Soldering with different solders

Industry

CPC
H05K2203/047

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/047Soldering with different solders

Industries

Patents Grantslast 30 patents

Information Patent Grant
Insulated circuit board
- Patent number 11,013,107
- Issue date May 18, 2021
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux residue detection
- Patent number 10,939,600
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level methods of fabricating semiconductor device packages an...
- Patent number 10,896,894
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Wei Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising an electronic component mounted on a s...
- Patent number 10,897,822
- Issue date Jan 19, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,867,956
- Issue date Dec 15, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Won Chul Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection including a cable assembly and a board assembly, a...
- Patent number 10,541,479
- Issue date Jan 21, 2020
- MD Elektronik GmbH
- Martin Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Estimation device
- Patent number 10,413,986
- Issue date Sep 17, 2019
- FUJI CORPORATION
- Kazuya Degura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,249,559
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual solder layer for fluidic self assembly and electrical componen...
- Patent number 10,039,194
- Issue date Jul 31, 2018
- OSRAM SYLVANIA Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with solder dam
- Patent number 9,949,378
- Issue date Apr 17, 2018
- Presidio Components, Inc.
- Hung Van Trinh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices and methods for manufacturing same
- Patent number 9,936,589
- Issue date Apr 3, 2018
- Presidio Components, Inc.
- Hung Van Trinh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component, semiconductor-mounted product including th...
- Patent number 9,925,612
- Issue date Mar 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuo Fukuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,780,066
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device
- Patent number 9,761,556
- Issue date Sep 12, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshitada Higashizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,659,902
- Issue date May 23, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical apparatus
- Patent number 9,640,508
- Issue date May 2, 2017
- Fujitsu Limited
- Taiki Uemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted structure and manufacturing method of mounted structure
- Patent number 9,603,295
- Issue date Mar 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press fit electrical terminal having a solder tab shorter than PCB...
- Patent number 9,564,697
- Issue date Feb 7, 2017
- Lear Corporation
- Bert William Eakins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 9,414,513
- Issue date Aug 9, 2016
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting device
- Patent number 9,210,836
- Issue date Dec 8, 2015
- Shinko Electric Industries Co., Ltd.
- Yoshitada Higashizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly
- Patent number 9,113,584
- Issue date Aug 18, 2015
- Koninklijke Philips N.V.
- Hangfeng Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In system reflow of low temperature eutectic bond balls
- Patent number 8,671,560
- Issue date Mar 18, 2014
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-assembled electrical contacts
- Patent number 8,318,595
- Issue date Nov 27, 2012
- The United States of America as represented by the Secretary of the Army
- Christopher J. Morris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier for manufacturing a printed circuit board
- Patent number 8,156,635
- Issue date Apr 17, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seong Min Cho
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,901,997
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attachment using magnetic particle based solder composites
- Patent number 7,902,060
- Issue date Mar 8, 2011
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOLDERING METHOD AND DEVICE
- Publication number 20220320811
- Publication date Oct 6, 2022
- O.M.C. CO., LTD.
- Shinji WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH ELECTRICAL CONTACTS AND SOLDER JOINTS O...
- Publication number 20220078919
- Publication date Mar 10, 2022
- Hewlett-Packard Development Company, L.P.
- Roger A. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...
- Publication number 20200305283
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX RESIDUE DETECTION
- Publication number 20200170155
- Publication date May 28, 2020
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL METHODS OF FABRICATING SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20200105713
- Publication date Apr 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20190229045
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION INCLUDING A CABLE ASSEMBLY AND A BOARD ASSEMBLY, A...
- Publication number 20190036245
- Publication date Jan 31, 2019
- MD ELEKTRONIK GmbH
- Martin Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ESTIMATION DEVICE
- Publication number 20180185946
- Publication date Jul 5, 2018
- FUJI MACHINE MFG. CO., LTD.
- Kazuya DEGURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS
- Publication number 20180015558
- Publication date Jan 18, 2018
- FUJI MACHINE MFG. CO., LTD.
- Katsunori TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20160183384
- Publication date Jun 23, 2016
- Presidio Components. Inc.
- Hung Van Trinh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...
- Publication number 20150223346
- Publication date Aug 6, 2015
- Osram Sylvania Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
- Publication number 20140291843
- Publication date Oct 2, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL OVERLOAD PROTECTION APPARATUS
- Publication number 20140232511
- Publication date Aug 21, 2014
- Phoenix Contact GmbH & Co. KG
- Rainer Durth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In System Reflow of Low Temperature Eutectic Bond Balls
- Publication number 20140144971
- Publication date May 29, 2014
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
- Publication number 20140049930
- Publication date Feb 20, 2014
- PANASONIC CORPORATION
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20130314885
- Publication date Nov 28, 2013
- Koninklijke Philips N.V.
- Hangfeng Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...
- Publication number 20130291378
- Publication date Nov 7, 2013
- Shinko Electric Industries Co., Ltd.
- Yoshitada HIGASHIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...
- Publication number 20130140069
- Publication date Jun 6, 2013
- Fujitsu Limited
- Masayuki KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
- Publication number 20130088839
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...
- Publication number 20120292087
- Publication date Nov 22, 2012
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MAKING SAME
- Publication number 20120162928
- Publication date Jun 28, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20120152606
- Publication date Jun 21, 2012
- IBIDEN CO., LTD.
- Satoshi Kurokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
In system reflow of low temperature eutectic bond balls
- Publication number 20110239456
- Publication date Oct 6, 2011
- siXis, Inc.
- Robert O. Conn
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SU...
- Publication number 20110180205
- Publication date Jul 28, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Min CHO
- B32 - LAYERED PRODUCTS
Information Patent Application
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...
- Publication number 20110138621
- Publication date Jun 16, 2011
- Seong Min CHO
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS
- Publication number 20110089438
- Publication date Apr 21, 2011
- Zarlink Semiconductor AB
- Odd Robert Steijer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20110006414
- Publication date Jan 13, 2011
- OLYMPUS CORPORATION
- Satoshi Ohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATTACHMENT USING MAGNETIC PARTICLE BASED SOLDER COMPOSITES
- Publication number 20100159692
- Publication date Jun 24, 2010
- Rajasekaran SWAMINATHAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Soldering with different solders

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Insulated circuit board

Flux residue detection

Wafer-level methods of fabricating semiconductor device packages an...

Electronic device comprising an electronic component mounted on a s...

Method of manufacturing a semiconductor device

Ball grid array and land grid array assemblies fabricated using tem...

Interconnection including a cable assembly and a board assembly, a...

Voiding control using solid solder preforms embedded in solder paste

Estimation device

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Ball grid array and land grid array assemblies fabricated using tem...

Dual solder layer for fluidic self assembly and electrical componen...

Electrical devices with solder dam

Electrical devices and methods for manufacturing same

Semiconductor component, semiconductor-mounted product including th...

Thermocompression bonding systems and methods of operating the same

Method of manufacturing electronic device

Thermocompression bonding systems and methods of operating the same

Electrical apparatus

Mounted structure and manufacturing method of mounted structure

Press fit electrical terminal having a solder tab shorter than PCB...

Electronic component module

Electronic component mounting device

Printed circuit board assembly

In system reflow of low temperature eutectic bond balls

Self-assembled electrical contacts

Carrier for manufacturing a printed circuit board

Method of manufacturing semiconductor device

Attachment using magnetic particle based solder composites

Patents Applicationslast 30 patents

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

LASER SOLDERING METHOD AND DEVICE

PRINTED CIRCUIT BOARDS WITH ELECTRICAL CONTACTS AND SOLDER JOINTS O...

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...

FLUX RESIDUE DETECTION

WAFER-LEVEL METHODS OF FABRICATING SEMICONDUCTOR DEVICE PACKAGES AN...

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

INTERCONNECTION INCLUDING A CABLE ASSEMBLY AND A BOARD ASSEMBLY, A...

ESTIMATION DEVICE

SOLDERING APPARATUS

ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME

DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...

HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING

THERMAL OVERLOAD PROTECTION APPARATUS

In System Reflow of Low Temperature Eutectic Bond Balls

MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE

PRINTED CIRCUIT BOARD ASSEMBLY

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...

CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...

METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...

ELECTRONIC PACKAGE AND METHOD OF MAKING SAME

PRINTED WIRING BOARD

In system reflow of low temperature eutectic bond balls

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SU...

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...

OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

ATTACHMENT USING MAGNETIC PARTICLE BASED SOLDER COMPOSITES