Special local insulating pattern

Industry

CPC
H05K2201/09909

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09909Special local insulating pattern

Industries

Patents Grantslast 30 patents

Information Patent Grant
Organic light emitting display device including dam structure and a...
- Patent number 11,968,860
- Issue date Apr 23, 2024
- LG Display Co., Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed circuit board stack structure and manufacturing method thereof
- Patent number 11,910,535
- Issue date Feb 20, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including host connector and memory device
- Patent number 11,791,579
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Kyung-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and inspection method
- Patent number 11,751,326
- Issue date Sep 5, 2023
- Sharp Kabushiki Kaisha
- Mitsuaki Morimoto
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic electronic component
- Patent number 11,659,659
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Naoya Murakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable wiring board
- Patent number 11,659,656
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Takahito Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic light emitting display device including curve-shaped third...
- Patent number 11,552,141
- Issue date Jan 10, 2023
- LG Display Co, Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Load adaptive device and hand-made circuit module
- Patent number 11,425,815
- Issue date Aug 23, 2022
- Aidmics Biotechnology (HK) Co., Limited
- Chang-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable wiring board
- Patent number 11,406,011
- Issue date Aug 2, 2022
- Murata Manufacturing Co., Ltd.
- Takahito Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BGA component masking dam and a method of manufacturing with the BG...
- Patent number 11,172,580
- Issue date Nov 9, 2021
- Rosemount Aerospace Inc.
- James R. Gaertner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic light emitting display device having a multi-directional da...
- Patent number 10,916,604
- Issue date Feb 9, 2021
- LG Display Co., Ltd.
- Dongjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing reworkable strain relief packaging structure for elect...
- Patent number 10,834,811
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,827,621
- Issue date Nov 3, 2020
- SHARP KABUSHIKI KAISHA
- Yasukazu Tomita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component, electronic component mounting substrate, and...
- Patent number 10,753,551
- Issue date Aug 25, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshiaki Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic assembly, and electronic assembl...
- Patent number 10,729,023
- Issue date Jul 28, 2020
- Robert Bosch GmbH
- Peter Zweigle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 10,681,820
- Issue date Jun 9, 2020
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accurate positioning and alignment of a component during processes...
- Patent number 10,667,387
- Issue date May 26, 2020
- ams Sensors Singapore Pte. Ltd.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic apparatus, method for attaching sheet meta...
- Patent number 10,624,216
- Issue date Apr 14, 2020
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reducing warpage of an organic substrate
- Patent number 10,595,399
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing flexible electronic circuits having conform...
- Patent number 10,595,417
- Issue date Mar 17, 2020
- VERILY LIFE SCIENCES LLC
- Brian Marc Pepin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module having a highly reflective carrier
- Patent number 10,586,901
- Issue date Mar 10, 2020
- Tridonic Jennersdorf GMBH
- Florian Wimmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive patterns and methods of using them
- Patent number 10,462,908
- Issue date Oct 29, 2019
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic apparatus, and method for manufacturing el...
- Patent number 10,420,212
- Issue date Sep 17, 2019
- Fujitsu Limited
- Keiichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having structure for preventing coating liqui...
- Patent number 10,406,553
- Issue date Sep 10, 2019
- Alps Alpine Co., Ltd.
- Younggil Choi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Rectification module
- Patent number 10,389,266
- Issue date Aug 20, 2019
- DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
- Hao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup apparatus and method for manufacturing image pickup ap...
- Patent number 10,381,393
- Issue date Aug 13, 2019
- Olympus Corporation
- Takuro Suyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Portable electronic device, image-capturing module thereof and carr...
- Patent number 10,367,981
- Issue date Jul 30, 2019
- Azurewave Technologies, Inc.
- Tseng-Chieh Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Housing and electronic device using the same
- Patent number 10,353,440
- Issue date Jul 16, 2019
- Shenzhen Futaihong Precision Industry Co., Ltd.
- Wu-Zheng Ou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,314,174
- Issue date Jun 4, 2019
- Winbond Electronics Corp.
- Yu-Hsuan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating ceramic paste, ceramic electronic component, and method...
- Patent number 10,292,264
- Issue date May 14, 2019
- Murata Manufacturing Co., Ltd.
- Sumiyo Nakamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE AND KEYBOARD STRUCTURE
- Publication number 20240028134
- Publication date Jan 25, 2024
- Lite-On Technology Corporation
- SHAN-HUI CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ORGANIC LIGHT EMITTING DISPLAY DEVICE
- Publication number 20230116429
- Publication date Apr 13, 2023
- LG Display Co., Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
LOAD ADAPTIVE DEVICE AND HAND-MADE CIRCUIT MODULE
- Publication number 20210251072
- Publication date Aug 12, 2021
- AIDMICS BIOTECHNOLOGY (HK) CO., LIMITED
- Chang-Ching YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20190357357
- Publication date Nov 21, 2019
- SHARP KABUSHIKI KAISHA
- Yasukazu TOMITA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Producing an Electronic Assembly, and Electronic Assembl...
- Publication number 20190230804
- Publication date Jul 25, 2019
- Peter Zweigle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECTIFICATION MODULE
- Publication number 20190140551
- Publication date May 9, 2019
- Delta Electronics (Thailand) Public Company Limited
- Hao LU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE
- Publication number 20190053370
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Sayuri Hada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...
- Publication number 20180235080
- Publication date Aug 16, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20170212553
- Publication date Jul 27, 2017
- SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- WU-ZHENG OU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC D...
- Publication number 20170150605
- Publication date May 25, 2017
- SONY CORPORATION
- Takashi NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN...
- Publication number 20140334108
- Publication date Nov 13, 2014
- Jin-San JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140326486
- Publication date Nov 6, 2014
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- CHAO-RONG LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20140313682
- Publication date Oct 23, 2014
- NIHON DEMPA KOGYO CO., LTD.
- HIROYUKI MITOME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE
- Publication number 20140307359
- Publication date Oct 16, 2014
- Yuuki MIKAMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE POLYMER WITH DIELECTRIC PATCH
- Publication number 20140290988
- Publication date Oct 2, 2014
- Todd Mathew Spath
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ROLL TO ROLL PRINTING OF FINE LINES AND FEATURES WITH AN...
- Publication number 20140248423
- Publication date Sep 4, 2014
- Uni-Pixel Displays, Inc.
- Ed S. Ramakrishnan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERDIGITATED CHIP CAPACITOR ASSEMBLY
- Publication number 20140227891
- Publication date Aug 14, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Allan Jerome Daen Rapales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Confining Conductive Bump Materi...
- Publication number 20140225257
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...
- Publication number 20140208587
- Publication date Jul 31, 2014
- PANASONIC CORPORATION
- Tadashi Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140185254
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo MOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140174805
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Takayuki Haze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20140166354
- Publication date Jun 19, 2014
- Wistron Corporation
- Jui-Yun Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Edge Connector
- Publication number 20140158403
- Publication date Jun 12, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Edge Connector
- Publication number 20140158404
- Publication date Jun 12, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140131081
- Publication date May 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hye Jin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE OF CIRCUIT BOARD
- Publication number 20140127916
- Publication date May 8, 2014
- SAMSUNG DISPLAY CO., LTD.
- Jin-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTO-ELECTRIC HYBRID BOARD
- Publication number 20140126857
- Publication date May 8, 2014
- Nitto Denko Corporation
- Shotaro Masuda
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING SOLDER RESIST POST, METHOD OF MANUFACTURING ELECT...
- Publication number 20140126166
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Su Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Confining Conductive Bump Materi...
- Publication number 20140113446
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

