Soldering or alloying

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H01L2224/82801

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82801Soldering or alloying

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bridged fanout chiplet connectivity
- Patent number 11,658,123
- Issue date May 23, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcontroller unit and fabrication method thereof
- Patent number 11,056,476
- Issue date Jul 6, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Ying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
- Patent number 8,790,742
- Issue date Jul 29, 2014
- nScrypt, Inc.
- Kenneth H. Church
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
- Patent number 7,972,650
- Issue date Jul 5, 2011
- nScrypt, Inc.
- Kenneth H. Church
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY
- Publication number 20220102276
- Publication date Mar 31, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118839
- Publication date Apr 22, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROCONTROLLER UNIT AND FABRICATION METHOD THEREOF
- Publication number 20200212028
- Publication date Jul 2, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Ying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Manufacturing Semiconductor Package Board
- Publication number 20120122278
- Publication date May 17, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwan Ho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC C...
- Publication number 20110237002
- Publication date Sep 29, 2011
- nScrypt, Inc.
- KENNETH H. CHURCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR