Solid-solid interdiffusion

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CPC
H01L2224/8183

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8183Solid-solid interdiffusion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,594,509
- Issue date Feb 28, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor flip-chip package
- Patent number 11,393,742
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding structures and manufacturing method...
- Patent number 11,205,635
- Issue date Dec 21, 2021
- Shun-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 10,923,449
- Issue date Feb 16, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack and method for manufacturing semiconductor...
- Patent number 10,861,813
- Issue date Dec 8, 2020
- SHARP KABUSHIKI KAISHA
- Toshiya Ishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,861,811
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,388,620
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder stud structure
- Patent number 9,997,482
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,905,529
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,673,147
- Issue date Jun 6, 2017
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip chip structure and fabrication metho...
- Patent number 9,673,163
- Issue date Jun 6, 2017
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,530,744
- Issue date Dec 27, 2016
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly process for connecting two components to each other
- Patent number 9,368,472
- Issue date Jun 14, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,988
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,287,225
- Issue date Mar 15, 2016
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor bonding structure
- Patent number 9,196,595
- Issue date Nov 24, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including in-situ formed cavity
- Patent number 9,153,551
- Issue date Oct 6, 2015
- Skyworks Solutions, Inc.
- Steve X. Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
LASING TO ATTACH DIE TO LEAD FRAME
- Publication number 20240145419
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daiki KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICE
- Publication number 20240047396
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...
- Publication number 20210242166
- Publication date Aug 5, 2021
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20210159203
- Publication date May 27, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20210118833
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Flip-Chip Package
- Publication number 20200388561
- Publication date Dec 10, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20190371756
- Publication date Dec 5, 2019
- Sharp Kabushiki Kaisha
- TOSHIYA ISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20190279953
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...
- Publication number 20180358320
- Publication date Dec 13, 2018
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, ELECTRONIC DEVICE HAVING THE SAME AND METHOD OF...
- Publication number 20180114768
- Publication date Apr 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Sang Hyeon SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
- Publication number 20140239494
- Publication date Aug 28, 2014
- Kuo-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD
- Publication number 20140061921
- Publication date Mar 6, 2014
- Alcatel-Lucent USA, Incorporated
- Nagesh Basavanhally
- G02 - OPTICS
Information Patent Application
Flip-Chip Assembly Process for Connecting Two Components to Each Other
- Publication number 20140038355
- Publication date Feb 6, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
- Publication number 20130341804
- Publication date Dec 26, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE FLIP CHIP DIE ATTACH
- Publication number 20130313726
- Publication date Nov 28, 2013
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Solid-solid interdiffusion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector structure and method of forming same

Method of direct bonding semiconductor components

Fabrication process and structure of fine pitch traces for a solid...

Method for fabricating a semiconductor flip-chip package

Semiconductor package structure and method for manufacturing the same

Low temperature hybrid bonding structures and manufacturing method...

Fabrication process and structure of fine pitch traces for a solid...

Semiconductor chip stack and method for manufacturing semiconductor...

Connector structure and method of forming same

Metallic interconnect, a method of manufacturing a metallic interco...

Connector structure and method of forming same

Bonding structure and method for producing bonding structure

Room temperature metal direct bonding

Solder stud structure

Bonding structure for semiconductor package and method of manufactu...

Method of manufacturing an electronic device, and electronic device...

Method for manufacturing semiconductor device

Transient interface gradient bonding for metal bonds

Semiconductor device and manufacturing method thereof

Semiconductor device with flip chip structure and fabrication metho...

Semiconductor device

Wafer to wafer bonding process and structures

Semiconductor device and method of manufacturing the same

Room temperature metal direct bonding

Flip-chip assembly process for connecting two components to each other

Semiconductor device

Semiconductor device and manufacturing method thereof

Bonding pad for thermocompression bonding, process for producing a...

Semiconductor bonding structure

Integrated circuit package including in-situ formed cavity

Patents Applicationslast 30 patents

LASING TO ATTACH DIE TO LEAD FRAME

BONDED SEMICONDUCTOR DEVICE

BONDING APPARATUS AND BONDING METHOD USING THE SAME

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

Connector Structure and Method of Forming Same

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Method for Fabricating a Semiconductor Flip-Chip Package

SEMICONDUCTOR CHIP STACK AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

Connector Structure and Method of Forming Same

ROOM TEMPERATURE METAL DIRECT BONDING

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...

SEMICONDUCTOR CHIP, ELECTRONIC DEVICE HAVING THE SAME AND METHOD OF...

ROOM TEMPERATURE METAL DIRECT BONDING

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS

Electrical Connecting Element and Method for Manufacturing the Same

3D ASSEMBLY FOR INTERPOSER BOW

METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...

GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD

Flip-Chip Assembly Process for Connecting Two Components to Each Other

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING

LOW-TEMPERATURE FLIP CHIP DIE ATTACH

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

ROOM TEMPERATURE METAL DIRECT BONDING