Special local insulating pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Organic light emitting display device including dam structure and a...

Printed circuit board stack structure and manufacturing method thereof

Electronic device including host connector and memory device

Electronic apparatus and inspection method

Ceramic electronic component

Stretchable wiring board

Organic light emitting display device including curve-shaped third...

Load adaptive device and hand-made circuit module

Stretchable wiring board

BGA component masking dam and a method of manufacturing with the BG...

Organic light emitting display device having a multi-directional da...

Implementing reworkable strain relief packaging structure for elect...

Display device

Electronic component, electronic component mounting substrate, and...

Method for producing an electronic assembly, and electronic assembl...

Circuit board and manufacturing method therefor

Accurate positioning and alignment of a component during processes...

Wiring board, electronic apparatus, method for attaching sheet meta...

Method of reducing warpage of an organic substrate

Method of manufacturing flexible electronic circuits having conform...

LED module having a highly reflective carrier

Conductive patterns and methods of using them

Wiring board, electronic apparatus, and method for manufacturing el...

Printed circuit board having structure for preventing coating liqui...

Rectification module

Image pickup apparatus and method for manufacturing image pickup ap...

Portable electronic device, image-capturing module thereof and carr...

Housing and electronic device using the same

Method for manufacturing circuit board

Insulating ceramic paste, ceramic electronic component, and method...

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE AND KEYBOARD STRUCTURE

ORGANIC LIGHT EMITTING DISPLAY DEVICE

LOAD ADAPTIVE DEVICE AND HAND-MADE CIRCUIT MODULE

DISPLAY DEVICE

Method for Producing an Electronic Assembly, and Electronic Assembl...

RECTIFICATION MODULE

METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE

ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...

HOUSING AND ELECTRONIC DEVICE USING THE SAME

CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC D...

SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN...

PRINTED CIRCUIT BOARD

COMPOSITE ELECTRONIC COMPONENT

ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE

STACK TYPE SEMICONDUCTOR PACKAGE

PATTERNED CONDUCTIVE POLYMER WITH DIELECTRIC PATCH

METHOD OF ROLL TO ROLL PRINTING OF FINE LINES AND FEATURES WITH AN...

INTERDIGITATED CHIP CAPACITOR ASSEMBLY

Semiconductor Device and Method of Confining Conductive Bump Materi...

ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Printed Circuit Board Edge Connector

Printed Circuit Board Edge Connector

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CONNECTION STRUCTURE OF CIRCUIT BOARD

OPTO-ELECTRIC HYBRID BOARD

METHOD OF FORMING SOLDER RESIST POST, METHOD OF MANUFACTURING ELECT...

Semiconductor Device and Method of Confining Conductive Bump Materi...