Special geometry or disposition of pixel-elements, address-lines or gate-electrodes

Industry

CPC
H01L27/14603

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-protrusion transfer gate manufacturing method
- Patent number 12,211,862
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low noise vertical gate device structure
- Patent number 12,211,861
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 12,211,866
- Issue date Jan 28, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yusuke Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device for temporal binning of received photons
- Patent number 12,203,854
- Issue date Jan 21, 2025
- Quantum-Si Incorporated
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Image sensor
- Patent number 12,199,127
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jeongsoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge or a discharge of an output voltage rail of a plurality of p...
- Patent number 12,199,117
- Issue date Jan 14, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- François Ayel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,199,115
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device with increased bonding strength, and met...
- Patent number 12,199,121
- Issue date Jan 14, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukihiro Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,191,331
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Masato Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 12,191,327
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and semiconductor device including asymmetric active r...
- Patent number 12,191,332
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Taeyoung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated sensor with reduced skew
- Patent number 12,188,870
- Issue date Jan 7, 2025
- Quantum-Si Incorporated
- Eric A. G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and X-ray imaging device
- Patent number 12,183,749
- Issue date Dec 31, 2024
- SHARP KABUSHIKI KAISHA
- Fumiki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array and image sensor including the same
- Patent number 12,183,750
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jeongjin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-photon avalanche diodes with deep trench isolation
- Patent number 12,183,754
- Issue date Dec 31, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ping Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, semiconductor device, and electronic device
- Patent number 12,183,758
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takashi Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel circuit configured with global shutter ensuring sufficient sa...
- Patent number 12,177,590
- Issue date Dec 24, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiaki Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic radiation detection method
- Patent number 12,176,361
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,176,362
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Min-Woong Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device comprising isolation region between floating diffusi...
- Patent number 12,176,374
- Issue date Dec 24, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and electronic device
- Patent number 12,176,363
- Issue date Dec 24, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with varying same-color color filter thickness
- Patent number 12,176,366
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Dong Min Keum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light receiving element, ranging module, and electronic apparatus
- Patent number 12,176,373
- Issue date Dec 24, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiki Ebiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device including signal line and unit pixel cell including...
- Patent number 12,160,673
- Issue date Dec 3, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation imaging apparatus and manufacturing method of same
- Patent number 12,158,551
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Masato Ofuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic detection interface and electronic detection module usin...
- Patent number 12,154,932
- Issue date Nov 26, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor
- Patent number 12,154,917
- Issue date Nov 26, 2024
- Optohub Co., Ltd
- Ikuo Kurachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform threshold voltage non-planar transistors
- Patent number 12,154,919
- Issue date Nov 26, 2024
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and mobile terminal
- Patent number 12,154,918
- Issue date Nov 26, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhitao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and electronic device including a share...
- Patent number 12,149,852
- Issue date Nov 19, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenichi Obata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE INCLUDING A SHARE...
- Publication number 20250039579
- Publication date Jan 30, 2025
- Sony Semiconductor Solutions Corporation
- KENICHI OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS AND OPTICAL DETECTION SYSTEM
- Publication number 20250040268
- Publication date Jan 30, 2025
- Canon Kabushiki Kaisha
- Junji Iwata
- B60 - VEHICLES IN GENERAL
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE AND ELECTRONIC DEVICE
- Publication number 20250039575
- Publication date Jan 30, 2025
- Canon Kabushiki Kaisha
- Hideo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spectral Element Array, Image Sensor and Image Apparatus
- Publication number 20250040267
- Publication date Jan 30, 2025
- Nippon Telegraph and Telephone Corporation
- Masashi Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS
- Publication number 20250031464
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Seungwook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE ASSEMBLY DEVICE AND ASSEMBLY METHOD FOR THE SAME
- Publication number 20250031470
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Ha Young KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE, EQUIPMENT, AND METHOD OF MANUFACTURING IMAGE S...
- Publication number 20250022893
- Publication date Jan 16, 2025
- Sony Semiconductor Solutions Corporation
- MASAMI SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250022895
- Publication date Jan 16, 2025
- Sony Semiconductor Solutions Corporation
- SHINYA YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING APPARATUS AND CAMERA SYSTEM
- Publication number 20250022903
- Publication date Jan 16, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- HIDENARI KANEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20250015100
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Eunsub Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20250015108
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Younggu JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECORDING IMAGE DATA
- Publication number 20250008052
- Publication date Jan 2, 2025
- Amold & Richter Cine Technik GmbH & Co. Betriebs KG
- Harald BRENDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250006754
- Publication date Jan 2, 2025
- Sony Semiconductor Solutions Corporation
- KEN TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240429252
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240423001
- Publication date Dec 19, 2024
- Sony Semiconductor Solutions Corporation
- TADASHI IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGING SENSOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240413175
- Publication date Dec 12, 2024
- Shanghai IC R&D Center Co., Ltd.
- Xiaoxu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240413176
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- NAOYUKI OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240413177
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL, AND ELECTRONIC DEVICE
- Publication number 20240405033
- Publication date Dec 5, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Fei Ai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH-DENSITY CAPACITOR FOR FOCAL PLANE ARRAYS
- Publication number 20240405032
- Publication date Dec 5, 2024
- DRS Network & Imaging Systems, LLC
- Eugene E. Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DEEP TRENCH ISOLATION STRUCTURE FOR LEAKAGE SUPPRESSION
- Publication number 20240387567
- Publication date Nov 21, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Chun-Yung Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS HAVING IMPROVED OPTICAL CHARACTERISTICS USING ENHANCE...
- Publication number 20240387568
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Gwideok Ryan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE
- Publication number 20240379702
- Publication date Nov 14, 2024
- SONY GROUP CORPORATION
- Shunsuke MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
- Publication number 20240379692
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240379696
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Sanghyuck Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20240379691
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- Yosuke SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND IMAGE SENSOR INCLUDING THE SAME
- Publication number 20240379722
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Changyong UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240379693
- Publication date Nov 14, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hirohisa OHTSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-NOISE IMAGE SENSOR HAVING STACKED SEMICONDUCTOR SUBSTRATES
- Publication number 20240379720
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Dummy Pixel Structures
- Publication number 20240371910
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Special geometry or disposition of pixel-elements, address-lines or gate-electrodes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-protrusion transfer gate manufacturing method

