 2015
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A PRINTED CIRCUIT BOARD ARRANGEMENT AND A METHOD FOR FORMING ELECTR...
- Publication number 20150208506
- Publication date Jul 23, 2015
- TELEFONAKTIEBOLAGET L M ERICSSON (publ)
- Igor Perez-Uria
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...
- Publication number 20140376196
- Publication date Dec 25, 2014
- Volodymyr Karpovych
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temperature Triggering Ejector Mechanism for Lock Pin Soldering Typ...
- Publication number 20140353360
- Publication date Dec 4, 2014
- International Business Machines Corporation
- Xiaowei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL AND MECHANICAL INTERCONNECTION FOR ELECTRONIC COMPONENTS
- Publication number 20140321075
- Publication date Oct 30, 2014
- Apple Inc.
- Kuo-Hua SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...
- Publication number 20140174795
- Publication date Jun 26, 2014
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier, Electric Conductor and Method for Producing a Co...
- Publication number 20130175076
- Publication date Jul 11, 2013
- E.G.O. Elektro-Geratebau GmbH
- Axel Hiller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connector
- Publication number 20130175085
- Publication date Jul 11, 2013
- Keita Terajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Component to an Electric Circuit Board, Elect...
- Publication number 20130044448
- Publication date Feb 21, 2013
- BIOTRONIK SE & CO. KG
- Anthony A. Primavera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE IMPROVEMENT OF LED LAMP
- Publication number 20120176785
- Publication date Jul 12, 2012
- GEM-SUN TECHNOLOGIES CO., LTD.
- Hung-Tsung HSU
- F21 - LIGHTING
Information Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
- Publication number 20120104628
- Publication date May 3, 2012
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Dissipating Assembly
- Publication number 20110279981
- Publication date Nov 17, 2011
- Alex Horng
- F21 - LIGHTING
Information Patent Application
ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING...
- Publication number 20110001222
- Publication date Jan 6, 2011
- Nozomu Nishimura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
- Publication number 20100109142
- Publication date May 6, 2010
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SOLDER BALL WHICH HAS DOUBLE CONNECTIO...
- Publication number 20100090324
- Publication date Apr 15, 2010
- Samsung Electronics Co., Ltd.
- Hye-Jin KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Solder filled plated through-hole in the final product

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power conversion device

Sn—Bi and copper powder conductive paste in through hole of insulat...

Flexible printed circuit for bridging and display panel

Multi-layer ceramic electronic component, method of producing the s...

High-current PCB traces

Method for producing a printed circuit board having thermal through...

Facilitating filling a plated through-hole of a circuit board with...

Semiconductor device

Systems and methods for breadboard-style printed circuit board

Circuit substrate, component-mounted substrate, and methods of manu...

Preventing post reflow interconnect failures in VIPPO solder joints...

Method for making a multi-layer circuit board using conductive past...

Light blocking features for indicator lights in an appliance

High-current PCB traces

High-current transmitting method utilizing printed circuit board

Systems and methods for breadboard style printed circuit board

Printed circuit board and method for producing a printed circuit board

Substrate on which electronic component is soldered, electronic dev...

Construction of printed circuit board having a buried via

Semiconductor package, electronic device, and solder mounting method

Conductive connections, structures with such connections, and metho...

Solder void reduction between electronic packages and printed circu...

Printed circuit board, ball grid array package and wiring method of...

Method for producing a printed circuit board consisting of at least...

Printed wiring board, printed circuit board, and method for manufac...

Solder void reduction between electronic packages and printed circu...

Conductive connections, structures with such connections, and metho...

Connector

Electrical and mechanical interconnection for electronic components

Manufacturing method of connector

Patents Applicationslast 30 patents

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

SUBSTRATE JOINING STRUCTURE

Flexible Circuit Board, Circuit Board Assembly, and Electronic Device

CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...

POWER CONVERSION DEVICE

METHODS OF MANUFACTURING CIRCUIT SUBSTRATE AND COMPONENT-MOUNTED SU...

FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...

HIGH-CURRENT PCB TRACES

PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS...

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING THE S...

SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...

High-Current PCB Traces

SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...

CONNECTOR

A PRINTED CIRCUIT BOARD ARRANGEMENT AND A METHOD FOR FORMING ELECTR...

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...

Temperature Triggering Ejector Mechanism for Lock Pin Soldering Typ...

ELECTRICAL AND MECHANICAL INTERCONNECTION FOR ELECTRONIC COMPONENTS

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...

Component Carrier, Electric Conductor and Method for Producing a Co...

Connector

Method for Mounting a Component to an Electric Circuit Board, Elect...

STRUCTURE IMPROVEMENT OF LED LAMP

INTERPOSER FOR SEMICONDUCTOR PACKAGE

Heat Dissipating Assembly

ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING...

INTERPOSER FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING SOLDER BALL WHICH HAS DOUBLE CONNECTIO...