The present disclosure relates to a device and a structure, and more particularly to a light emitting device and a keyboard structure.
A conventional keyboard structure includes a light emitting device, and a plurality of light emitting units of the light emitting device are electrically coupled to a circuit. During a manufacturing process of the conventional light emitting device, the circuit on a substrate is formed by solidifying a molten conductive material (e.g., solder). However, when the molten conductive material is not yet solidified, each of the light emitting units located on the molten conductive material is prone to rotation and displacement, which leads to unreliable electrical coupling between the light emitting units and the circuit. Additionally, during the solidification process, the molten conductive material is susceptible to uneven distribution due to cohesive forces, such that some areas of the circuit are thinner and prone to breakage.
In response to the above-referenced technical inadequacies, the present disclosure provides a light emitting device and a keyboard structure.
In order to solve the above-mentioned problems, one of the technical aspects adopted by the present disclosure is to provide a light emitting device. The light emitting device includes a circuit board and a plurality of light emitting units. The circuit board includes a substrate, a first conductive pad, a plurality of second conductive pads, and a plurality of third conductive pads. The substrate has a first board surface and a second board surface that is opposite to the first board surface. The first conductive pad is disposed on the first board surface. The first conductive pad has a symmetrical shape and a symmetrical axis. The second conductive pads are disposed on the first board surface. The symmetrical axis passes through the second conductive pads, and the second conductive pads are spaced apart from the first conductive pad. The third conductive pads are disposed on the second board surface. The third conductive pads are electrically coupled to the first conductive pad and the second conductive pads respectively by a plurality of conductive columns. The light emitting units are disposed on the first board surface. Each of the light emitting units is connected to the first conductive pad and one of the second conductive pads.
In one of the possible or preferred embodiments, a longitudinal axis of each of the light emitting units is parallel to the symmetrical axis.
In one of the possible or preferred embodiments, the first conductive pad includes a plurality of conductive sheets and a connecting circuit line. The conductive sheets are spaced apart from each other. The symmetrical axis passes through the conductive sheets, and the conductive sheets are respectively connected to the light emitting units. The connecting circuit line is connected to the conductive sheets.
In one of the possible or preferred embodiments, an area of each of the conductive sheets is equal to an area of each of the second conductive pads.
In one of the possible or preferred embodiments, a part of the connecting circuit line has a ring pattern and surrounds one of the second conductive pads.
In one of the possible or preferred embodiments, the light emitting device further includes two insulating layers. The two insulating layers are respectively disposed on two sides of the first board surface, and are symmetrically to the symmetrical axis, and the two insulating layers cover a part of the first conductive pad.
In one of the possible or preferred embodiments, the light emitting device further includes two insulating layers that cover a part of the first conductive pad. Two of the second conductive pads farthest from each other have a farthest distance there-between, two side portions of the connecting circuit line are parallel to the symmetrical axis, a length of each of the two side portions is greater than or equal to the farthest distance, and a length of each of the two insulating layers is greater than or equal to the length of each of the two side portions.
In one of the possible or preferred embodiments, heights of the two insulating layers relative to the substrate are identical to each other.
In one of the possible or preferred embodiments, the light emitting device further includes a diffusion layer disposed on the first board surface. The diffusion layer covers the light emitting units.
In one of the possible or preferred embodiments, the light emitting device further includes a reflective layer that covers the diffusion layer.
In one of the possible or preferred embodiments, the light emitting device further includes two light blocking walls. The two light blocking walls are respectively disposed on two sides of the light emitting units, and each of the two light blocking walls is parallel to the symmetrical axis.
In order to solve the above-mentioned problems, another one of the technical aspects adopted by the present disclosure is to provide a keyboard structure. The keyboard structure includes the above-mentioned light emitting device, a keycap that covers the light emitting device, and a carrier that carries the light emitting device and the keycap. The light emitting device corresponds in position to a center of the keycap, and a longitudinal axis of the light emitting device is parallel to a width direction of a character on the keycap.
