Solid-solid interdiffusion

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H01L2224/8683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8683Solid-solid interdiffusion

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Patents Grantslast 30 patents

Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,643,942
- Issue date May 5, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,468,342
- Issue date Nov 5, 2019
- Compass Technology Company, Ltd.
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents