Solid-liquid interdiffusion

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H01L2224/83825

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83825Solid-liquid interdiffusion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
- Patent number 11,894,284
- Issue date Feb 6, 2024
- LMDJ MANAGEMENT LLC
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
- Patent number 11,373,925
- Issue date Jun 28, 2022
- LIGHT-MED (USA), INC.
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless multi-layered ceramic capacitor stack
- Patent number 11,227,719
- Issue date Jan 18, 2022
- KEMET Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices formed in a cavity between substrates
- Patent number 11,050,407
- Issue date Jun 29, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,984,955
- Issue date Apr 20, 2021
- KEMET Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of liquid assisted bonding
- Patent number 10,971,472
- Issue date Apr 6, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices formed in a cavity between substrates and includ...
- Patent number 10,965,269
- Issue date Mar 30, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a leadless stack comprising multiple components
- Patent number 10,790,094
- Issue date Sep 29, 2020
- KEMET Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods of manufacturing electronic devices formed in a cavity and...
- Patent number 10,763,820
- Issue date Sep 1, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a package having a power semiconductor chip
- Patent number 10,734,250
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high quality and reliability wiring conne...
- Patent number 10,615,131
- Issue date Apr 7, 2020
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for high temperature bonding controlled pro...
- Patent number 10,500,661
- Issue date Dec 10, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing electronic devices formed in a cavity
- Patent number 10,439,587
- Issue date Oct 8, 2019
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Bonding Structure
- Publication number 20240312955
- Publication date Sep 19, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
- Publication number 20230326897
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...
- Publication number 20220084903
- Publication date Mar 17, 2022
- LIGHT-MED (USA), INC.
- Yongjun HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTO...
- Publication number 20220005744
- Publication date Jan 6, 2022
- LIGHT-MED (USA), INC.
- Yongjun HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD OF LIQUID ASSISTED BONDING
- Publication number 20210013174
- Publication date Jan 14, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
On-Chip Antennas for Semiconductor Devices and Related Manufacturin...
- Publication number 20190221531
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190122998
- Publication date Apr 25, 2019
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for Producing a Device
- Publication number 20180261564
- Publication date Sep 13, 2018
- Osram Opto Semiconductors GmbH
- Barbara Behr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20180102492
- Publication date Apr 12, 2018
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...
- Publication number 20170243851
- Publication date Aug 24, 2017
- ATV TECHNOLOGIE GMBH
- Ventzeslav RANGELOV
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20170133341
- Publication date May 11, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WITH A SILVER PASTE
- Publication number 20160148900
- Publication date May 26, 2016
- Hyundai Motor Company
- Kyoung-Kook HONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING METHOD
- Publication number 20150287696
- Publication date Oct 8, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Mitsuhiko Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140367701
- Publication date Dec 18, 2014
- Mitsubishi Electrict Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR...
- Publication number 20140284797
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Yuuji HISAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...
- Publication number 20140267683
- Publication date Sep 18, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...
- Publication number 20140175495
- Publication date Jun 26, 2014
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Termination and Assembly by Means of Transient...
- Publication number 20140177132
- Publication date Jun 26, 2014
- Kemet Electronics Corporation
- JOHN E. MCCONNELL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY
- Publication number 20140159067
- Publication date Jun 12, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140145341
- Publication date May 29, 2014
- Toyota Jidosha Kabushiki Kaisha
- Toru TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...
- Publication number 20140138833
- Publication date May 22, 2014
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS

Solid-liquid interdiffusion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having an antenna arranged over an active main...

Advanced device assembly structures and methods

Semiconductor structure having silver-indium transient liquid phase...

Light emitting diode display with redundancy scheme

Multilayered transient liquid phase bonding

Chip assembly

Alternative compositions for high temperature soldering applications

Soldering a conductor to an aluminum layer

Light emitting diode display with redundancy scheme

Silver-indium transient liquid phase method of bonding semiconducto...

Leadless multi-layered ceramic capacitor stack

Non-eutectic bonding

Bonded structure and method of manufacturing the same

Semiconductor packages with an intermetallic layer

Electronic devices formed in a cavity between substrates

Electronic component structures with reduced microphonic noise

Method of liquid assisted bonding

Light emitting diode display with redundancy scheme

Electronic devices formed in a cavity between substrates and includ...

Multi-layered composite bonding materials and power electronics ass...

Method of forming a leadless stack comprising multiple components

Methods of manufacturing electronic devices formed in a cavity and...

Method of manufacturing a package having a power semiconductor chip

Sintering pastes with high metal loading for semiconductor die atta...

Package with vertical interconnect between carrier and clip

Chip assembly

Semiconductor device with high quality and reliability wiring conne...

Methods and apparatuses for high temperature bonding controlled pro...

Methods of manufacturing electronic devices formed in a cavity

Hermetically sealed MEMS device and its fabrication

Patents Applicationslast 30 patents

Bonding Structure

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

DIE BACKSIDE METALLIZATION METHODS AND APPARATUS

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Advanced Device Assembly Structures And Methods

SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...

SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTO...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

METHOD OF LIQUID ASSISTED BONDING

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

On-Chip Antennas for Semiconductor Devices and Related Manufacturin...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DIE BONDING TO A BOARD

Device and Method for Producing a Device

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

METHOD FOR BONDING WITH A SILVER PASTE

MOUNTING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR...

METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...

DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...

Electronic Component Termination and Assembly by Means of Transient...

ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

SEMICONDUCTOR DEVICE

Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...