Therefore, in the light emitting device and the keyboard structure provided by the present disclosure, by virtue of “the first conductive pad having a symmetrical shape and a symmetrical axis” and “the symmetrical axis passing through the second conductive pads, and the second conductive pads being spaced apart from the first conductive pad,” the light emitting device and the keyboard structure can ensure an electrical relationship between the light emitting units, and the first conductive pad, the second conductive pads, and the third conductive pads connected, so as to improve product reliability.
These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.
The described embodiments may be better understood by reference to the following description and the accompanying drawings, in which:
The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a,” “an” and “the” includes plural reference, and the meaning of “in” includes “in” and “on.” Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.
The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first,” “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.
Referring to
Referring to
Referring to
The conductive sheets have a rectangular shape and are spaced apart from each other, but the present disclosure is not limited thereto (e.g., each of the conductive sheets can also have a circular shape or other geometric shapes). The conductive sheets can be arranged along the longitudinal axis of the first board surface 111, such that the symmetrical axis AL passes through each of the conductive sheets. The conductive sheets are respectively connected to the light emitting units 2. In addition, the connecting circuit line 122 is connected to the conductive sheets, so that the first conductive pad 12 can have the first polarity.
In one embodiment of the present disclosure, the connecting circuit line 122 may have a plurality of connection segments (e.g., 1221, 1222 in
Taking the light emitting device 100 illustrated in
Referring to
It is worth noting that one of the second conductive pads 13 can be surrounded by the ring pattern (i.e., the two second connection segments 1222, the second conductive sheet 121B, and the third conductive sheet 121C), so that a space on the first board surface 111 is effectively utilized. In addition, it is preferable for an area of each of the second conductive pads 13 to be substantially equal to an area of each of the conductive sheets 121, but the present disclosure is not limited thereto. For example, in another embodiment of the present disclosure (not shown), the area of each of the second conductive pads 13 can be different from the area of each of the conductive sheets, and the ring pattern can surround some or none of the second conductive pads 13.
It should be noted that during a manufacturing or use process, the solder material G applied to the conductive sheets (e.g., 121A, 121B, 121C in
Referring to
Preferably, areas of the third conductive pads 14 are identical to each other, and a total area of the third conductive pads 14 can be greater than 80% of an area of the second board surface 112, so that the third conductive pads 14 can increase the overall rigidity of the light emitting device 100, and can also improve a heat dissipation effect of the light emitting device 100, but the present disclosure is not limited thereto. For example, in another embodiment of the present disclosure (not shown), the areas of the third conductive pads 14 can also be different from each other, and the total area of the third conductive pads 14 is less than 80% of the area of the second board surface 112.
It should be noted that a spacing distance L3 between each of the third conductive pads 14 and an edge of the substrate 11 is preferably within a range from 0.025 mm to 0.1 mm. Since the presence of metal burrs near a cutting edge can affect a soldering operation during a surface mount technology (SMT) assembly, the design of the spacing distance L3 can be adjusted in the manufacturing process of the light emitting device 100, so as to prevent the third conductive pads 14 to close to the cutting edge.
Moreover, in order to further ensure that the third conductive pads 14 do not experience electrical interference with each other (such as interconnection of different polarities), the light emitting device 100 also includes a plurality of barrier layers 3 that are not conductive (such as a solder resist). The barrier layers 3 are disposed on the second board surface 112, and each of the barrier layers 3 is located between any two adjacent ones of the third conductive pads 14. Preferably, areas of the barrier layers 3 can be identical to each other, which is beneficial for improving the production efficiency of the light emitting device 100. Naturally, the barrier layers 3 can be omitted according to practical requirements.
