Solid-solid interdiffusion

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CPC
H01L2224/8383

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8383Solid-solid interdiffusion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,862,598
- Issue date Jan 2, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,855,067
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,072
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method and joined structure
- Patent number 11,450,643
- Issue date Sep 20, 2022
- Tohoku University
- Takehito Shimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,121,116
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assemblies with solder layer and exterior coating,...
- Patent number 10,903,186
- Issue date Jan 26, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,879,209
- Issue date Dec 29, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state wafer bonding of functional materials on substrates and...
- Patent number 10,679,964
- Issue date Jun 9, 2020
- The Regents of the University of California
- Shadi A. Dayeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,411,210
- Issue date Sep 10, 2019
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 10,297,583
- Issue date May 21, 2019
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding to a board
- Patent number 10,115,716
- Issue date Oct 30, 2018
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material, bonding method and semiconductor device for elect...
- Patent number 10,043,775
- Issue date Aug 7, 2018
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240170441
- Publication date May 23, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240088123
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20240038719
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
- Publication number 20230326897
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230307411
- Publication date Sep 28, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220392884
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
- Publication number 20220199569
- Publication date Jun 23, 2022
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20210327866
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...
- Publication number 20200235072
- Publication date Jul 23, 2020
- Mitsubishi Electric Corporation
- Keisuke KAWAMOTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
JOINT DEVICE AND CONTROL METHOD FOR JOINT DEVICE
- Publication number 20200176414
- Publication date Jun 4, 2020
- JTEKT Corporation
- Koichiro MATSUHISA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...
- Publication number 20200126944
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE
- Publication number 20200083190
- Publication date Mar 12, 2020
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20180102492
- Publication date Apr 12, 2018
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...
- Publication number 20170317050
- Publication date Nov 2, 2017
- The Regents of the University of California
- Shadi A. Dayeh
- G02 - OPTICS
Information Patent Application
Non-eutectic bonding
- Publication number 20170282287
- Publication date Oct 5, 2017
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20170117246
- Publication date Apr 27, 2017
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD
- Publication number 20150287696
- Publication date Oct 8, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Mitsuhiko Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SUBSTRATES
- Publication number 20150179604
- Publication date Jun 25, 2015
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- B32 - LAYERED PRODUCTS

Solid-solid interdiffusion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for permanent connection of two metal surfaces

Semiconductor module

Semiconductor module

Semiconductor module

Manufacturing method of power semiconductor device, power semicondu...

Semiconductor device

Integrated circuit package and method

Bonding structures and methods for forming the same

Light emitting diode display with redundancy scheme

Method for producing structure, and structure

Integrated circuit package and method

Chemical bonding method and joined structure

Light emitting diode display with redundancy scheme

Method for permanent connection of two metal surfaces

Non-eutectic bonding

Manufacturing method of power semiconductor device, power semicondu...

Light emitting diode display with redundancy scheme

Method and apparatus for creating a bond between objects based on f...

Power electronic assemblies with solder layer and exterior coating,...

Encapsulated stress mitigation layer and power electronic assemblie...

Metallic interconnect, a method of manufacturing a metallic interco...

Solid-state wafer bonding of functional materials on substrates and...

Semiconductor device

Light emitting diode display with redundancy scheme

Bonding structure and method for producing bonding structure

Semiconductor device package and methods of packaging thereof

Method for permanently bonding wafers by a connecting layer by mean...

Room temperature metal direct bonding

Die bonding to a board

Bonding material, bonding method and semiconductor device for elect...

Patents Applicationslast 30 patents

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

Integrated Circuit Package and Method

NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

DIE BACKSIDE METALLIZATION METHODS AND APPARATUS

SEMICONDUCTOR MODULE

Integrated Circuit Package and Method

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

CHEMICAL BONDING METHOD AND JOINED STRUCTURE

INTEGRATED CIRCUIT PACKAGE AND METHOD

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...

JOINT DEVICE AND CONTROL METHOD FOR JOINT DEVICE

POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...

METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE

ROOM TEMPERATURE METAL DIRECT BONDING

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

DIE BONDING TO A BOARD

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...

Non-eutectic bonding

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

MOUNTING METHOD

METHOD FOR BONDING SUBSTRATES