Low noise vertical gate device structure

Imaging device

Integrated device for temporal binning of received photons

Image sensor

Charge or a discharge of an output voltage rail of a plurality of p...

Image sensor

Solid-state imaging device with increased bonding strength, and met...

Image sensor

CMOS image sensor having indented photodiode structure

Image sensor and semiconductor device including asymmetric active r...

Integrated sensor with reduced skew

Photoelectric conversion device and X-ray imaging device

Pixel array and image sensor including the same

Single-photon avalanche diodes with deep trench isolation

Circuit board, semiconductor device, and electronic device

Pixel circuit configured with global shutter ensuring sufficient sa...

Electromagnetic radiation detection method

Image sensor device

Imaging device comprising isolation region between floating diffusi...

Imaging device and electronic device

Image sensor with varying same-color color filter thickness

Light receiving element, ranging module, and electronic apparatus

Imaging device including signal line and unit pixel cell including...

Radiation imaging apparatus and manufacturing method of same

Electronic detection interface and electronic detection module usin...

Semiconductor image sensor

Uniform threshold voltage non-planar transistors

Display panel and mobile terminal

Solid-state imaging element and electronic device including a share...

Patents Applicationslast 30 patents

SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE INCLUDING A SHARE...

PHOTOELECTRIC CONVERSION APPARATUS AND OPTICAL DETECTION SYSTEM

PHOTOELECTRIC CONVERSION DEVICE AND ELECTRONIC DEVICE

Spectral Element Array, Image Sensor and Image Apparatus

IMAGE SENSORS

IMAGE SENSOR MODULE ASSEMBLY DEVICE AND ASSEMBLY METHOD FOR THE SAME

IMAGE SENSOR DEVICE, EQUIPMENT, AND METHOD OF MANUFACTURING IMAGE S...

IMAGING DEVICE AND ELECTRONIC DEVICE

IMAGING APPARATUS AND CAMERA SYSTEM

IMAGE SENSOR

IMAGE SENSOR

METHOD FOR RECORDING IMAGE DATA

IMAGING DEVICE AND SEMICONDUCTOR DEVICE

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

SOLID-STATE IMAGING DEVICE

CMOS IMAGING SENSOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

IMAGING DEVICE

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

ARRAY SUBSTRATE, DISPLAY PANEL, AND ELECTRONIC DEVICE

HIGH-DENSITY CAPACITOR FOR FOCAL PLANE ARRAYS

BACKSIDE DEEP TRENCH ISOLATION STRUCTURE FOR LEAKAGE SUPPRESSION

IMAGE SENSORS HAVING IMPROVED OPTICAL CHARACTERISTICS USING ENHANCE...

SOLID-STATE IMAGE PICKUP DEVICE

IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE

IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME

IMAGING DEVICE AND ELECTRONIC EQUIPMENT

SEMICONDUCTOR DEVICE AND IMAGE SENSOR INCLUDING THE SAME

SOLID-STATE IMAGING DEVICE

LOW-NOISE IMAGE SENSOR HAVING STACKED SEMICONDUCTOR SUBSTRATES

Image Sensors With Dummy Pixel Structures