Referring to
Furthermore, in order to ensure the brightness and uniformity of the light emitting device 100, a spacing distance L4 between any two adjacent ones of the light emitting units 2 is preferably less than 100 micrometers. Additionally, one of the light emitting units 2 disposed in a central region of the first board surface 111 can be designated to emit green light or have the highest luminous intensity. Taking the light emitting device 100 shown in
It should be noted that, as shown in
For example, as shown in
Referring to
The connecting circuit line 122 further includes two extension segments 1223 connected to each of the second connection segments 1222. Specifically, two ends of each of the second connection segments 1222 parallel to the symmetrical axis AL are respectively connected to the two extension segments 1223, and the two extension segments 1223 are also parallel to the symmetrical axis AL, so that each of the second connection segments 1222 and the two extension segments 1223 roughly form a 7C shape. That is to say, two side portions of the connecting circuit line 122 in the present embodiment are parallel to the symmetrical axis AL.
In addition, in a practical application, the light emitting device may further include two insulating layers 7, the two insulating layers 7 are disposed on two sides of the first board surface 111, and are symmetrical to the symmetrical axis AL, and the two insulating layers 7 cover a part of the first conductive pad 12. Taking the light emitting device shown in
It should be noted that, as shown in
Referring to
Referring to
The first conductive pads 12′ and the second conductive pads 13′ are disposed on the first outer layer 114, and the first conductive pads 12′ and the second conductive pads 13′ are spaced apart from each other. Each of the first conductive pads 12′ can provide a first polarity, and each of the second conductive pads 13′ can provide a second polarity that is opposite to the first polarity. Preferably, each of the first conductive pads 12′ and each of the second conductive pads 13′ are rectangular, and an area of each of the first conductive pads 12′ can be roughly equal to an area of each of the second conductive pads 13′, but the present disclosure is not limited thereto.
Referring to
Referring to
In the present embodiment, the first conductive pattern 161 roughly covers more than 70% of a side surface of the interlayer 113 facing the first outer layer 114, and the second conductive patterns 162 are arranged on the side surface of the interlayer 113 facing the first outer layer 114. In addition, the second conductive patterns 162 are spaced apart from each other and do not contact the first conductive pattern 161. A total area of the second conductive patterns 162 roughly covers more than 10% of an area of the side surface of the interlayer 113 facing the first outer layer 114. Accordingly, the first conductive pattern 161 and the second conductive patterns 162 can increase the overall rigidity of the substrate 11.
Referring to
Referring to
Referring to
It is worth noting that conventional keyboard structures often use square-shaped light emitting devices. However, the square-shaped light emitting devices exhibit poor performance in terms of a light emitting angle and color over angle (COA) uniformity when being emitted through a keycap (as shown in Table 1). In contrast, the keyboard structure 1000 of the present disclosure employs the structure of the light emitting device 100 as shown in
The experimental procedure for measuring the color over angle (COA) uniformity is as follows. The light emitting device is fixed onto a rotating table that is placed in a completely dark environment, such as a dark box. A center position of the light emitting device faces the center of a receiver. The rotating table drives the light emitting device to rotate from −90 degrees to 90 degrees. The light emitting units (of red, blue, and green light) emit light simultaneously, and the emitted light is measured by the receiver. The receiver takes measurements of the data at 0 degrees and 90 degrees. The test for the color over angle (COA) uniformity is a common testing method in this field and is not the main focus of the present disclosure, and thus will not be specifically described herein.
In conclusion, in the light emitting device and the keyboard structure provided by the present disclosure, by virtue of “the first conductive pad having a symmetrical shape and a symmetrical axis” and “the symmetrical axis passing through the second conductive pads, and the second conductive pads being spaced apart from the first conductive pad,” the light emitting device and the keyboard structure can ensure an electrical relationship among the light emitting units, and the first conductive pad, the second conductive pads, and the third conductive pads connected, so as to improve product reliability.
The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.
Number | Date | Country | Kind |
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202310392214.7 | Apr 2023 | CN | national |
This application claims the benefit of priorities to China Patent Application No. 202310392214.7, filed on Apr. 13, 2023 in People's Republic of China, and U.S. Provisional Patent Application Ser. No. 63/406,735 filed on Sep. 15, 2022, and No. 63/391,072 filed on Jul. 21, 2022. The entire content of each of the above identified applications is incorporated herein by reference. Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.
Number | Date | Country | |
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63391072 | Jul 2022 | US | |
63406735 | Sep 2022 | US |