specially adapted for batch processes

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H01L2224/7898

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7898specially adapted for batch processes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,935,864
- Issue date Mar 19, 2024
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,515,285
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 10,707,176
- Issue date Jul 7, 2020
- Disco Corporation
- Youngsuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 10,700,014
- Issue date Jun 30, 2020
- Disco Corporation
- Youngsuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tools, and methods of designing ribbon bonding tools
- Patent number 10,562,127
- Issue date Feb 18, 2020
- Kulicke and Soffa Industries, Inc.
- Bernard Poncelet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for detecting and removing defective integrate...
- Patent number 10,504,801
- Issue date Dec 10, 2019
- Texas Instruments Incorporated
- Zheng Qing Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 10,340,163
- Issue date Jul 2, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for producing a bondable coating on a carrier strip
- Patent number 10,211,180
- Issue date Feb 19, 2019
- HERAEUS DEUTSCHLAND GMBH & CO., KG
- Joachim-Franz Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible window clamp
- Patent number 10,147,700
- Issue date Dec 4, 2018
- Carsem (M) Sdn. Bhd.
- Wong Chee Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for improved bonding
- Patent number 10,050,009
- Issue date Aug 14, 2018
- Semiconductor Components Industries, LLC
- Nobuhisa Onai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tools, and methods of designing ribbon bonding tools
- Patent number 9,981,336
- Issue date May 29, 2018
- Kulicke and Soffa Industries, Inc.
- Bernard Poncelet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
- Patent number 9,953,953
- Issue date Apr 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning system
- Patent number 9,076,856
- Issue date Jul 7, 2015
- Lite-On Electronics (Guangzhou) Limited
- Yan-Yi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 9,070,762
- Issue date Jun 30, 2015
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 8,752,751
- Issue date Jun 17, 2014
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,541,667
- Issue date Jun 2, 2009
- Hitachi, Ltd.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,528,014
- Issue date May 5, 2009
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,960,823
- Issue date Nov 1, 2005
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...
- Publication number 20230039460
- Publication date Feb 9, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...
- Publication number 20210305199
- Publication date Sep 30, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...
- Publication number 20180323167
- Publication date Nov 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC VIBRATION BONDING APPARATUS
- Publication number 20180272463
- Publication date Sep 27, 2018
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Akihiro ICHINOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON BONDING TOOLS, AND METHODS OF DESIGNING RIBBON BONDING TOOLS
- Publication number 20180243856
- Publication date Aug 30, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Bernard Poncelet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DETECTING AND REMOVING DEFECTIVE INTEGRATE...
- Publication number 20180114733
- Publication date Apr 26, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Zheng Qing Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20170309503
- Publication date Oct 26, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE WINDOW CLAMP
- Publication number 20170256518
- Publication date Sep 7, 2017
- Carsem (M) Sdn.Bhd.
- Wong Chee Heng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A BONDABLE COATING ON A CARRIER STRIP
- Publication number 20170170139
- Publication date Jun 15, 2017
- Heraeus Deutschland GmbH & Co. KG
- Joachim-Franz SCHMIDT
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS AND APPARATUS FOR IMPROVED BONDING
- Publication number 20170077061
- Publication date Mar 16, 2017
- Semiconductor Components Industries, LLC
- Nobuhisa ONAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING ASSEMBLY AND METHOD
- Publication number 20140239473
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- MengThee Chia
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140217152
- Publication date Aug 7, 2014
- ASM Technology Singapore Pte Ltd
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140014708
- Publication date Jan 16, 2014
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITIONING SYSTEM
- Publication number 20130201465
- Publication date Aug 8, 2013
- Lite-On Technology Corporation
- YAN-YI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050258524
- Publication date Nov 24, 2005
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050196903
- Publication date Sep 8, 2005
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020146864
- Publication date Oct 10, 2002
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS

specially adapted for batch processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of optimizing clamping of a semiconductor element against a...

Methods of optimizing clamping of a semiconductor element against a...

Bonding process with rotating bonding stage

Bonding apparatus with rotating bonding stage

Ultrasonic vibration bonding apparatus

Method of manufacturing semiconductor package

Method of manufacturing semiconductor package

Ribbon bonding tools, and methods of designing ribbon bonding tools

Methods of operating a wire bonding machine to improve clamping of...

Method and apparatus for detecting and removing defective integrate...

Mounting apparatus

Method for producing a bondable coating on a carrier strip

Flexible window clamp

Methods and apparatus for improved bonding

Ribbon bonding tools, and methods of designing ribbon bonding tools

Method for assembling a microelectronic chip element on a wire elem...

Positioning system

Lead frame support plate and window clamp for wire bonding machines

Lead frame support plate and window clamp for wire bonding machines

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...

METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...

BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM

METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...

ULTRASONIC VIBRATION BONDING APPARATUS

RIBBON BONDING TOOLS, AND METHODS OF DESIGNING RIBBON BONDING TOOLS

METHOD AND APPARATUS FOR DETECTING AND REMOVING DEFECTIVE INTEGRATE...

MOUNTING APPARATUS

FLEXIBLE WINDOW CLAMP

METHOD FOR PRODUCING A BONDABLE COATING ON A CARRIER STRIP

METHODS AND APPARATUS FOR IMPROVED BONDING

WIRE BONDING ASSEMBLY AND METHOD

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

POSITIONING SYSTEM

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same