Solid-liquid interdiffusion

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H01L2224/84825

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84825Solid-liquid interdiffusion

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Patents Grantslast 30 patents

Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor module including solid-liquid...
- Patent number 7,670,879
- Issue date Mar 2, 2010
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INKJET PRINTING OF DIFFUSION SOLDER
- Publication number 20240379615
- Publication date Nov 14, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor module
- Publication number 20070197017
- Publication date Aug 23, 2007
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS